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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

共 185 条记录，以下是141-150 订阅

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Femtosecond laser interferometric processing of Nd:GGG planar optical waveguide

Femtosecond laser interferometric processing of Nd:GGG plana...

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conference on photon processing in microelectronics and photonics ii

作者： Oi, K Obara, M Sumiyoshi, T Keio Univ Fac Sci & Technol Dept Elect & Elect Engn Kohoku Ku Yokohama Kanagawa 2138522 Japan

ISBN: (纸本)0819447773

Surface relief type gratings for input laser coupling were fabricated on the PLD deposited 2 at. % Nd:GGG thin film optical waveguide by femtosecond laser interferometric processing. The. morphology and coupling efficiency were experimentally evaluated. A clear periodic structure with a fringe period of similar to 800 nm and height of similar to 100 nm was obtained for a surface relief type grating induced on the target surface with a fluence of 0.92 Jcm(-2). The coupling efficiency of an 808 nm-centered laser diode pumping light into the 1.35 mum thick film was measured as a function of the incident angle. Three coupling peaks were observed at 57degrees, 65degrees and 77degrees, each being the coupling to the TE0, TE1 and TE2 modes respectively. Each peak had a large FWHM and a maximum coupling efficiency was 3 %.

关键词： interferometric ablation femtosecond laser processing grating coupler waveguide laser neodymium doped gallium gadolinium garnet

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Application of melt ejection criterion in simulation of micro-machining with laser

Application of melt ejection criterion in simulation of micr...

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conference on photon processing in microelectronics and photonics ii

作者： Semak, VV Schriempf, JT Knorovsky, GA MacCallum, DO Penn State Univ Ctr Electroopt ARL Kittanning PA 16201 USA

ISBN: (纸本)0819447773

A theoretical criterion defining the threshold pulse energy and beam intensity required for melt ejection is proposed. The results of numerical simulation present dependencies of the threshold pulse energy and beam intensity as functions of laser pulse duration and beam radius. The experimental verification of the proposed criterion is described and the comparison of theoretical predictions and measurements is presented. The criterion is applied for simulation of laser drilling metal foil with thickness in the range 25 mum - 125 mum using a laser beam with 12 mum beam radius and pulse durations 10 ns and 100 ns. The computational results are used to interpret the results of an experimental study of laser drilling of 125 mum aluminum foil using a single mode beam of a XeCl laser performed at the Nederlands Centrum voor Laser Research (NCLR) and the University of Twente. Additional results on Nd:YAG spot welds in pure Ni are also presented.

关键词： laser materials processing laser welding laser drilling modeling simulation

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Sub-surface 3d structures by laser-induced modification of the optical properties of transparent materials

Sub-surface 3d structures by laser-induced modification of t...

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conference on photon processing in microelectronics and photonics ii

作者： Ashkenasi, D Hoffmann, HJ Krause, D Müller, G Laser & Med Technol GmbH Div Appl Laser Technol Berlin Germany

ISBN: (纸本)0819447773

A new field in laser processing is opened by this method of modifying the optical properties, i.e. the refractive, index, absorption- and scattering-coefficient, inside the material. Focusing ultra. short laser pulses inside the transparent media allows to control and modify their optical properties. This is referred to as nik-engineering(TM), relating the experimental technique to changes of the complex refractive index (n + ik). Three dimensional patterns of the (n + ik) modifications can be achieved in the subsurface region even on a microscopic scale. New results in nik-engineering obtained in our application laboratory are presented using different optical materials. The results in laser nik-engineering. of photo-chromic glass using ultra short laser pulses at a wavelength of 800 nm are presented to the best of our knowledge for the first time. We discuss the results and the possibilities of nik-engineering and consider the technological relevance with respect to decorative work, micro-tagging, and other functional-structures.

关键词： laser processing nik-engineering((TM)) sub-surface modification damage threshold ultra short laser pulses photo-chromic glass

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Laser beam soldering - An attractive alternative to conventional soldering technologies

Laser beam soldering - An attractive alternative to conventi...

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conference on photon processing in microelectronics and photonics ii

作者： Bosse, L Koglin, A Olowinsky, A Kolauch, V Nover, M Fraunhofer Inst Lasertech ILT D-52074 Aachen Germany

ISBN: (纸本)0819447773

Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and interconnection technology today. Due to the actual trend towards complex and cost intensive products, LBS gains more attention for certain applications in this field. For mass production in automotive applications a fully automated and temperature controlled LBS process was developed. The achieved results are discussed with respect to quality, reliability and process efficiency and compared to established micro flame (hydrogen) soldering technology. The development of the LBS process is presented. The process window is optimized using High Speed Video Imaging. Temperature signals are logged by means of pyrometry. The processed parts are evaluated with metallographical assessment of solder joint quality. Especially cross sections reveal the fine grained structure and the shape of the meniscus of the solder joints. The reliability is proven using shear strength tests and thermally induced strain cycles. Conclusively, LBS is a stable, reproducible process for applications requiring controlled and locally restricted heat input. The thermal and mechanical stress is reduced in comparison to conventional techniques.

关键词： Lead Mirrors Signal detection Sensors Signal processing Aluminum Laser welding Reliability Hybrid circuits Ceramics

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Femtosecond laser ablation processing of x-cut LiNbO₃ substrates for optical communication devices

Femtosecond laser ablation processing of x-cut LiNbO<sub>3</...

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conference on photon processing in microelectronics and photonics ii

作者： Kitano, R Ozono, K Obara, M Tsuda, H Keio Univ Kohoku Ku Yokohama Kanagawa 2238522 Japan

ISBN: (纸本)0819447773

We have studied femtosecond laser ablation characteristics of LiNbO3 for the first time. LiNbO3 is ferroelectric material with large optical nonlinearity and Pockels effect. The femtosecond laser ablation is very useful to fabricate various optical devices including the optical modulator and the tunable optical filter for optical communication systems because the thermal damage around the irradiated area is small due to the short pulse width, and the sub-wavelength structures may be formed by the multi-photon excitation. In our experiments, the femtosecond Ti:Sapphire laser system (Energy 0.14 mJ/pulse, Wavelength 800 nm, Pulse duration 60 fs, Repetition rate 1 kHz) based on the chirped-pulse amplification (CPA) technique was used. The aperture with a diameter of 5 nun was imaged onto the LiNbO3 surface by the objective lens in the air. We observed ablation holes by the scanning electron microscope and the profilometer. We have found no damage around the holes and the clear boundary between ablated area and non-ablated area was observed. Those features are very useful for precise material processing. The bottom face of the holes was relatively flat. The etching rate was 0.93 micrometer/pulse and proportional to the number of the laser pulse. The results showed that the femtosecond laser ablation is an innovative tool for manufacturing LiNbO3-based optical devices.

关键词： LiNbO3 femtosecond laser ablation processing optical waveguide optical communication

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Autonomous production cell for μm- and nm-processing

Autonomous production cell for μm- and nm-processing

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conference on photon processing in microelectronics and photonics ii

作者： Kreutz, EW Böske, L Kaierle, S Mann, S Ortmann, J Willach, J Rhein Westfal TH Aachen Klinikum Lehrstuhl Lasertech D-52074 Aachen Germany

ISBN: (纸本)0819447773

Shorter life time cycles of products, increasing workpiece variety and declining lot sizes demand for a closed processing chain which enables the economic production of variable products in the future. A new type of manufacturing concept for the production of the 21(st) century is lined out by the design of an "Autonomous Production Cell". Applied to and designed for manufacturing with laser radiation this concept shows completely new ways in comparison to former manufacturing procedures. The manufacturing processes in the Autonomous Production Cell start with a production oriented design and planning of the manufacturing procedure is including sensor controlled processing of the workpieces with integrated quality management. The quality management detects failures in the manufacturing, procedure and allows back-coupling to any preceding step by means of a multistage cascaded production controller. In comparison to former concepts the user is at all times integrated into the manufacturing procedure. The user can add his own competence and creativity. At the same time he is being relieved by routine work and gets adequate help by the system in corresponding situations. The design of the components of the Autonomous Production Cell (design and planning tools, networking of sensors and actuators, user interface, etc.) has been performed as general as possible. This offers the possibility to transfer this. concept with countable efforts to all the manufacturing with laser radiation such as welding, cutting, surface treatment, freeforming, rapid prototyping, etc.

关键词： laser radiation manufacturing processing control failure analysis quality assurance

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Femtosecond laser processing tailored for biomedical materials and laser power delivery through optical fibers

Femtosecond laser processing tailored for biomedical materia...

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conference on photon processing in microelectronics and photonics ii

作者： Obara, M Ozono, K Kanai, M Sekita, H Atanasov, PA Keio Univ Dept Elect & Elect Engn Kohoku Ku Yokohama Kanagawa 2238522 Japan

ISBN: (纸本)0819447773

We have been working on the tailored ablation processing of advanced materials using femtosecond lasers. Here we would like to focus on the femtosecond laser processing tailored for hydroxyapatite. Hydroxyapatite is a key material of human tooth and human bone. The human bone is made of hydroxyapatite oriented along the collagen. The micromachining of human bone is highly required for medicine. The medical issue is how to preserve the chemical property of the laser-ablated surface. By use of pulsewidth tunable femtosecond laser (50fs - 2ps, 1.5mJ, 1kpps), we compared the relative content of calcium and phosphorus. The relative content of calcium and phosphorus is kept unchanged before and after laser ablation. For these medical applications, the intense femtosecond laser delivery through optical fibers is required. It is theoretically shown that it is possible to deliver the 900 fs pulses of 0.1 mJ/pulse through a I m-long graded index fiber with a 200 mum core diameter if the fiber has the optimum refractive index profile. We therefore conclude that graded index multimode fibers give better spatial distributions of the output transverse mode than hollow fibers or step index multimode fibers, and can deliver larger pulse energy than single mode fibers.

关键词： hard tissue ablation tooth bone plastic surgery fiber delivery femtosecond laser

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New fiber lasers with temporal pulse shaping of nanosecond pulses for "Tailoring" flexible laser material processing

New fiber lasers with temporal pulse shaping of nanosecond p...

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conference on photon processing in microelectronics and photonics ii

作者： Stock, ML Endert, H Patel, R IMRA Amer Inc Ann Arbor MI 48105 USA

ISBN: (纸本)0819447773

Using an innovative approach based on Yb:fiber amplifiers and pre-shaped pulsed diode seeders, a unique laser source with tunable pulse duration and rectangular pulse shape has been developed. Based on the patented use of multimode, fibers with single-mode output, the resultant system provides pulses adjustable between 4 and 20 ns duration with sharp rise times of <1.5 ns, at a repetition rate of up to 20 kHz. The output pulse energy of >15 microJoules can be maintained over the full tuning range. The high-quality output beam is coupled into a polarization-maintaining, single-mode delivery fiber for ease of integration into an application. With this "tailorable" pulse design, control of laser energy deposition in very confined laser interaction zones (by pulse shape), and of its dosage (by pulse duration) can be optimized by the user and adjusted in real-time from the laser controller in response to measured structural changes. Results of machining of materials such as Si, Cr on glass and drilling of Cu/Pl/Cu are presented, showing the unique capability of this laser and its advantageous use to ablate, structure, repair, or trim very small areas (down to sub-micron size) without damaging or influencing the underlying and/or neighboring structures.

关键词： micromachining microfabrication short-pulsed lasers fiber lasers fiber amplifiers nanosecond lasers

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New developments in laser processing of silicon devices

New developments in laser processing of silicon devices

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conference on photon processing in microelectronics and photonics ii

作者： Dirscherl, M Esser, G Kaufmann, S Geiger, M Bayer Laserzentrum BLZ gGmbH D-91052 Erlangen Germany Univ Erlangen Nurnberg Chair Mfg Technol D-91058 Erlangen Germany

ISBN: (纸本)0819447773

Silicon is the standard material for the production of integrated circuits and one of the most important substrates for micro systems technology. It can be produced with an extraordinarily high purity, homogeneity and crystal Perfection. Today, laser processing of silicon is becoming increasingly more interesting. This can be partly attributed to the evolution of frequency-converted solid state lasers which emit visible or ultraviolet radiation that is readily absorbed by silicon. Another reason for the growing interest in laser processing of silicon devices is that conventional technologies are approaching their limits. Especially laser cutting of thin silicon wafers as an alternative to mechanical sawing represents a very promising option for industrial applications. This paper shows current research results on laser processing of silicon. Besides laser cutting and ablation with frequency-tripled Nd:YAG lasers and Ti:Sapphire femtosecond lasers, laser welding of silicon with millisecond pulses is a focus of the presented work. When welding Si, the brittle behaviour of the material usually leads to thermally induced cracks. These cracks do typically not occur when cutting with short and ultrashort pulsed lasers. A controlled heating of the work piece can prevent cracks during welding with millisecond pulses as well. Together with laser cutting and welding, laser adjustment of silicon components by ultrashort pulse ablation of pre-stressed layer systems, which is also described in this paper, is another promising approach for high precision manufacturing of silicon micro devices.

关键词： silicon laser welding laser cutting laser adjustment

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High brightness solid-state laser systems with fiber phase conjugate mirrors for micro material processing

High brightness solid-state laser systems with fiber phase c...

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conference on photon processing in microelectronics and photonics ii

作者： Riesbeck, T Eichler, HJ Risse, E Binder, A Ashkenasi, D Müller, G Tech Univ Berlin Inst Opt D-10623 Berlin Germany

ISBN: (纸本)0819447773

High beam quality is one of the most important properties for micro material processing with lasers. It facilitates slight focus diameters and due to high Raleigh length even at strong focusing drilling of holes with high aspect ratio. Together with high average output powers it allows fast processes with high quality. Another important point is the wavelength of the laser radiation. Many materials e.g. diamond or silicon show no sufficient absorption at fundamental wavelength of Nd based solid-state laser sources. Frequency conversation to the second and forth harmonic allows the efficient processing of these materials. At least flexible pulse peak power and repetition rate is necessary to optimize the process. Three laser systems which fulfill these requirements are investigated. A pulsed pumped Nd:YAP System which delivers an average output power of 315 W with M-2 = 2.6 at the fundamental wavelength and 124 W at the second harmonic. Another pulsed pumped System based on Nd:YAG with an average output power up to 125 W with M-2 = 2.2 at the fundamental wavelength, 49.5 W at the second harmonic and 4.75 W at 266 nm. Due to its active Q-switch the pulse peak power of this system is variable in a wide range. Furthermore-a continuously pumped amplifier arrangement with nearly diffraction limited output of 120 W average power has been Achieved at 10 kHz repetition rate.

关键词： solid state lasers beam quality phase conjugation optical fiber frequency conversation

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