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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

共 185 条记录，以下是61-70 订阅

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Pulse duration and energy density influence on laser processing of metals with short and ultra-short pulses

Pulse duration and energy density influence on laser process...

引用

conference on photon processing in microelectronics and photonics IV

作者： Le Harzic, R Breitling, D Sommer, S Föhl, C Valette, S König, K Dausinger, F Audouard, E Univ Stuttgart IFSW D-70569 Stuttgart Germany

ISBN: (纸本)081945687X

Influence of pulse duration on microprocessing of Al is studied. Results show noticeable differences in terms of quality, burr height and remolten or recast matter into micromachined grooves at high fluence regime for 120fs and 4,5 ps pulse duration. At 120 fs experimental results of penetration depth are found to be 2 or 3 times higher than the theoretical optical penetration depth and is lowered to this value with increasing pulse duration. At high fluence regime up to 2 J/cm(2), ablation thresholds are found to be in the range 10 times higher than for the case of 1 J/cm(2). Penetration depths are higher by a factor 10 to 20 than the theoretical optical penetration depth. The ablation rate is nearly constant until 1 ps and then falls down to 2 times lower values and decreases regularly until 4,5 ps. This time is supposed to correspond to a critical pulse width between ultrashort and short regime.

关键词： laser femtosecond picosecond ablation pulse duration energy heat penetration thermal effects

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Pulsed laser processing of shallow micro-optical structures

Pulsed laser processing of shallow micro-optical structures

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conference on photon processing in microelectronics and photonics VI

作者： Pedder, J. E. A. Holmes, A. S. Oerlikon Opt UK Ltd Oxford Ind Estate Oxford OX5 1QU England Imperial Coll London EEE Dept London SW7 2AZ England

ISBN: (纸本)9780819465719

Pulsed UV laser machining is an established method for production of 2.5D and 3D features in a wide variety of materials. In addition to direct laser patterning by ablation, exposure of photoresist using pulsed lasers can eliminate the need for large area contact photomasks. Half-tone machining, either by ablation or exposure, allows the production of high quality shallow features where the surface roughness from other laser machining techniques would be unacceptable. Such features could be used as anti-reflection surfaces for mobile display devices. Features produced by lithography typically exhibit low surface roughness but have more complex fabrication processes. Here, the surface roughness of shallow features produced by half-tone lithography and half-tone ablation is investigated for a photoresist. Similar surface profiles are achieved for each technique and roughness levels are comparable for both.

关键词： Laser ablation Photomasks Surface roughness Photoresist materials Laser processing Lithography Excimer lasers Pulsed laser operation Calibration Ultraviolet radiation

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DPSSL for direct dicing and drilling of dielectrics

DPSSL for direct dicing and drilling of dielectrics

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conference on photon processing in microelectronics and photonics VI

作者： Ashkenasi, David Schwagmeier, M. Appl Laser Technol Laser & Med Technol GmbH Schwarzschild Str 8 D-12489 Berlin Germany

ISBN: (纸本)9780819465719

New strategies in laser micro processing of glasses and other optically transparent materials are being developed with increasing interest and intensity using diode pumped solid state laser (DPSSL) systems generating short or ultra-short pulses in the optical spectra at good beam quality. Utilizing non-linear absorption channels, it can be demonstrated that ns green (532 nm) laser light can scribe, dice, full body cut and drill (flat) borofloat and borosilicate glasses at good quality. Outside of the correct choice in laser parameters, an intelligent laser beam management plays an important role in successful micro processing of glass. This application characterizes a very interesting alternative where standard methods demonstrate severe limitations such as diamond dicing, CO2 laser treatment or water jet cutting, especially for certain type of optical materials and/or geometric conditions. Application near processing examples using different DPSSL systems generating ns pulsed light at 532 nm in TEM00 at average powers up to 10 W are presented and discussed in respect to potential applications in display technology, micro electronics and optics.

关键词： DPSSL micro processing dicing drilling cutting borofloat and borosilicate glasses

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Education of photonic methods of information processing

Education of photonic methods of information processing

引用

4th International conference on photonics, Devices and Systems

作者： Klíma, M Páta, P Kaiser, J Czech Tech Univ Dept Radioelectr Fac Elect Engn Prague 16627 6 Czech Republic

ISBN: (纸本)0819448370

The submitted paper is describes a relevant experience in an introduction of photonic information processing techniques into the curricula of MSc course subject Image processing and photonics and PhD course subject Selected Parts from photonics. The photonic information processing systems offer extensive computational power because of several advantages: the information carrier - photon - is the fastest one, massively parallel access and computation, some mathematical operations performed by physical effects (2D convolution, 2D Fourier transform).

关键词： Optical processors photonics education optical 2D correlation

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Generation of new nanomaterials by interfering femtosecond laser processing and its applications - art. no. 61060M

Generation of new nanomaterials by interfering femtosecond l...

引用

conference on photon processing in microelectronics and photonics V

作者： Nakata, Yoshiki Osaka Univ Inst Laser Engn Suita Osaka 5650871 Japan

ISBN: (纸本)0819461482

New nanomaterials such as nanobump, nanomesh, nanobelt were generated by thin film processing by interfering a transmission femtosecond laser beams. To split and correlate femtosecond laser, a demagnification optical system with beam splitter was used. Different interference patterns can be generated depending upon the number of beam, macrnification factor and period of the transmission gating. Using the system, a material surface can be processed according to the interference pattern. Metallic single- or multi-layered film was used as a target. A nanobump array was applied to field emission device. In addition, periodic structure could be generated inside transparent material in a single process. This scheme is a new technique to generate new nanomaterials and nanostructures using top-down technique.

关键词： femtosecond laser laser ablation interference thin film nanobump nanobelt nanomesh

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Ultra-fast laser-induced processing of materials: fundamentals and applications in micromachining

Ultra-fast laser-induced processing of materials: fundamenta...

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conference on photon processing in microelectronics and photonics

作者： Choi, TY Chimmalgi, A Grigoropoulos, CP Univ Calif Berkeley Dept Mech Engn Berkeley CA 94720 USA

ISBN: (纸本)081944376X

Fundamental questions arise regarding the possibility and nature of melting and die ensuing mechanism of ablation in femtosecond laser processing of materials. A comprehensive experimental study is presented to address these issues in depth and detail. The mechanisms of ultra-fast (femtosecond) laser-induced phase-transformations during the laser interactions with materials have been investigated by time-resolved pump-and-probe imaging in both vacuum and ambient environment. The temporal delay between the pump and probe pulses is set by a precision translation stage up to about 500 ps and then extended to the nanosecond regime by an optical fiber assembly. Ejection of material in the form of nanoparticles is observed at several picoseconds after the main (pump) pulse. The ignition of surface-initiated plasma into the ambient air immediately following the pump pulse and the ejection of ablated material in the picosecond and nanosecond time scales have been probed by high-resolution, ultra-fast shadowgraphy. To further dissect the origin and evolution of the ablation process, a double pulse experiment has been implemented, whereby both the pump and probe pulses are split into two components each separated by variable temporal delays. A diffractive optical element is used to fabricate micro-channels in silicon wafers.

关键词： femtosecond laser ablation pump-and-probe double beam diffractive optical element

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Femtosecond laser lithography and applications

Femtosecond laser lithography and applications

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conference on photon processing in microelectronics and photonics V

作者： Chichkov, B. N. Fadeeva, E. Koch, J. Ostendorf, A. Ovslanikov, A. Passinger, S. Reinhardt, C. Laser Zentrum Hannover eV Hollerithallee 8 D-30419 Hannover Germany

ISBN: (纸本)0819461482

Rapid progress in ultrafast laser systems opened many exciting possibilities for high-resolution material processing. These laser systems allow to control and deliver optical energy and laser Pulses in time and space with unprecedented precision. It is not surprising that these high-quality optical pulses have revolutionized microfabrication technologies. Femtosecond lasers enabled processing of a wide range of materials (including heat sensitive and thermo-reactive) with a sub-micrometer resolution. At present, nearly arbitrary shaped 2D and 3D structures can be produced by direct write photofabrication techniques using femtosecond laser pulses. In this paper we present a brief review of our recent progress in femtosecond (maskless, direct-write, nonlinear) laser lithography and 3D photofabrication technique.

关键词： laser lithography ultrashort laser pulses material processing

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A neuro-fuzzy approach to failure detection and diagnosis of Excimer laser ablation in microvia formation

A neuro-fuzzy approach to failure detection and diagnosis of...

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conference on photon processing in microelectronics and photonics V

作者： Setia, Ronald May, Gary S. Georgia Inst Technol Sch Elect & Comp Engn Atlanta GA 30332 USA

ISBN: (纸本)0819461482

Excimer laser ablation is used for microvia formation in the microelectronics packaging industry. With continuing advancement of laser systems, there is an increasing need to offset capital equipment investment and lower equipment downtime. This paper presents a neuro-fuzzy methodology for in-line failure detection and diagnosis of the excimer laser ablation process. Response data originating directly from laser tool sensors and the characterization of microvias were used as failure symptoms for potential deviations in four laser system parameters from their corresponding baseline values. The response characteristics consist of via diameter, via wall angle, and via resistance. Resistance measurements on copper deposited in the ablated vias were performed to characterize the degree to which debris remaining inside the vias affected quality. The laser system parameters include laser fluence, shot frequency, number Of pulses, and helium pressure flow. The adaptive neuro-fuzzy inference system (ANFIS) was trained and Subsequently validated for its capability in evidential reasoning using the data collected. Results indicated only a single false alarm occurred in 19 possible failure detection scenarios. In failure diagnosis, a single false alarm and a single missed alarm Occurred.

关键词： excimer laser failure detection and diagnosis microelectronics packaging inicrovia neuro-fuzzy

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Laser-induced modification of the optical properties of transparent materials

Laser-induced modification of the optical properties of tran...

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conference on photon processing in microelectronics and photonics iiI

作者： Ashkenasi, D Ghaleh, KJ Hoffmann, HJ Laser & Med Technol GmbH Dept Appl Laser Technol Berlin Germany

ISBN: (纸本)0819452475

A new field in laser processing is opened by a laser-induced modification of the optical properties, i.e. the refractive index, absorption- and scattering-coefficient, inside transparent materials, preferentially optical glasses. Ultra short laser pulses are capable of inducing these modifications without cracking or even melting the glass matrix. The femtosecond and in some cases even picosecond laser technology allows to control and modify the optical properties in the bulk on a sub-mum scale. This is referred to as nik-engineering(TM), relating the experimental technique to changes of the complex refractive index (n + ik). Three dimensional patterns of the (n + ik) modifications can be achieved in the subsurface region on a microscopic scale. The technical potential for optical applications is challenging and on the verge to be exploited. New results on nik-engineering using ultra-short laser pulses at a wavelength of 800 nm was investigated for special glasses with semi-conductive nano-particles, i.e. photo-chromic and GG/RG filter glasses. This paper discusses the laser-induced optical modification inside these glasses for different laser fluence and shot numbers, addressing also the possible technological relevance of these effects in respect to decorative work, micro-tagging, and other functional structures.

关键词： laser processing nik-engineeringTM sun-surface modification damage threshold ultra short laser pulses photo-chromic glass GG/RG filter glass

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Versatile light-control schemes based on diffractive optics for laser drilling, cutting and joining technologies for microelectronic and micromechanical components and devices

Versatile light-control schemes based on diffractive optics ...

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conference on photon processing in microelectronics and photonics iiI

作者： Amako, J Shimoda, T Umetsu, K Seiko Epson Corp Technol Platform Res Ctr Nagano 3990293 Japan

ISBN: (纸本)0819452475

Indispensable in laser-processing applications is an accurate and efficient delivery of light energy to process points. For mass production, multi-beam parallel processing is a must to gain high throughput. Diffractive optics is a competitive and cost-effective solution to achieve these goals. A diffractive optical element (DOE) is able to offer various light-control functions such as focusing, splitting and shaping according to the user's requests. These elements can be utilized in a compact and convenient optical system. Thus laser-processing technologies using diffractive optics can be easily brought into manufacturing settings. We present four laser-based processes, each of which adopts diffractive optics in a distinctive way. They are 1) laser drilling of silicon wafers using a diffractive array illuminator to form microcavities for inkjet printers, 2) laser cutting of metal films using a diffractive focusator to produce liquid-crystal display panels for mobile phones, 3) laser soldering of quartz oscillators using a diffractive beam duplicator onto printed circuits set in wristwatches, and 4) laser sealing of packages using diffraction patterns to house electronic components therein. Some of these processes are at work routinely in our manufacturing plants.

关键词： laser processing diffractive optics beam control wavefront modulation

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