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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

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Classical and quantum information processing based on laser-matter coherent interaction

Classical and quantum information processing based on laser-...

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Forth Asia-Pacific conference on Fuundamental Problem of Optoelectronics and microelectronics ii

作者： Manykin, EA IV Kurchatov Atom Energy Inst Russian Res Ctr Moscow 123182 Russia

ISBN: (纸本)0819458481

Principles and schemes of optical information processing, transmission and storage based on the ultra-short laser impulses' interaction with doped rare-earth ions' crystals are considered, Nonlinear optical effect as a photon echo is discussed. This effect is widely used for the investigation of kinetic processing involving the relaxation of elementary excitations in solids. Possibility of parallel processing of large data arrays in the form of two and three dimensional images and flexibility in controlling data flows are represented. Architecture of the various photon echo digital operation, including laser digital vector and matrix-vector multiplication are analyzed. Advantages of optical coherent phenomena for quantum computing are discussed.

关键词： photon echo optical information processing digital operation quantum computing

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Two-dimensional hexagonally arrayed nanohole fabrication on silicon substrate using a femtosecond laser pulse

Two-dimensional hexagonally arrayed nanohole fabrication on ...

引用

conference on photon processing in microelectronics and photonics IV

作者： Takada, H Obara, M Keio Univ Fac Sci & Technol Dept Elect & Elect Engn Kohoku Ku Yokohama Kanagawa 2238522 Japan

ISBN: (纸本)081945687X

We report a nanohole array fabrication with a particle light enhancement effect using a femtosecond laser pulse. Two-dimensional (2-D) arrayed polystyrene (PS) nanoparticles are deposited on silicon (Si) substrates. Polystyrene spherical particles with diameters of 200, 450, and 820 run are used. We investigated the fabricated nanohole profiles in terms of the particles diameter and irradiated laser fluence. The morphology of the nanoholes is characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The nanohole diameter and depth became larger and deeper as the diameter of used particle or the irradiated laser fluence is increased. The intensity enhancement factor is obtained from the experimental data by comparing the nanohole depths to the ablation rate of the Si surface without particles. The enhanced light intensity between a PS particle and a Si substrate is calculated by the finite difference time domain (FDTD) method. The calculated optical enhancement factor is consistent with the experimental value.

关键词： near-field optics nanostructuring femtosecond laser laser processing ablation Mie scattering

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Pulse duration and energy density influence on laser processing of metals with short and ultra-short pulses

Pulse duration and energy density influence on laser process...

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conference on photon processing in microelectronics and photonics IV

作者： Le Harzic, R Breitling, D Sommer, S Föhl, C Valette, S König, K Dausinger, F Audouard, E Univ Stuttgart IFSW D-70569 Stuttgart Germany

ISBN: (纸本)081945687X

Influence of pulse duration on microprocessing of Al is studied. Results show noticeable differences in terms of quality, burr height and remolten or recast matter into micromachined grooves at high fluence regime for 120fs and 4,5 ps pulse duration. At 120 fs experimental results of penetration depth are found to be 2 or 3 times higher than the theoretical optical penetration depth and is lowered to this value with increasing pulse duration. At high fluence regime up to 2 J/cm(2), ablation thresholds are found to be in the range 10 times higher than for the case of 1 J/cm(2). Penetration depths are higher by a factor 10 to 20 than the theoretical optical penetration depth. The ablation rate is nearly constant until 1 ps and then falls down to 2 times lower values and decreases regularly until 4,5 ps. This time is supposed to correspond to a critical pulse width between ultrashort and short regime.

关键词： laser femtosecond picosecond ablation pulse duration energy heat penetration thermal effects

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LIPAA technique and its possible impact on micro-electronics

LIPAA technique and its possible impact on micro-electronics

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conference on photon processing in microelectronics and photonics IV

作者： Hanada, Y Sugioka, K Miyamoto, L Midorikawa, K RIKEN Cent Res Inst Phys Wako Saitama 3510198 Japan

ISBN: (纸本)081945687X

The laser-induced plasma-assisted ablation (LIPAA) process developed by our group, in which a single conventional pulsed laser is only used, makes it possible to perform high-quality and high-speed glass micro fabrication. Up to the present, this process has been widely applied for micromachining of various transparent hard and soft materials. In this process, a laser beam is first directed to a glass substrate placed in vacuum or air. The laser beam passes through the substrate since the wavelength of the laser beam must have no absorption by the substrate for the LIPAA process. The transmitted laser beam is absorbed by a solid target (typically a metal), located behind the substrate. The target is then ablated, resulting in plasma generation. Due to the interaction of the laser beam and the laser-induced plasma, significant ablation takes place at the rear surface of the substrate. Recently, we have developed the proto-type LIPAA system using a second harmonic of diode pumped Q-switched Nd:YAG laser for the practical use. In this paper, we will demonstrate micromachining, crack-free marking, color marking and dicing of glass materials. Additionally, selective metallization of glass and polyimide by the LIPAA process followed by metal chemical-plating is investigated. The discussion includes mechanism and practical applications in micro-electronics industry of the LIPAA process.

关键词： laser-induced plasma-assisted ablation (LIPAA) micromachining dicing metallization

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Laser-based microprocesses using diffraction-free beams generated by diffractive axicons

Laser-based microprocesses using diffraction-free beams gene...

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conference on photon processing in microelectronics and photonics IV

作者： Amako, J Yoshimura, K Sawaki, D Shimoda, T Seiko Epson Corp Technol Platform Res Ctr Suwa Nagano 3990293 Japan

ISBN: (纸本)081945687X

Diffraction-free beams having a large depth of focus are of great merit in laser-based processes in which light-matter interaction is to occur in an extended region along the beam path. We have investigated two kinds of processes that use a diffraction-free beam known as a zero-order Bessel beam: 1) Laser-drilling metal films coated on a substrate to make pinholes therein using nanosecond laser pulses at 532 nm. Given an uneven surface of the substrate, the beam irradiation point, or the process point, would be displaced from a right position. By using the Bessel beams holes similar to 2 mu m in diameter can be formed despite the displacement of similar to 2 mm or more. 2) Laser-exposing bulk glass to form modifications inside using femtosecond laser pulses at 800 nm. The pulses must be temporally stretched to save their energy from being used up because of multi-photon absorption. The Bessel pulses can modify through glasses similar to 3 mm thick in a width of < 5 mu m. We have developed a new set of formulas to calculate the Bessel fields, which are generated by diffractive optical elements. The elements are designed to convert a Gaussian beam efficiently into an approximate form of the zero-order Bessel beam and are fabricated on fused quartz by direct laser writing and reactive-ion etching.

关键词： laser processing hybridized process diffraction-free beam diffractive axicon depth of focus

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New laser patterning technology with dynamic focus control for 3-D MIDs

New laser patterning technology with dynamic focus control f...

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conference on photon processing in microelectronics and photonics IV

作者： Suzuki, T Shindo, T Yuasa, S Matsushita Elect Works Ltd Adv Technol Fus Lab Kadoma Osaka 5718686 Japan

ISBN: (纸本)081945687X

We have developed an original laser structuring process for MIDs in harmony with laser patterning technology recently displaying remarkable technical innovation.. For creating MID products, conventional patterning technology is unable to meet the requirements for complicated three-dimensional shapes, finer circuits and higher accuracy because of involving the following problems. 1) It is difficult to execute highly accurate and fine circuit patterning on surfaces at a 900 angle with level difference of 4mm or over. 2) It is difficult to assure the quality on surfaces such as sloped surfaces where the workability is varied. 3) The productivity is lowered due to fine circuit patterning. We have solved the above problems through dynamic control of laser structuring parameters, using a dynamic focusing system, and it has enabled the following improvements. 1) Successive laser patterning on surfaces with level difference of 10mm. 2) Fine circuit (track/gap = 30 mu m/30 mu m) patterning in same circuit on surfaces at a 90 degrees angle. 3) Quality assurance and productivity improvement by structuring parameters best for patterning.

关键词： Optical lithography Laser applications Laser processing Beam controllers Control systems Laser development Copper Dynamical systems Laser systems engineering Plating

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Quantum cascade lasers tuned by amorphous As₂S₃ claddings

Quantum cascade lasers tuned by amorphous As<sub>2</sub>S<su...

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conference on photon processing in microelectronics and photonics IV

作者： Recht, DL Liu, ZJ Rahman, KR Gmachl, CF Arnold, CB Princeton Univ Princeton Inst Sci & Technol Mat Princeton NJ 08544 USA

ISBN: (纸本)081945687X

Quantum cascade lasers (QCLs) have become a key component in the development of optical approaches to sensing applications. Recent experiments have shown the ability to achieve second harmonic generation from these structures suggesting the possibility of achieving short wave-infrared output. However, in these cases the power of the non-linear mode is limited by its phase mismatch with the fundamental cavity mode. By modifying the effective index of the laser system through cladding, one may ameliorate the mismatch to increase power output. In this study, we develop a simple method for drop-coating arsenic sulfide (As2S3)glass on QCLs. The glass is processed by above band-gap illumination, which induces a change in the refractive index resulting in a shift of the output mode of the laser. We observe the effective index to change by a factor 1.3 x 10(-4) after 20 minutes of illumination at 312 rim. for the fundamental wavelength of the QCL. Below band-gap irradiation, such as that occurring during device operation, is confirmed to have no effect on the material. Studies of the output of QCLs reveal for the first time mode shifting of the spectra as a result of optical modification to a cladding layer.

关键词： chalcogenide glass quantum cascade laser QCL laser processing arsenic sulfide second harmonic generation

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Viscous drag force effect on transportation of sub-micron particle contaminants during dry and steam laser cleaning

Viscous drag force effect on transportation of sub-micron pa...

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conference on photon processing in microelectronics and photonics IV

作者： Kudryashov, SI Allen, SD Arkansas State Univ Dept Chem & Phys Jonesboro AR 72467 USA

ISBN: (纸本)081945687X

Viscous air drag and diffusive Brownian motion result in unfavorable re-deposition of sub-micron spherical particle contaminants after their dry laser-assisted detachment from critical surfaces. Theoretical modeling and experimental results on particle transportation in air and thin variable liquid layers point out particle size and lift-off velocity as the most important parameters for efficient particle removal from critical substrates, while for smaller particles with lower inertia, lower lift-off distances and higher diffusion rates dry laser cleaning is less effective due to their fast diffusive redeposition back on these substrates. Under these circumstances one excellent option is the steam laser cleaning technique, when contaminating particles lift-off together with explosively boiling pre-deposited layer or separate micronsized droplets of a low-boiling liquid energy transfer medium and travel in the hydro- and gas-dynamic flow produced to much higher distances from the substrate irrespectively on particle size. Mechanical coupling of particles to the lifting-off liquid layer or separate droplets occurs via the known "inertial" mechanism and/or new mechanism of "dragging" contaminating particles off the substrate by the liquid environment, demonstrated for the first time in this work. Nearly 100% cleaning efficiencies and no any indication of re-deposition were observed for different particles in single-shot steam laser cleaning experiments.

关键词： microelectronics critical surfaces nano- and micro-contaminants dry and steam laser cleaning

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F₂-laser micro-welding of optical fibers and glass substrates

F<sub>2</sub>-laser micro-welding of optical fibers and glas...

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conference on photon processing in microelectronics and photonics IV

作者： Ho, S Aitchison, JS Herman, PR Univ Toronto Dept Elect & Comp Engn Toronto ON M5S 3G4 Canada

ISBN: (纸本)081945687X

Laser welding of optical glasses remains a challenging area today because of the weak optical absorption typically available with most commercial lasers and the brittle nature of glass. In this paper, we demonstrate for the first time to our best knowledge, the laser welding of telecommunication optical fiber onto a fused silica substrate. The 157-nm F-2 laser was selected for the wide processing window. that drives strong absorption at high fluence exposure > 1 J/cm(2) without inducing microcrack formation. The method of second surface ablation was applied to the contact point between the glass plate and glass fiber to locally heat, melt, and reflow the glass and thereby weld together the two similar glasses. Mechanical pressure was applied while the laser beam was scanned along the sample contact to produce a line of overlapping welds of 25-mu m spot size each. Fused silica samples of up to several hundreds of microns thick could be welded owing to a large 157-nm penetration depth of 1/alpha approximate to 1 mm. A narrow 3.31 to 3.66 J/cm(2) fluence window was found for laser welding through 160-mu m thick fused silica substrates. The F-2-laser welding window is constrained by the need for sufficient transmitted fluence to melt the interface without too much fluence that will damaged the interface structure at the onset of ablation or induce front surface ablation.

关键词： glass welding laser micromachining photonics packaging laser welding F-2 laser

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Measurement techniques for laser parameters relevant to materials processing

Measurement techniques for laser parameters relevant to mate...

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conference on photon processing in microelectronics and photonics IV

作者： Arbore, MA Balsley, D Morehead, J Adams, F Wiechmann, W Kmetec, J Zhou, YD Grossman, WM Lightwave Elect Corp Mountain View CA 94043 USA

ISBN: (纸本)081945687X

Many micromachining operations, particularly in the electronics sector, utilize pulsed solid-state UV lasers. These processes demand high levels of stability, as the yield and quality relate directly to the repeatability of each laser pulse. Critical stability issues arise with single-pulse processes (e.g. repair), situations requiring bursts of pulses (e.g. drilling), and continuous pulsing applications (e.g. cutting). To realize optimal stability specific design choices must be made, certain transient problems must be solved, and pulse energy measurements must be standardized. Solid-state UV lasers originate as infrared lasers, and nonlinear optics converts the infrared to the UV. This conversion introduces instability. Performing the conversion within the infrared laser cavity suppresses the instability, relative to performing the conversion outside of the laser cavity. We explain this phenomenon. Ideally, a versatile and stable solid-state laser can generate pulses in many formats. Thermal effects tend to prevent this versatile ideal, resulting in transient problems (unstable pulse trains), or less than optimal performance when the laser is pulsing continuously. Many methods of measuring pulse energy exist. Each method can produce surprisingly different results. We compare various techniques, discuss their limitations, and suggest an easily implemented pulse energy stability measurement.

关键词： solid-state diode-pumped materials processing ultraviolet micromachining measurement stability harmonic generation intracavity harmonic generation

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