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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

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3D-MID and process monitoring for micro joining applications

3D-MID and process monitoring for micro joining applications

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conference on photon processing in microelectronics and photonics ii

作者： Ostendorf, A Specker, W Stallmach, M Zeadan, J Laser Zentrum Hannover eV D-30419 Hannover Germany

ISBN: (纸本)0819447773

Nd:YAG solid-state lasers have been integrated in many seam welding applications. They provide a good ability of integration into existing manufacturing sequences and allow its easy automation. Appropriate process monitoring systems are needed to decrease necessary user intervention, to ensure a high machine availability and to realize a zero defect production. In the electronics industry, laser spot welding techniques using pulsed Nd:YAG-lasers have been established in mass production applications, for example in manufacturing of electron gun components for TV monitor tubes over the last 25 years. They require different strategies and methods for process monitoring systems [1]. Apart from these integrated laser spot welding applications, there is a current demand for new technologies to join micro components onto 3-dimensional (3-D) circuit substrates and to connect electrical plugs. In recent years, laser spot joining techniques have emerged as a viable option for packaging electrical and mechanical microparts, such as surface mounted devices (SMDs) and casings. Under most conditions, laser spot welding provides more durability as well as' thermal and mechanical stability compared to traditional packaging techniques, such as simultaneous soldering [2, 3]. Additionally, under less ideal conditions, the packaging quality can be inconsistent, resulting in the need for optimization and monitoring of the weld parameters under different conditions [4, 5]. In order to achieve a stable process during packaging of electrical components despite their weak absorption of laser radiation and different surface qualifies, a process monitoring system should be needed.

关键词： Signal processing Laser welding Metals Signal detection Laser processing Sensors Optical sensors Laser applications Packaging Pulsed laser operation

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Direct laser-assisted processing of polymers for micro-fluidic and micro-optical applications

Direct laser-assisted processing of polymers for micro-fluid...

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conference on photon processing in microelectronics and photonics ii

作者： Pfleging, W Böhm, J Finke, S Gaganidze, E Hanemann, T Heidinger, R Litfin, K Forschungszentrum Karlsruhe Mat Res Inst D-76021 Karlsruhe Germany

ISBN: (纸本)0819447773

In the microscopic world the need of functional prototypes increases, e.g. as a precondition for a mould insert fabrication for micro-injection moulding. In this work the direct fabrication of prototypes made from polymers with an accuracy down to the micrometer range will be presented. For this purpose the direct patterning or modification of polymers with UV-Iaser radiation is performed for applications in fluidic and micro-optics. Different UV laser sources such as excimer and frequency-multiplied Nd:YAG were used. In the case of complex designs for fluidic applications it is powerful to use Nd:YAG laser radiation as patterning tool because of their high laser repetition rates: CAD data from complex fluidic designs were transmitted directly via CAM module into the polymeric surface. Because of the very small laser pulse duration of about 400-500 ps the thermal-induced damage during ablation decreases significantly. Process parameters, ablation rates and attainable surface qualifies for capillary-electrophoreses chips will be presented. With the aid-of a motorised aperture or a rotating mask system, excimer laser radiation is used to enable a well defined patterning of grooves with sharp edges and smooth sidewalls. The direct ablation of polymethylmethacrylate (PMMA), as well as the laser induced modification of the polymeric chemistry is used for the preparation of passive integrated-optical waveguides. Two types of concepts of waveguides are discussed: 1. Laser patterned grooves are filled with index matched materials which leads either to an increase or a decrease of the refractive index relative to pure PMMA. 2. Localised laser-induced polymer modification leads immediately to an integrated waveguide with higher refractive index. Both types of waveguides-concepts are characterised by their optical properties, which will be discussed in detail.

关键词： excimer Nd : YAG rapid manufacturing polymer ablation polymer modification polymer waveguides refractive index variation micro fluidic micro optics

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Education of photonic methods of information processing

Education of photonic methods of information processing

引用

4th International conference on photonics, Devices and Systems

作者： Klíma, M Páta, P Kaiser, J Czech Tech Univ Dept Radioelectr Fac Elect Engn Prague 16627 6 Czech Republic

ISBN: (纸本)0819448370

The submitted paper is describes a relevant experience in an introduction of photonic information processing techniques into the curricula of MSc course subject Image processing and photonics and PhD course subject Selected Parts from photonics. The photonic information processing systems offer extensive computational power because of several advantages: the information carrier - photon - is the fastest one, massively parallel access and computation, some mathematical operations performed by physical effects (2D convolution, 2D Fourier transform).

关键词： Optical processors photonics education optical 2D correlation

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CAD/CAM software for an industrial laser manufacturing tool

CAD/CAM software for an industrial laser manufacturing tool

引用

PROCEEDINGS OF SPIE SPIE - The International Society for Optical Engineering: photon processing in microelectronics and photonics ii

作者： Böhlen, Ines Stassen Fieret, Jim Holmes, Andrew Lee, Kin Wei Exitech Ltd. Oxford Industrial Park Yarnton Oxford OX5 1QU United Kingdom Imp. Coll. of Sci. Technol. Med. Dept. of Elec. and Electron. Eng. Exhibition Road London SW7 2BT United Kingdom

A facility for rapid prototyping of MEMS devices is crucial for the development of novel miniaturised components in all sectors of high-tech industry, e.g. telecommunications, information technology, micro-optics and aerospace. To overcome the disadvantages of existing techniques in terms of cost and flexibility, a new approach has been taken to provide a tool for rapid prototyping and small-scale production: Complex CAD/CAM software has been developed that automatically generates the tool paths according to a CAD drawing of the MEMS device. As laser ablation is a much more complicated process than mechanical machining, for which such software has already been in use for many years, the generation of these tool paths relies not only on geometric considerations, but also on a sophisticated simulation module taking into account various material and laser parameters and micro-effects. The following laser machining options have been implemented: cutting, hole drilling, slot cutting, 2D area clearing, pocketing and 2 l/2D surface machining. Once the tool paths are available, a post processor translates this information into CNC commands that control a scanner head. This scanner head then guides the beam of a UV solid-state laser to machine the desired structure by direct laser ablation.

关键词： Microelectronic processing

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Laboratory practical work on optical data processing

Laboratory practical work on optical data processing

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4th International conference on photonics, Devices and Systems

作者： Melnikova, EA Tolstik, AL Belarusian State Univ Dept Laser Phys & Spect Minsk 220050 BELARUS

ISBN: (纸本)0819448370

A laboratory bench has been developed and a laboratory manual has been prepared for the practical course in optical data processing including the following laboratory exercises: "Spatial Filtering of Images", "Optical Bistability", "Intensity Self-Oscillations and Optical Chaos", "Logic Optical Elements". These laboratory exercises enable the students to study the analog and digital information conversion methods and the effects underlying them. The laboratory bench was created on the basis of the electrically controlled liquid-crystal elements and involved a computerized recording system for temporal and spatial characteristics of light beams.

关键词： optical data processing spatial filtering of images optical bistability intensity self-oscillations and optical chaos logic optical elements

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Efficient single-mode generation of degenerate 1550 nm entanglement in type-ii parametric downconversion

Efficient single-mode generation of degenerate 1550 nm entan...

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Trends in Optics and photonics Series: Quantum electronics and Laser Science (QELS)

作者： Ljunggren, Daniel Marsden, Philip Tengner, Maria Ghiu, Iulia Vellekoop, Ivo Karlsson, Anders Dept. Microelectronics Info. Technol Royal Institute of Technology Electrum 229 SE-164 40 Kista Sweden

ISBN: (纸本)1557527490

A common source for many quantum communication schemes is that of entangled photons which are most easily generated by the process of spontaneous parametric downconversion. There are many reports on how to increase the efficiency of this generation, however, there are fewer reports on how to efficiently launch these photon-pairs into single-mode fibers. This paper reports on the first experiment on a source based on type-ii parametric downconversion for beam-like creation of a pair of degenerate, entangled photons at 1550 nm produced in a 12 mm long BBO crystal.

关键词： Optical communication

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Digital autoradiography with a Medipix2 hybrid silicon pixel detector

Digital autoradiography with a Medipix2 hybrid silicon pixel...

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IEEE Symposium on Nuclear Science (NSS/MIC)

作者： G. Mettivier M.C. Montesi P. Russo Dipartimento di Scienze Fisiche Università di Napoli Federico II Napoli Italy Dipartimento di Scienze Fisiche INFN Università di Napoli Federico II Napoli Italy

A new digital imaging system for beta and gamma autoradiography has been realized. The technological advancement of this imaging system is represented by the second-generation Medipix2 chip (a single photon/particle counting chip), developed at CERN in the framework of the Medipix2 European collaboration, as a successor of the Medipix1 chip. Medipix2 is realized in 0.25 /spl mu/m CMOS technology; it has a sensitive area of 14/spl times/14 mm/sup 2/ and a pixel pitch of 55 /spl mu/m, it has been bump-bonded to a 300 /spl mu/m thick silicon pixel detector. A dedicated electronic interface and a complete image acquisition and processing software allow to operate this hybrid pixel detector for digital autoradiography with acquisition time as long as several days. In a preliminary test of this imaging system for digital autoradiography we obtained a detection threshold of 1600 electrons (equivalent to about 6 keV in Si), a noise of 10/sup -3/ cps/mm/sup 2/, a minimum detectable activity of 0.32 Bq in 14 h for /sup 3/H and 0.012 Bq in 10 h for /sup 14/C. A preliminary spatial resolution test for /sup 14/C gives a FWHM resolution of 30 /spl mu/m. Real time images of /sup 3/H, /sup 14/C, /sup 125/I autoradiographic microscales are also presented.

关键词： Silicon Detectors CMOS technology System testing Spatial resolution Digital images Optical imaging photonics Collaboration CMOS image sensors

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Physical and chemical aspects of laser-materials interactions relevant to laser processing

Physical and chemical aspects of laser-materials interaction...

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conference on photon processing in microelectronics and photonics

作者： Dickinson, JT Washington State Univ Dept Phys Surface Dynam Lab Pullman WA 99164 USA

ISBN: (纸本)081944376X

The use of lasers in packaging and materials processing is an increasingly attractive choice for high technology manufacturing. As we push for more demanding materials processing tasks and smaller dimensions, an understanding of the underlying physical and chemical aspects of problems becomes important. Here we discuss some of these issues relevant to materials processing.

关键词： Laser processing Absorption Polymers Laser applications Metals Materials processing Chemical lasers Electrons Packaging Silicon

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Laser material processing: An industrial view of packaging applications

Laser material processing: An industrial view of packaging a...

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conference on photon processing in microelectronics and photonics

作者： Brannon, J IBM Storage Technol Div San Jose CA 95193 USA

ISBN: (纸本)081944376X

In the past two decades, laser applications in the packaging of microelectronics and photonics have clearly made a mark in industrial processing. With the commercial availability of reliable UV and IR lasers, a wealth of techniques and methods have evolved: generation of vias, high resolution patterning of materials by etching and ablation, laser bonding and microwelding, stripping of insulation and cladding, deposition of conductors, creation of surface microstructures, cleaning of sensitive surfaces, and a variety of drilling, slicing, and dicing processes. The list goes on and on, and what new techniques may evolve is limited only by human ingenuity. In this presentation I will review several of these applications with particular emphasis on those that are industrially useful. Many interesting concepts in laser processing fill the pages of scientific and engineering journals, but few of these ideas are seriously considered for a manufacturing environment. In concluding this talk, I will attempt to answer just what makes an industrially successful laser process.

关键词： laser processing lasers microelectronics packaging material processing

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Overview and future prospects of the use of lasers for packaging by microelectronics and photonics industry in japan

Overview and future prospects of the use of lasers for packa...

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conference on photon processing in microelectronics and photonics

作者： Washio, K Kouta, H NEC Corp Ltd Control Syst Operat Unit Minato Ku Tokyo 1088001 Japan

ISBN: (纸本)081944376X

This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

关键词： packaging welding trimming drilling patterning marking annealing repairing photonic devices lasers

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