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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

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Wrap-free phase retrieval using a series of intensity measurements produced by tuning the illumination wavelength

Wrap-free phase retrieval using a series of intensity measur...

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conference on Optical Micro- and Nanometrology in Microsystems Technology ii

作者： Bao, Peng Zhang, Fucai Pedrini, Giancarlo Osten, Wolfgang Univ Stuttgart Inst Tech Opt D-70569 Stuttgart Germany

ISBN: (纸本)9780819471932

In this paper, we present a phase retrieval method where a sequence of diffraction speckle intensities, recorded by tuning the illumination wavelength, is used. These recordings, combined with an iterative calculation method, allow the reconstruction of the amplitude and the phase of the wavefront. The main advantages of this method are: simple optical setup and high immunity to noise and environmental disturbance, since no reference beam or additional moving parts are needed. Furthermore, this method allows for an extended wrap-free phase measurement range by using synthetic wavelengths. The technique shows great potential in some fields of micro-metrology, such as lensless phase contrast imaging and wavefront sensing.

关键词： phase retrieval digital holography image processing

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Benchmarking Performance and Physical Limits on processing Electronic Device and Systems: Solid-State, Molecular and Natural processing Paradigms

Benchmarking Performance and Physical Limits on Processing E...

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Nanotechnology conference and Trade Show (Nanotech 2008)

作者： Lyshevski, Sergey Edward Shmerko, Vlad P. Yanushkevich, Svetlana N. Rochester Inst Technol Dept Elect Engn Rochester NY 14623 USA

ISBN: (纸本)9781420085051

This paper examines the physical and technological limits imposed on processing devices which predefine hardware and software solutions. We study various constraints which are imposed. The emerging molecular processing paradigm promises one to ensure benchmarking overall performance in data processing. The soundness of fluidic and solid solutions is studied. We discuss the use of basic physics, implication of the Heisenberg uncertainty principle, as well as technologies which ultimately may affect various approaches. Natural and engineered molecular processing solutions are profoundly different. In general, the comparison cannot be made because natural processing is not comprehended at the device and system levels. The information processing, performed by natural systems, is a frontier for multidisciplinary research. Therefore, we concentrate on data processing accomplished by engineered molecular primitives and platforms. This molecular solution is fundamentally different when compared to solid-state microelectronics due to distinct device physics, system organization, technology, software, etc. The case-studies are reported.

关键词： electronic device physical limits processing

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Holographic femtosecond laser processing by use of a spatial light modulator

Holographic femtosecond laser processing by use of a spatial...

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conference on photon processing in microelectronics and photonics VI

作者： Hasegawa, Satoshi Hayasaki, Yoshio Univ Tokushima Fac Engn Dept Opt Sci & Tech 2-1 Minamijosanjima-cho Tokushima 7708506 Japan

ISBN: (纸本)9780819465719

Parallel femtosecond laser processing using a hologram displayed on a spatial light modulator is demonstrated. The use of a spatial light modulator enables to perform an arbitrary and variable patterning. The hologram is multiplexed phase Fresnel lenses (MPFL) is demonstrated. The MPFL has the features of an independent tunablity and three-dimensional parallelism of the diffraction peaks with low computational costs. The MPFL is optimized by changing the center phase and size of each phase Fresnel lens while taking account of the intensity distribution of the irradiated laser pulse and the spatial frequency response of the spatial light modulator. Two-dimensional and three-dimensional parallel processing of glass are demonstrate and the processing performance is analyzed.

关键词： computer-generated hologram laser processing diffractive optical elements

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Pulsed laser processing of shallow micro-optical structures

Pulsed laser processing of shallow micro-optical structures

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conference on photon processing in microelectronics and photonics VI

作者： Pedder, J. E. A. Holmes, A. S. Oerlikon Opt UK Ltd Oxford Ind Estate Oxford OX5 1QU England Imperial Coll London EEE Dept London SW7 2AZ England

ISBN: (纸本)9780819465719

Pulsed UV laser machining is an established method for production of 2.5D and 3D features in a wide variety of materials. In addition to direct laser patterning by ablation, exposure of photoresist using pulsed lasers can eliminate the need for large area contact photomasks. Half-tone machining, either by ablation or exposure, allows the production of high quality shallow features where the surface roughness from other laser machining techniques would be unacceptable. Such features could be used as anti-reflection surfaces for mobile display devices. Features produced by lithography typically exhibit low surface roughness but have more complex fabrication processes. Here, the surface roughness of shallow features produced by half-tone lithography and half-tone ablation is investigated for a photoresist. Similar surface profiles are achieved for each technique and roughness levels are comparable for both.

关键词： Laser ablation Photomasks Surface roughness Photoresist materials Laser processing Lithography Excimer lasers Pulsed laser operation Calibration Ultraviolet radiation

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DPSSL for direct dicing and drilling of dielectrics

DPSSL for direct dicing and drilling of dielectrics

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conference on photon processing in microelectronics and photonics VI

作者： Ashkenasi, David Schwagmeier, M. Appl Laser Technol Laser & Med Technol GmbH Schwarzschild Str 8 D-12489 Berlin Germany

ISBN: (纸本)9780819465719

New strategies in laser micro processing of glasses and other optically transparent materials are being developed with increasing interest and intensity using diode pumped solid state laser (DPSSL) systems generating short or ultra-short pulses in the optical spectra at good beam quality. Utilizing non-linear absorption channels, it can be demonstrated that ns green (532 nm) laser light can scribe, dice, full body cut and drill (flat) borofloat and borosilicate glasses at good quality. Outside of the correct choice in laser parameters, an intelligent laser beam management plays an important role in successful micro processing of glass. This application characterizes a very interesting alternative where standard methods demonstrate severe limitations such as diamond dicing, CO2 laser treatment or water jet cutting, especially for certain type of optical materials and/or geometric conditions. Application near processing examples using different DPSSL systems generating ns pulsed light at 532 nm in TEM00 at average powers up to 10 W are presented and discussed in respect to potential applications in display technology, micro electronics and optics.

关键词： DPSSL micro processing dicing drilling cutting borofloat and borosilicate glasses

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Assembly and integration of thin bare die using laser direct-write

Assembly and integration of thin bare die using laser direct...

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conference on photon processing in microelectronics and photonics VI

作者： Pique, Alberto Charipar, Nicholas A. Auyeung, Ray C. Y. Kim, Heungsoo Mathews, Scott A. Naval Res Lab 4555 Overlook AveSW Washington DC 20375 USA

ISBN: (纸本)9780819465719

Laser-based direct-write (LDW) processes offer unique advantages for the transfer of unpackaged semiconductor bare die for microelectronics assembly applications. Using LDW it is possible to release individual devices from a carrier substrate and transfer them inside a pocket or recess in a receiving substrate using a single UV laser pulse, thus performing the same function as pick-and-place machines currently employed in microelectronics assembly. However, conventional pick-and-place systems have difficulty handling small (< 1 mm(2)) and thin (< 100 mu m) components. At the Naval Research Laboratory, we have demonstrated the laser release and transfer of intact 1 mm(2) wafers with thicknesses down to 10 microns and with high placement accuracy using LDW techniques. Furthermore, given the gentle nature of the laser forward transfer process it is possible to transfer semiconductor bare die of sizes ranging from 0.5 to 10 mm(2) without causing any damage to their circuits. Once the devices have been transferred, the same LDW system can then be used to print the metal patterns required to interconnect each device. The implementation of this technique is ideally suited for the assembly of microelectronic components and systems while allowing the overall circuit design and layout to be easily modified or adapted to any specific application or form factor including 3-D architectures. This paper describes how the LDW process can be used as an effective laser die transfer tool and will present analysis of the laser-driven release process as applied to various types of silicon bare dies.

关键词： laser direct-write laser-induced forward-transfer laser die transfer laser-assisted microelectronics assembly laser embedding

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Lithographyfree high resolution inkjet printed OFET (organic field effect transistor) fabrication on polymer by laser processing

Lithographyfree high resolution inkjet printed OFET (organic...

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conference on photon processing in microelectronics and photonics VI

作者： Ko, Seung Hwan Pan, Heng Grigoropoulos, Costas P. Poulikakos, Dimos Univ Calif Berkeley Dept Mech Engn Laser Thermal Lab Berkeley CA 94720 USA

ISBN: (纸本)9780819465719

The low temperature fabrication of OFET (organic field effect transistor) on the flexible polymer substrate is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print gold nano-particles suspended in Alpha-Terpineol solvent, PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent, semiconductor polymer (modified polythiophene) in dichlorobenzene (o-DCB) solution to fabricate OFET on flexible polymer substrates. Short pulsed laser ablation enabled finer electrical components to overcome the resolution limitation of inkjet deposition. Continuous Argon ion laser was irradiated locally to evaporate carrier solvent as well as to sinter gold nano-particles. In addition, a new selective ablation of multilayered gold nanoparticle film was demonstrated using the SPLA-DAT (selective pulsed laser ablation by differential ablation threshold) scheme for sintered and non-sintered gold nanoparticles. Finally, selective ablation of multilayered film was used to define narrow channel of a FET (field effect transistor) and semiconductor polymer solution was deposited on top of channel to complete OFET (organic field effect transistor) fabrication.

关键词： flexible electronics OFET (organic field effect transistor) nanoparticle inkjet printing laser ablation and sintering

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Excimer laser processing of novel materials for optoelectronic and spintronic applications

Excimer laser processing of novel materials for optoelectron...

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conference on photon processing in microelectronics and photonics VI

作者： Tabbal, Malek Aziz, Michael J. Madi, Charbel Charnvanichborikarn, Supakit Williams, James S. Christidis, Theodore C. Amer Univ Beirut Dept Phys Bliss St Beirut 1107 Lebanon

ISBN: (纸本)9780819465719

The interaction of the highly energetic pulsed excimer laser beam with a target material induces non-equilibrium physico-chemical processes which could be harnessed to synthesize a variety of novel and technologically attractive materials that are difficult to grow using more conventional thin film deposition techniques. In this paper, recent advances on two excimer laser based techniques that we have used in the processing of thin films and surfaces will be presented. First, we demonstrate the synthesis, by Pulsed Laser Melting (PLM), of silicon supersaturated with sulfur at concentrations several orders of magnitude greater than the solubility limit of silicon alloys, with strong sub-bandgap optical absorption. This material has potential applications in the fabrication of Si-based opto-electronic devices. Second, the capability of Remote Plasma Pulsed Laser Deposition (RP-PLD) in synthesizing the meta-stable half-metallic CrO2 compound that is of great interest in the field of spintronics was assessed. Infra-Red spectroscopy and Magnetic Force Microscopy indicate that the use of the remote plasma is beneficial to the formation of the CrO2 phase, at a deposition pressure of 30 mTorr and for deposition temperature below 350 degrees C. Atomic Force Microscopy and Magnetic Force Microscopy studies respectively show that films containing the CrO2 phase have significantly different surface topography and magnetic characteristics from those in which the Cr2O3 phase is dominant.

关键词： PLD PLM laser ablation laser annealing excimer laser chromium oxide black silicon sulfur doping

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Femtosecond laser-induced long-range self-organized periodic planar nanocracks for applications in biophotonics

Femtosecond laser-induced long-range self-organized periodic...

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conference on photon processing in microelectronics and photonics VI

作者： Simova, Eli Hnatovsky, Cyril Taylor, Rod S. Rayner, David M. Corkum, Paul B. Natl Res Council Canada Inst Microstruct Sci Ottawa ON K1A 0R6 Canada Natl Res Council Canada Steacie Inst Mol Sci 100 Sussex Dr Ottawa ON K1A 0R6 Canada

ISBN: (纸本)9780819465719

With the proper choice of laser parameters focused femtosecond laser light creates long-range self-assembled planar nanocracks inside and on the surface of fused silica glass. The orientation of the crack planes is normal to the laser polarization direction and can be precisely controlled. The arrays of cracks when properly oriented and combined with chemical etching produce high aspect ratio micro- and nanofluidic channels. Direct femtosecond laser writing without any chemical etching can be used to fabricate embedded nanoporous capillaries in bulk fused silica for biofiltering and electrophoresis applications. The morphology of the porous structures critically depends on the laser polarization and pulse energy and can be used to control the transmission rates of fluids through the capillaries. Finally high aspect ratio, polarization-dependent, self-ordered periodic nanoslots can be fabricated from nanocracks produced on the surface of fused silica wafers. Control of the surface slot width from 10 to 60 nm is achieved through selective chemical etching. This technique, which may be useful for Surface Enhanced Raman Scattering (SERS) applications, has sub-diffraction limited resolution and features high throughput writing over centimeters.

关键词： laser material processing laser micromachining lab-on-a-chip periodic nanostructures for SERS microfluidics nanoporous capillaries

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Structured beam shaping for precision laser dicing of multilayered substrates

Structured beam shaping for precision laser dicing of multil...

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conference on photon processing in microelectronics and photonics VI

作者： Lizotte, Todd Ohar, Orest Hitachi Via Mech USA Inc Emerging Technol Grp 4 Delta DrSuite 6 Londonderry NH 03053 USA

ISBN: (纸本)9780819465719

Laser dicing of wafer based devices;such as light emitting diodes (LEDs) is multifaceted since these devices are formed from various materials in a layered structure. Many of these layers include active device materials, passivation coatings, conductors and dielectric films all deposited on top of a bulk wafer substrate and all potentially having different ablation thresholds. These composite multi-layered structures require high finesse laser processes to ensure yields, high quality and low cost. Such processes have become very complex over the years as new devices become miniaturized, requiring smaller micro-machined features, greater precision and reduction of thermal stress to minimize substrate micro-cracking and maintain device integrity over its projected lifetime. Newer laser processes often involve the sequential use of single or multiple diode pumped solid state (DPSS) lasers, such as UV DPSS (355nn, 266nm), VIS DPSS (similar to 532nm) and IR DPSS (1064nm, 1070nm) as well as DPFL (Diode Pumped Fiber Lasers) lasers to penetrate various and differing material layers and substrates including SiC, Silicon and Sapphire. Development of beam shaping optics with the purpose of permitting two or more differing energy densities within a single focused or imaged beam spot would provide opportunities for pre-processing or pre-scribing of thinner cover layers, while following through with a higher energy density portion to cut through base substrates. This technique is also possible using multiple wavelengths simultaneously for micro-machining or dicing. Using multiple wavelengths offers advantages where high photon energies from such wavelengths as 266 ran can cause adverse effects to doped materials such as silicon or to active device layers such as GaN or other iiI-V materials deposited on the substrate surface. This paper will describe the development of variable intensity beam shaping optical elements targeting micromachining, dicing and patterning of delicate thi

关键词： Beam shaping Optical design Semiconductor lasers Diode pumped solid state lasers Micromachining Optical components Computer generated holography Fiber lasers Laser processing Silicon carbide

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