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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics"

共 116 条记录，以下是71-80 订阅

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Dye-sensitized solar cells using laser processing techniques

Dye-sensitized solar cells using laser processing techniques

引用

conference on photon processing in microelectronics and photonics III

作者： Kim, H Piqué, A Kushto, GP Auyeung, RCY Lee, SH Arnold, CB Kafafi, ZH USN Res Lab Washington DC 20375 USA

ISBN: (纸本)0819452475

Laser processing techniques, such as laser direct-write (LDW) and laser sintering, have been used to deposit mesoporous nanocrystalline TiO2, (nc-TiO2) films for use in dye-sensitized solar cells. LDW enables the fabrication of conformal structures containing metals, ceramics, polymers and composites on rigid and flexible substrates without the use of masks or additional patterning techniques. The transferred material maintains a porous, high surface area structure that is ideally suited for dye-sensitized solar cells. In this experiment, a pulsed UV laser (355nm) is used to forward transfer a paste of commercial TiO2 nanopowder (P25) onto transparent conducting electrodes on flexible polyethyleneterephthalate (PET) and rigid glass substrates. For the cells based on flexible PET substrates, the transferred TiO2 layers were sintered using an in-situ laser to improve electron paths without damaging PET substrates. In this paper, we demonstrate the use of laser processing techniques to produce nc-TiO2 films (similar to10 mum thickness) on glass for use in dye-sensitized solar cells (V-oc = 690 mV, J(sc) = 8.7 mA/cm(2),ff= 0.67, eta = 4.0 % at 100 mW/cm(2)).

关键词： laser direct-write laser forward transfer laser annealing dye-sensitized solar cells nanocrystalline TiO2

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Laser-induced bandgap engineering for multicolor detection with a GaAs/AlGaAs quantum well infrared photodetector

Laser-induced bandgap engineering for multicolor detection w...

引用

conference on photon processing in microelectronics and photonics III

作者： Dubowski, JJ Zhang, XR Xu, X Lefebvre, J Wasilewski, Z Univ Sherbrooke Dept Elect & Comp Engn Sherbrooke PQ J1K 2R1 Canada

ISBN: (纸本)0819452475

Post-growth selective-area laser tuning of quantum well infrared photo-detector (QWIP) material has been investigated as a possible route towards the fabrication of a multicolor low-cost focal plane array device. The method takes advantage of the infrared laser for inducing local temperature of a semiconductor wafer that leads to a spatially selective quantum well intermixing (QWI) process. The wafer consisting of 30-pairs of 6 nm GaAs quantum wells and 35 nm Al0.31Ga0.69As barriers was irradiated by a fast scanning CW Nd:YAG laser beam projecting a total of 12 lines spaced at 0.8 mm. For the chosen pattern, writing scheme and a total power delivered to the sample, a material has been fabricated with 12-regions of distinctly different bandgaps in the range of 790 to 830 nm. Preliminary calculations predict reasonably well the laser-induced temperature profile achieved with a stationary laser beam. However, a more advanced model needs to be developed in order to describe temperature profiles induced with a fast scanning laser beam.

关键词： quantum well infrared photodetector multicolor detection quantum well intermixing laser processing

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Sensor for monitoring plasma parameters

Sensor for monitoring plasma parameters

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conference on photon processing in microelectronics and photonics III

作者： Bol'shakov, AA Cruden, BA Sharma, SP NASA Ames Res Ctr Moffett Field CA 94035 USA

ISBN: (纸本)0819452475

A spectrally tunable VCSEL (vertical cavity surface-emitting laser) was used as part of sensing hardware for measurements of the radial-integrated gas temperature inside an inductively coupled plasma reactor. The data were obtained by profiling the Doppler-broadened absorption of metastable Ar atoms at 763.51 rim in argon and argon/nitrogen plasmas (3, 45, and 90% N-2 in Ar) at pressure 0.5-70 Pa and inductive power of 100 and 300 W. The results were compared to rotational temperature derived from the N-2, emission at the (0,0) transition of the C(3)Pi(u)-B(3)Pi(g) system. The differences in integrated rotational and Doppler temperatures were attributed to non-uniform spatial distributions of both temperature and thermometric species (Ar* and N-2*) that varied depending on conditions. A two-dimensional, two-temperature fluid plasma simulation was employed to explain these differences. This work should facilitate further development of a miniature sensor for non-intrusive acquisition of data (temperature and densities of multiple plasma species) during micro- and nano-fabrication plasma processing, thus enabling the diagnostic-assisted continuous optimization and advanced control over the processes. Such sensors would also enable tracking the origins and pathways of damaging contaminants, thereby providing real-time feedback for adjustment of processes. Our work serves as an example of how two line-of-sight integrated temperatures derived from different thermometric species make it possible to characterize the radial non-uniformity of the plasma.

关键词： diode laser plasma processing optical diagnostics 2-D simulation gas temperature

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Analysis of thermal damage in bulk silicon with femtosecond laser micro-machining

Analysis of thermal damage in bulk silicon with femtosecond ...

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conference on photon processing in microelectronics and photonics III

作者： Coyne, E O'Connor, GM Mannion, P Magee, J Glynn, TJ Natl Univ Ireland Univ Coll Galway Natl Ctr Laser Appl Galway Ireland

ISBN: (纸本)0819452475

Femtosecond laser micromachining of silicon offers the potential to realize precision components with minimal thermal damage. In this work, an assessment of the damage observed in bulk silicon during femtosecond laser micromachining is presented. The different analysis methods used to determine the structural and chemical changes to wafer grade silicon is first described. The analysis is at or above the ablation threshold-defined as the point where laser induced crystalline-damage is first observed for 1 kHz laser pulses, of 150 fs duration, at a wavelength of 775 nm. Structural analysis is based upon electron and optical microscopies, with different sample preparation techniques being used to reveal the micromachined structure. A key feature of the work presented here is the high-resolution Scanning Transmission Electron Microscope (STEM) images of the laser-machined structures. Below the ablation threshold, electrical experiments were performed with silicon under femtosecond laser excitation to provide a direct method for determining the accumulation of damage to the silicon lattice. Based on this analysis, it will be shown that laser machining of silicon with femtosecond pulses can produce features with minimal thermal damage, although lattice damage created by mechanical stresses and the deposition of ablated material both limit the extent to which this can be achieved, particularly at high aspect ratios.

关键词： femtosecond laser materials processing silicon thermal effects SEM EDX micromachining

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Nano/femto-second laser based nano structuring of ultra thin films

Nano/femto-second laser based nano structuring of ultra thin...

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conference on photon processing in microelectronics and photonics III

作者： Chimmalgi, A Grigoropoulos, CP Univ Calif Berkeley Dept Mech Engn Berkeley CA 94720 USA

ISBN: (纸本)0819452475

Nanofabrication, at lateral resolutions beyond the capability of conventional optical lithography techniques, is demonstrated here. Various nanofeatures (nanogrids, nanocraters, nanocurves) were machined, with high spatial resolution (similar to10-12nm), on thin metallic and semiconductor films by utilizing the enhanced field that exists underneath a scanning microscope tip irradiated with a laser beam. For the first time in the published literature, recrystallization results of thin a-Si films, at the nano-scale, are being presented to demonstrate the utility of this machining scheme as an effective 'nano'- laser source. Attempting to understand the modification mechanism and the physics involved, numerical simulation studies were performed to evaluate the field enhancement underneath the tip and the 'femtosecond laser - thin film' interaction dynamics in general. For the former study Finite Difference Time Domain simulation was carried out to evaluate the spatial distribution of the field intensity in the near field of the SPM probe tip. The later study employed finite-difference numerical method to solve the hyperbolic two-temperature scheme used to model the interaction. Possible applications of thin film structuring and its use as a mask may be in the areas of high-resolution nanolithography, nanofluidics, controlled nanodeposition, ultra high-density data storage, nanoelectronics, nanophotonics and various nanobiotechnology related applications.

关键词： nanostructuring scanning probe microscope femtosecond laser field enhancement thin film processing

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Proceedings of SPIE: photon processing in microelectronics and photonics II

Proceedings of SPIE: Photon Processing in Microelectronics a...

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PROCEEDINGS OF SPIE SPIE - The International Society for Optical Engineering: photon processing in microelectronics and photonics II

This Volume 4977 of the conference proceedings contains 73 papers. Topics discussed include laser applications in microelectronics and optoelectronic manufacturing, laser microengineering, femtosecond laser processing, laser nanoengineering, pulsed laser deposition, laser engineering photonic structures, laser direct write, microstructuring, laser engineered semiconductor structures, laser joining, welding, drilling and cutting, structuring and synthesis and photonics of nanoscale materials.

关键词： Optoelectronic devices

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Opportunities and challenges for laser technology in microelectronics and photonics

Opportunities and challenges for laser technology in microel...

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conference on photon processing in microelectronics and photonics II

作者： Hoving, W CFT Philips Ctr Ind Technol NL-5600 MD Eindhoven Netherlands

ISBN: (纸本)0819447773

Industrial manufacturing with the aid of laser technology has found many applications in the microelectronics industry during the last three decades. At Philips the main application fields are laser spot welding and marking. Several novel fields are strongly coming up due to the high demands in the microelectronics and (flat) display industry that cannot be met with conventional technologies. In this paper we give an overview of the present status of laser technology in electronics manufacturing and of innovative developments for new applications in microelectronics and photonics.

关键词： laser materials processing micro-spot welding spike-welding adjustment separation cleavage laser mass transfer process control

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Laser processing of photonic & micro-electronic components using multiple visible and UV wavelength source

Laser processing of photonic & micro-electronic components u...

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conference on photon processing in microelectronics and photonics II

作者： Illy, E Rutterford, G Knowles, MRH Oxford Lasers Ltd Abingdon OX14 3YR Oxon England

Laser processing using a multiple visible and UV wavelength copper laser source is presented with particular emphasis on photonic and microelectronic applications. Visible micromachining of ceramics and diamond are di... 详细信息

ISBN: (纸本)0819447773

关键词： laser micromachining copper vapor laser microelectonics fibre Bragg gratings dicing

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Laser micromachining in the microelectronics industry: Emerging applications

Laser micromachining in the microelectronics industry: Emerg...

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conference on photon processing in microelectronics and photonics II

作者： Subrahmanyan, PK Electro Sci Ind Inc Portland OR 97007 USA

ISBN: (纸本)0819447773

Emerging applications in the microelectronics industry impose special manufacturing requirements that are not well addressed by conventional manufacturing techniques. On the other hand, advances in laser technology, optics and beam steering combined with a better understanding of laser-material interaction make laser micromachining a viable, attractive, cost-effective and in some cases enabling technology to support these applications. This paper reviews some of the emerging applications in the microelectronics industry that are well served by laser micromachining and discusses the advancements in lasers, optics and beam steering that enable cost effective laser micromachining. It also discusses some open issues that are the subject of current and future research.

关键词： lasers micromachining microelectronics

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Laser processing of ceramic and crystalline wafer substrates for microelectronic applications

Laser processing of ceramic and crystalline wafer substrates...

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conference on photon processing in microelectronics and photonics II

作者： Ashkenasi, D Binder, A Jaber, H Kern, H Müller, N Ziegert, A Laser & Med Technol Berlin GmbH Dept Appl Laser Technol Berlin Germany

ISBN: (纸本)0819447773

Ceramic and crystalline wafer substrates are widely used in microelectronics. The individual choice is based on their thermal, optical and mechanical properties. For a variety of applications high quality laser micro processing of these materials, i.e. the generation of blind and through holes, grooves and even complex three dimensional micro structures, is gaining in importance. The department of applied laser technologies of the LMTB GmbH has conducted extensive studies on the versatility of q-switch Nd:YAG laser systems for the micro structuring of ceramic and crystalline wafer substrates that differ strongly in their optical and mechanical properties, such as Al2O3, AlN, sapphire, Si and SiC. This paper discusses the laser material micro machining results in respect to the laser parameters used to optimize the micro processing quality and speed for the different materials.

关键词： laser material micro machining (LM3) wafer substrates semi-conductors ceramics transparent dielectrics

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