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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

共 185 条记录，以下是91-100 订阅

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Lithographyfree high resolution inkjet printed OFET (organic field effect transistor) fabrication on polymer by laser processing

Lithographyfree high resolution inkjet printed OFET (organic...

引用

conference on photon processing in microelectronics and photonics VI

作者： Ko, Seung Hwan Pan, Heng Grigoropoulos, Costas P. Poulikakos, Dimos Univ Calif Berkeley Dept Mech Engn Laser Thermal Lab Berkeley CA 94720 USA

ISBN: (纸本)9780819465719

The low temperature fabrication of OFET (organic field effect transistor) on the flexible polymer substrate is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in Alpha-Terpineol solvent, PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent, semiconductor polymer (modified polythiophene) in dichlorobenzene (o-DCB) solution to fabricate OFET on flexible polymer substrates. Short pulsed laser ablation enabled finer electrical components to overcome the resolution limitation of inkjet deposition. Continuous Argon ion laser was irradiated locally to evaporate carrier solvent as well as to sinter gold nano-particles. In addition, a new selective ablation of multilayered gold nanoparticle film was demonstrated using the SPLA-DAT (selective pulsed laser ablation by differential ablation threshold) scheme for sintered and non-sintered gold nanoparticles. Finally, selective ablation of multilayered film was used to define narrow channel of a FET (field effect transistor) and semiconductor polymer solution was deposited on top of channel to complete OFET (organic field effect transistor) fabrication.

关键词： flexible electronics OFET (organic field effect transistor) nanoparticle inkjet printing laser ablation and sintering

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processing of silicon by Nd:YAG-lasers with harmonics generation

Processing of silicon by Nd:YAG-lasers with harmonics genera...

引用

conference on photon processing in microelectronics and photonics

作者： Michael, P Jörg, K Hendrik, W Udo, K Eckhard, B Fraunhofer Inst Mat & Beam Technol D-01277 Dresden Germany

ISBN: (纸本)081944376X

Micro structures in silicon are applied in different fields of industry, medicine and research. Examples are micro mechanical sensors for car security systems, nozzle plates for printer, and optical elements for X-ray beam splitting. Wherever the accuracy of etched silicon structures is not required, laser processes with short pulses and small wave length can be an option with the advantage of shorter process time High quality cutting and drilling of silicon can be achieved by application of diode pumped q-switched Nd:YAG-lasers and harmonics generation. The short pulses (15 ns) and the UV wave length (355 nm) of the Gator UV from Lambda Physik AG, for example, allow a reduction of thermal effects like deposition of molten material and heat effected zones at the edges. Especially in the case of deep structures the ablation plasma causes powerful heating of the walls. An reduction of the plasma temperatures and so the heat influence on the walls can be realized by a small laser wave length with low plasma absorption. Short laser pulse durations are necessary to reduce the heat effected depth or melting due to heat flow from the ablation area into the bulk material. Also the duration and intensity of plasma heating is reduced by short laser pulses. In this contribution the possibilities and limits of laser machining of Si by diode pumped Nd:YAG-lasers with harmonics generation will be presented by means of structures processed by application of a scanner with f-theta-optic. The results will be discussed concerning the experimental setup and the laser parameters.

关键词： laser processing laser ablation laser cutting microstructure processing silicon

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Single photonics and quantum information

Single photonics and quantum information

引用

Laser Science, LS 2006

作者： Milburn, G.J. The University of Queensland QLD 4072 Australia

I introduce the concept of an optical single photon state and review proposed quantum information processing schemes that use them. I also describe a scheme for coherent optical communication with single photon states... 详细信息

ISBN: (纸本)1557528187

关键词： photons

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Excimer laser processing of novel materials for optoelectronic and spintronic applications

Excimer laser processing of novel materials for optoelectron...

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conference on photon processing in microelectronics and photonics VI

作者： Tabbal, Malek Aziz, Michael J. Madi, Charbel Charnvanichborikarn, Supakit Williams, James S. Christidis, Theodore C. Amer Univ Beirut Dept Phys Bliss St Beirut 1107 Lebanon

ISBN: (纸本)9780819465719

The interaction of the highly energetic pulsed excimer laser beam with a target material induces non-equilibrium physico-chemical processes which could be harnessed to synthesize a variety of novel and technologically attractive materials that are difficult to grow using more conventional thin film deposition techniques. In this paper, recent advances on two excimer laser based techniques that we have used in the processing of thin films and surfaces will be presented. First, we demonstrate the synthesis, by Pulsed Laser Melting (PLM), of silicon supersaturated with sulfur at concentrations several orders of magnitude greater than the solubility limit of silicon alloys, with strong sub-bandgap optical absorption. This material has potential applications in the fabrication of Si-based opto-electronic devices. Second, the capability of Remote Plasma Pulsed Laser Deposition (RP-PLD) in synthesizing the meta-stable half-metallic CrO2 compound that is of great interest in the field of spintronics was assessed. Infra-Red spectroscopy and Magnetic Force Microscopy indicate that the use of the remote plasma is beneficial to the formation of the CrO2 phase, at a deposition pressure of 30 mTorr and for deposition temperature below 350 degrees C. Atomic Force Microscopy and Magnetic Force Microscopy studies respectively show that films containing the CrO2 phase have significantly different surface topography and magnetic characteristics from those in which the Cr2O3 phase is dominant.

关键词： PLD PLM laser ablation laser annealing excimer laser chromium oxide black silicon sulfur doping

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Laser treatment of micro-components' surface for improved tribological applications

Laser treatment of micro-components' surface for improved tr...

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conference on photon processing in microelectronics and photonics V

作者： Ye, Kaidong Goh, Yeow-Whatt Cheng, Cheow-Tong Yeo, Ching-iing Hong, Minghul Data Storage Inst 5 Engn Dr 1 Singapore 117608 Singapore Sony Singapore Res Lab Singapore 117684 Singapore

ISBN: (纸本)0819461482

We are proposing a method and system. to mount and treat the surface of a fabricated micro-component to improve its tribological performance. By irradiating an infrared laser under ambient conditions, the heat will penetrate the micro-component's Surface, causing it to melt and flow to reduce the amount of irregularity. This method can create a desired Surface finishing with good repeatability on selected regions of the micro-components. It can also work on surfaces of various material types as well as internal surfaces of thin planar or circular structure. By changing the laser power, the repetition rate and the scanning speed, the process can deal with Surfaces of different roughness. The final surface roughness can,be improved from micro-meter level to sub-100nm level. The laser treated micro-components have improved tribological performance as the friction is reduced;the abrasion, heat and noise are also reduced. The improvement can enhance the lifetime of the micro-component when used in micro rotating or sliding mechanism.

关键词： Laser therapeutics Surface finishing Surface roughness Silicon Semiconductor lasers Laser scanners Polishing Annealing Laser processing Profilometers

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A new approach of smart vision sensors

A new approach of smart vision sensors

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conference on Optics, photonics and Digital Technologies for Multimedia Applications ii

作者： Bezine, Julien Thevenin, Mathieu Schmit, Renaud Duranton, Marc Paindavoine, Michel CEA LIST Bat 862 PC 172 F-91191 Gif Sur Yvette France Univ Bourgogne LEAD F-21065 Dijon France

ISBN: (纸本)9780819491282

Today's digital image sensors are used as passive photon integrators and image processing is essentially performed by digital processors separated from the image sensing part. This approach imposes to the processing part to deal with already grabbed pictures with possible unadjusted exposition parameters. This paper presents a fast self-adaptable preprocessing architecture with fast feedbacks on the sensing level. These feedbacks are controlled by digital processing in order to modify the sensor parameters during exposure time. Exposition and processing parameters are tuned in real life to fit with applications requirement depending on scene parameters. Considering emerging integration technologies such as 3D stacking, this paper presents an innovative way of designing smart vision sensors, integrating feedback control and opening new approaches for machine vision architectures.

关键词： image sensor imager smart imager vision chip feedback control active image processing active image sensor high dynamic range processing adaptation

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Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation

Development of dicing technique for thin semiconductor subst...

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conference on photon processing in microelectronics and photonics

作者： Yokotani, A Matsuo, N Kawahara, K Kurogi, Y Matsuo, N Ninomiya, T Sawada, H Kurosawa, K Miyazaki Univ Dept Elect & Elect Engn Miyazaki 8892192 Japan

ISBN: (纸本)081944376X

Recently, the semiconductor substrates for integrated circuits (ICs) have been required to become as thin as 50 pin, because the many electronic devices are strongly demanded to be miniaturized and light-weighted. Machining of such thin substrates with conventional dicing techniques is very difficult. Therefore, we have proposed to process them using femtosecond laser ablation, expecting advantage of efficient etching without undesirable mechanical and thermal damages such as cracking and melting is expected. In this work, we have investigated the influence of the laser conditions such as pulse duration and fluence on the cutting depth and diameter in order to develop a new photo-dicing technique for very thin ICs. Within the range of pulse energy used in the present experiments, the dependence of the pulse duration did not seem to be significant. It was also found that the lower energy of the laser pulses, the smaller and the deeper, i.e., the sharper holes were formed. The typical cutting depth and diameter for 0.20 mJ/pulse and 5 shots were 17 mum and 40 mum, respectively. These values are very promising for the practical dicing applications.

关键词： femtosecond laser laser ablation laser scanning microscope processing efficiency

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Embedded processor extensions for image processing

Embedded processor extensions for image processing

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conference on photonics in Multimedia ii

作者： Thevenin, Mathieu Paindavoine, Michel Letellier, Laurent Heyrman, Barthelemy Embedded Comp Lab LIST CEA Bd 528 MB 94 F-91191 Gif Sur Yvette France Univ Bourgogne CNR UMR 5158 LE2i F-21000 Dijon France

ISBN: (纸本)9780819471994

The advent of camera phones marks a new phase in embedded camera sales. By late 2009, the total number of camera phones will exceed that of both conventional and digital cameras shipped since the invention of photography. Use in mobile phones of applications like visiophony, matrix code readers and biometrics requires a high degree of component flexibility that image processors (IPs) have not, to date, been able to provide. For all these reasons, programmable processor solutions have become essential. This paper presents several techniques geared to speeding up image processors. It demonstrates that a,am of twice is possible for the complete image acquisition chain and the enhancement pipeline downstream of the video sensor. Such results confirm the potential of these computing systems for supporting future applications.

关键词： processor embedded image enhancement CMOS video sensor

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CAD/CAM software for an industrial laser manufacturing tool

CAD/CAM software for an industrial laser manufacturing tool

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PROCEEDINGS OF SPIE SPIE - The International Society for Optical Engineering: photon processing in microelectronics and photonics ii

作者： Böhlen, Ines Stassen Fieret, Jim Holmes, Andrew Lee, Kin Wei Exitech Ltd. Oxford Industrial Park Yarnton Oxford OX5 1QU United Kingdom Imp. Coll. of Sci. Technol. Med. Dept. of Elec. and Electron. Eng. Exhibition Road London SW7 2BT United Kingdom

A facility for rapid prototyping of MEMS devices is crucial for the development of novel miniaturised components in all sectors of high-tech industry, e.g. telecommunications, information technology, micro-optics and aerospace. To overcome the disadvantages of existing techniques in terms of cost and flexibility, a new approach has been taken to provide a tool for rapid prototyping and small-scale production: Complex CAD/CAM software has been developed that automatically generates the tool paths according to a CAD drawing of the MEMS device. As laser ablation is a much more complicated process than mechanical machining, for which such software has already been in use for many years, the generation of these tool paths relies not only on geometric considerations, but also on a sophisticated simulation module taking into account various material and laser parameters and micro-effects. The following laser machining options have been implemented: cutting, hole drilling, slot cutting, 2D area clearing, pocketing and 2 l/2D surface machining. Once the tool paths are available, a post processor translates this information into CNC commands that control a scanner head. This scanner head then guides the beam of a UV solid-state laser to machine the desired structure by direct laser ablation.

关键词： Microelectronic processing

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Laser processing of advanced materials with high brightness solid-state lasers at 532 nm

Laser processing of advanced materials with high brightness ...

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conference on photon processing in microelectronics and photonics V

作者： Riesbeck, T. Binder, A. Eichler, H. J. Tech Univ Berlin Opt Inst P1-1Str 17 Juni 135 D-10623 Berlin Germany LMTB GmbH Angewandte Lasertech D-12489 Berlin Germany

ISBN: (纸本)0819461482

Many materials e.g. diamond or silicon do not show sufficient absorption at one micron, the fundamental wavelength of Nd-based solid-state laser Sources. Frequency conversion to the second and fourth harmonic allows the efficient processing of these materials. High beam quality is another important property for micro material processing, with lasers. It facilitates small focus diameters and due to high Rayleigh length even at strong focusing drilling of holes with high aspect ratio. Together with high average Output Powers it allows fast processes with high quality. At least flexible pulse peak power and repetition rate is necessary to optimize the process. Two laser systems which fulfill these requirements are investigated. A pulse pumped Nd:YAP system which delivers an average Output power of 124 W at the second harmonic and a Nd:YAG with an average Output power Lip to 50 W in the second harmonic. Due to its active Q-switch the pulse peak power of this system is variable in a wide range. Efficient laser processing of different ceramics with these laser system are presented.

关键词： solid state lasers beam quality phase conjugation optical fiber frequency conversion high aspect ratio

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