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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics II"

共 185 条记录，以下是81-90 订阅

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New laser patterning technology with dynamic focus control for 3-D MIDs

New laser patterning technology with dynamic focus control f...

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conference on photon processing in microelectronics and photonics IV

作者： Suzuki, T Shindo, T Yuasa, S Matsushita Elect Works Ltd Adv Technol Fus Lab Kadoma Osaka 5718686 Japan

ISBN: (纸本)081945687X

We have developed an original laser structuring process for MIDs in harmony with laser patterning technology recently displaying remarkable technical innovation.. For creating MID products, conventional patterning technology is unable to meet the requirements for complicated three-dimensional shapes, finer circuits and higher accuracy because of involving the following problems. 1) It is difficult to execute highly accurate and fine circuit patterning on surfaces at a 900 angle with level difference of 4mm or over. 2) It is difficult to assure the quality on surfaces such as sloped surfaces where the workability is varied. 3) The productivity is lowered due to fine circuit patterning. We have solved the above problems through dynamic control of laser structuring parameters, using a dynamic focusing system, and it has enabled the following improvements. 1) Successive laser patterning on surfaces with level difference of 10mm. 2) Fine circuit (track/gap = 30 mu m/30 mu m) patterning in same circuit on surfaces at a 90 degrees angle. 3) Quality assurance and productivity improvement by structuring parameters best for patterning.

关键词： Optical lithography Laser applications Laser processing Beam controllers Control systems Laser development Copper Dynamical systems Laser systems engineering Plating

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Nano/femto-second laser based nano structuring of ultra thin films

Nano/femto-second laser based nano structuring of ultra thin...

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conference on photon processing in microelectronics and photonics iiI

作者： Chimmalgi, A Grigoropoulos, CP Univ Calif Berkeley Dept Mech Engn Berkeley CA 94720 USA

ISBN: (纸本)0819452475

Nanofabrication, at lateral resolutions beyond the capability of conventional optical lithography techniques, is demonstrated here. Various nanofeatures (nanogrids, nanocraters, nanocurves) were machined, with high spatial resolution (similar to10-12nm), on thin metallic and semiconductor films by utilizing the enhanced field that exists underneath a scanning microscope tip irradiated with a laser beam. For the first time in the published literature, recrystallization results of thin a-Si films, at the nano-scale, are being presented to demonstrate the utility of this machining scheme as an effective 'nano'- laser source. Attempting to understand the modification mechanism and the physics involved, numerical simulation studies were performed to evaluate the field enhancement underneath the tip and the 'femtosecond laser - thin film' interaction dynamics in general. For the former study Finite Difference Time Domain simulation was carried out to evaluate the spatial distribution of the field intensity in the near field of the SPM probe tip. The later study employed finite-difference numerical method to solve the hyperbolic two-temperature scheme used to model the interaction. Possible applications of thin film structuring and its use as a mask may be in the areas of high-resolution nanolithography, nanofluidics, controlled nanodeposition, ultra high-density data storage, nanoelectronics, nanophotonics and various nanobiotechnology related applications.

关键词： nanostructuring scanning probe microscope femtosecond laser field enhancement thin film processing

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Cell-by-cell construction of living tissue

Cell-by-cell construction of living tissue

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conference on photon processing in microelectronics and photonics

作者： Ringeisen, BR Kim, HS Young, HD Spargo, BJ Auyeung, RCY Pique, A Chrisey, D USN Res Lab Washington DC 20375 USA

ISBN: (纸本)081944376X

This paper outlines investigations into a potentially revolutionary approach to tissue engineering. Tissue is a complex three-dimensional structure that contains many different biomaterials such as cells, proteins, and extracellular matrix molecules that are ordered in a very precise way to serve specific functions. In order to replicate such complex structure, it is necessary to have a tool that could deposit all these materials in an accurate and controlled fashion. Most methods to fabricate living three-dimensional structures involve techniques to engineer biocompatible and biodegradable scaffolding, which is then seeded with living cells to form tissue. This scaffolding gives the tissue needed support, but the resulting tissue inherently has no microscopic cellular structure because cells are injected into the scaffolding where they adhere at random. We have developed a novel technique that actually engineers tissue, not scaffolding, that includes the mesoscopic cellular structure inherent in natural tissues. This approach uses a laser-based rapid prototyping system known as matrix assisted pulsed laser evaporation direct write (MAPLE DW) to construct living tissue cell-by-cell. This manuscript details our efforts to rapidly and reproducibly fabricate complex 2D and 3D tissue structures with MAPLE-DW by placing different cells and biomaterials accurately and adherently on the mesoscopic scale.

关键词： tissue engineering direct write technology MAPLE DW cell Patterning protein microarray laser processing laser-tissue interaction

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HELIOS: photonics ELectronics functional Integration on CMOS

HELIOS: pHotonics ELectronics functional Integration on CMOS

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conference on Silicon photonics and photonic Integrated Circuits ii

作者： Fedeli, Jean-Marc Fulbert, Laurent Van Thourhout, Dries Viktorovitch, Pierre O'Connor, Ian Duan, Guang-Hua Reed, Graham Della Corte, Francesco Vivien, Laurent Lopez Royo, Francisco Pavesi, Lorenzo Garrido, Blas Grard, Emmanuel Tillack, Bernd Zimmermann, Lars Formont, Stephane Hakansson, Andreas Wachmann, Ewald Zimmermann, Horst Bakker, Arjen Porte, Henri CEA Grenoble CEA LETI 17 Rue Martyrs F-38054 Grenoble 9 France Univ Ghent IMEC Photon Res Grp B-9000 Ghent Belgium INL UMR 5270 Ecully France Alcatel Thales IIIV Lab Route Nozay F-91460 Marcoussis France Univ Surrey Guildford GU2 7XH Surrey England Mediterranea Univ DIMET I-89126 Reggio Di Calabria Italy Univ Paris CNRS Inst Elect Fondamentable F-91405 Orsay France Univ Politecn Valencia E-46022 Valencia Spain Univ Trent Dept Phys Nanosci Lab I-38100 Trento Italy Univ Barcelona Dept Elect E-08028 Barcelona Spain 3S Photon Route Nozay A1 F-91460 Marcoussis France IHP D-15236 Frankfurt Germany Tech Univ Berlin HFT 4 D-10587 Berlin Germany Ctr Charles Nungesser THALES Aerosp Div F-7852 Elancourt France DAS Photon SL E-46022 Valencia Spain Austriamicrosyst AG Graz Austria Vienna Univ Technol Inst Electrodynm Microwave & Circuit Engn A-1040 Vienna Austria Phoenix BV NL-7500 AE Enschede Netherlands PhorlinTechnol F-25000 Besancon France

ISBN: (纸本)9780819481924

Silicon photonics have generated an increasing interest in the recent year, mainly for optical telecommunications or for optical interconnects in microelectronic circuits. The rationale of silicon photonics is the reduction of the cost of photonic systems through the integration of photonic components and an IC on a common chip, or in the longer term, the enhancement of IC performance with the introduction of optics inside a high performance chip. In order to build a Opto-Electronic Integrated circuit (OEIC), a large European project HELIOS has been launched two years ago. The objective is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics fabrication processes. High performance generic building blocks that can be used for a broad range of applications are developed such as WDM sources by iiI-V/Si heterogeneous integration, fast Si modulators and Ge or InGaAs detectors, Si passive circuits and specific packaging. Different scenari for integrating photonic with an electronic chip and the recent advances on the building blocks of the Helios project are presented.

关键词： photonics Silicon Waveguides Electronics Semiconducting wafers Silicon photonics microelectronics Germanium Modulators Polarization

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TEM investigations of thermal effects on material structure induced by femtosecond and nanosecond laser processing

TEM investigations of thermal effects on material structure ...

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conference on photon processing in microelectronics and photonics

作者： Le Harzic, R Valette, S Huot, N Audouard, E Baubeau, E Jonin, C Laporte, P Univ St Etienne Lab Traitement Signal & Instrumentat UMR 5516 CNRS F-42023 St Etienne Du Rouvray 2 France

ISBN: (纸本)081944376X

Holes drilled in Aluminum using nanosecond and femtosecond laser pulses are characterized by Transmission Electronic Microscopy (TEM). Hence we present a method for quantifying the dimensions of the heat affected zone (HAZ) surrounding micro-holes by analyzing the grain size evolution. Drilled samples investigations are performed after electrolytic thinning down to 100 nm. The experiments require a real time imaging system to shot close to the located thinner zone with an accuracy in the mum range. Thin Al samples are drilled both in nanosecond and femtosecond regimes using the same pulse number and the same Ti-Sapphire laser source (1 kHz, 800 nm). The regeneratively amplified ultra-short pulses (150 fs) are utilized at a low fluence regime (typically 0.01-0.5 mJ/pulse), while the longer pulses (ns) are obtained from the regenerative amplifier without oscillator seeding (0.5 mJ,tausimilar to7-8 ns). The main conclusion is that a 40 mum wide HAZ is induced by nanosecond pulses, whereas the femtosecond regime does not produce any TEM observable HAZ. It has to be noticed that the width of the femtosecond HAZ is roughly less than 2 mum, which is our observation limit.

关键词： femtosecond micromachining microcutting non thermal interaction HAZ TEM

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Crack-free laser processing of glass substrate and its mechanisms

Crack-free laser processing of glass substrate and its mecha...

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conference on photon processing in microelectronics and photonics

作者： Hong, MH Sugioka, K Wu, DJ Wong, LL Lu, YF Midorikawa, K Chong, TC Data Storage Inst Laser Microporc Grp Singapore 117608 Singapore

ISBN: (纸本)081944376X

Laser-induced-plasma-assisted ablation (LIPAA) for crack-free laser processing of glass substrate is investigated. Different from laser breakdown at high laser fluence, a pulsed green laser is used to achieve the glass processing in air at much lower laser fluence. Laser beam goes through the substrate first and then irradiates on a solid target behind. For laser fluence above target ablation threshold, plasma generated from target ablation flies forward at a high speed. At a small target-to-substrate distance, there are strong interactions among laser light, target plasma and glass substrate at its rear side surface. With the target materials deposition on the glass surface or even doping into the glass substrate, light absorption characteristic at the rear side surface is modified. The laser processing result is closely related to target-to-substrate distance, laser scanning speed and its repetition rate. Color marking, glass metallization and structuring can be achieved with the fine tune of the laser processing parameters.

关键词： LIPAA glass microfabrication non-crack and color marking

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Quantum cascade lasers tuned by amorphous As₂S₃ claddings

Quantum cascade lasers tuned by amorphous As<sub>2</sub>S<su...

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conference on photon processing in microelectronics and photonics IV

作者： Recht, DL Liu, ZJ Rahman, KR Gmachl, CF Arnold, CB Princeton Univ Princeton Inst Sci & Technol Mat Princeton NJ 08544 USA

ISBN: (纸本)081945687X

Quantum cascade lasers (QCLs) have become a key component in the development of optical approaches to sensing applications. Recent experiments have shown the ability to achieve second harmonic generation from these structures suggesting the possibility of achieving short wave-infrared output. However, in these cases the power of the non-linear mode is limited by its phase mismatch with the fundamental cavity mode. By modifying the effective index of the laser system through cladding, one may ameliorate the mismatch to increase power output. In this study, we develop a simple method for drop-coating arsenic sulfide (As2S3)glass on QCLs. The glass is processed by above band-gap illumination, which induces a change in the refractive index resulting in a shift of the output mode of the laser. We observe the effective index to change by a factor 1.3 x 10(-4) after 20 minutes of illumination at 312 rim. for the fundamental wavelength of the QCL. Below band-gap irradiation, such as that occurring during device operation, is confirmed to have no effect on the material. Studies of the output of QCLs reveal for the first time mode shifting of the spectra as a result of optical modification to a cladding layer.

关键词： chalcogenide glass quantum cascade laser QCL laser processing arsenic sulfide second harmonic generation

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Viscous drag force effect on transportation of sub-micron particle contaminants during dry and steam laser cleaning

Viscous drag force effect on transportation of sub-micron pa...

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conference on photon processing in microelectronics and photonics IV

作者： Kudryashov, SI Allen, SD Arkansas State Univ Dept Chem & Phys Jonesboro AR 72467 USA

ISBN: (纸本)081945687X

Viscous air drag and diffusive Brownian motion result in unfavorable re-deposition of sub-micron spherical particle contaminants after their dry laser-assisted detachment from critical surfaces. Theoretical modeling and experimental results on particle transportation in air and thin variable liquid layers point out particle size and lift-off velocity as the most important parameters for efficient particle removal from critical substrates, while for smaller particles with lower inertia, lower lift-off distances and higher diffusion rates dry laser cleaning is less effective due to their fast diffusive redeposition back on these substrates. Under these circumstances one excellent option is the steam laser cleaning technique, when contaminating particles lift-off together with explosively boiling pre-deposited layer or separate micronsized droplets of a low-boiling liquid energy transfer medium and travel in the hydro- and gas-dynamic flow produced to much higher distances from the substrate irrespectively on particle size. Mechanical coupling of particles to the lifting-off liquid layer or separate droplets occurs via the known "inertial" mechanism and/or new mechanism of "dragging" contaminating particles off the substrate by the liquid environment, demonstrated for the first time in this work. Nearly 100% cleaning efficiencies and no any indication of re-deposition were observed for different particles in single-shot steam laser cleaning experiments.

关键词： microelectronics critical surfaces nano- and micro-contaminants dry and steam laser cleaning

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F₂-laser micro-welding of optical fibers and glass substrates

F<sub>2</sub>-laser micro-welding of optical fibers and glas...

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conference on photon processing in microelectronics and photonics IV

作者： Ho, S Aitchison, JS Herman, PR Univ Toronto Dept Elect & Comp Engn Toronto ON M5S 3G4 Canada

ISBN: (纸本)081945687X

Laser welding of optical glasses remains a challenging area today because of the weak optical absorption typically available with most commercial lasers and the brittle nature of glass. In this paper, we demonstrate for the first time to our best knowledge, the laser welding of telecommunication optical fiber onto a fused silica substrate. The 157-nm F-2 laser was selected for the wide processing window. that drives strong absorption at high fluence exposure > 1 J/cm(2) without inducing microcrack formation. The method of second surface ablation was applied to the contact point between the glass plate and glass fiber to locally heat, melt, and reflow the glass and thereby weld together the two similar glasses. Mechanical pressure was applied while the laser beam was scanned along the sample contact to produce a line of overlapping welds of 25-mu m spot size each. Fused silica samples of up to several hundreds of microns thick could be welded owing to a large 157-nm penetration depth of 1/alpha approximate to 1 mm. A narrow 3.31 to 3.66 J/cm(2) fluence window was found for laser welding through 160-mu m thick fused silica substrates. The F-2-laser welding window is constrained by the need for sufficient transmitted fluence to melt the interface without too much fluence that will damaged the interface structure at the onset of ablation or induce front surface ablation.

关键词： glass welding laser micromachining photonics packaging laser welding F-2 laser

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Measurement techniques for laser parameters relevant to materials processing

Measurement techniques for laser parameters relevant to mate...

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conference on photon processing in microelectronics and photonics IV

作者： Arbore, MA Balsley, D Morehead, J Adams, F Wiechmann, W Kmetec, J Zhou, YD Grossman, WM Lightwave Elect Corp Mountain View CA 94043 USA

ISBN: (纸本)081945687X

Many micromachining operations, particularly in the electronics sector, utilize pulsed solid-state UV lasers. These processes demand high levels of stability, as the yield and quality relate directly to the repeatability of each laser pulse. Critical stability issues arise with single-pulse processes (e.g. repair), situations requiring bursts of pulses (e.g. drilling), and continuous pulsing applications (e.g. cutting). To realize optimal stability specific design choices must be made, certain transient problems must be solved, and pulse energy measurements must be standardized. Solid-state UV lasers originate as infrared lasers, and nonlinear optics converts the infrared to the UV. This conversion introduces instability. Performing the conversion within the infrared laser cavity suppresses the instability, relative to performing the conversion outside of the laser cavity. We explain this phenomenon. Ideally, a versatile and stable solid-state laser can generate pulses in many formats. Thermal effects tend to prevent this versatile ideal, resulting in transient problems (unstable pulse trains), or less than optimal performance when the laser is pulsing continuously. Many methods of measuring pulse energy exist. Each method can produce surprisingly different results. We compare various techniques, discuss their limitations, and suggest an easily implemented pulse energy stability measurement.

关键词： solid-state diode-pumped materials processing ultraviolet micromachining measurement stability harmonic generation intracavity harmonic generation

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