This paper presents an overview of our study on the subject that we categorically termed "vLSI (very large scale integration) microphotonics". We examine the scientific and technological issues and challenge...
详细信息
ISBN:
(纸本)0819443913
This paper presents an overview of our study on the subject that we categorically termed "vLSI (very large scale integration) microphotonics". We examine the scientific and technological issues and challenges concerning three essential steps in this technology: miniaturization, interconnection, and integration of microphotonic devices, circuits and systems in micron or submicron scale. In miniaturization, the issues on the size effect, proximity effect, energy confinement effect, microcavitiy effect, single photon effect, optical interference effect, high field effect, nonlinear effect, noise effect, quantum optical effect, and chaotic noise effect should be addressed. In interconnection, the issues of connecting identical devices (homogeneous interconnection) or non-identical devices (heterogeneous interconnection) have to be examined. Optical alignment between micron-scale devices, minimizing interconnection losses, and maintaining optical modes between devices, are to be considered. In integration, the issues of interfacing same kind of devices, two different kinds of devices, and several or many different kinds of devices have to be addressed. Other issues include the design and packaging of the integrated devices and circuits as a system for reliable function and operation. In the course of this study, we closely follow the experiences of "vLSI microelectronics" so that they can provide lessons, learnings, and insights that microphotonics can benefit from. Similarities, dissimilarities, advantages, and disadvantages of the two technologies are explored in such a way that they can be more effectively utilized by mutual support and complement. Directions for future studies are also discussed.
This paper presents an overview of our study on the subject that is categorically termed >. microelectronics, as we define it here, is an area of scientific and technological study concerning the miniaturization, i...
详细信息
ISBN:
(纸本)0819443107
This paper presents an overview of our study on the subject that is categorically termed <photonics>>. microelectronics, as we define it here, is an area of scientific and technological study concerning the miniaturization, interconnection, and integration of photonic devices, circuits, and systems in micron or submicron scale. We examine the scientific and technological issues relating to these matters and discuss the challenges that the microphotonics faces toward the information technology in the 21st century. In the course of this study, we closely follow the experiences of microelectronics side by side, so that they can provide lessons, learnings, and insights that microphotonics can rightfully benefit from in a complementary form. Similarities, dissimilarities, advantages, and disadvantages, merits and demerits of the two technologies are explored in such a way that they can be more effectively utilized by mutual support. Directions for future studies are also discussed with particular emphasis on information technology.
We analyze the potentialities of microlens-based free-space optical pathway blocks for on-chip interconnects. To assess the promises of these modules, researchers typically make use of simple analytic Gaussian beam pr...
详细信息
ISBN:
(纸本)0819441694
We analyze the potentialities of microlens-based free-space optical pathway blocks for on-chip interconnects. To assess the promises of these modules, researchers typically make use of simple analytic Gaussian beam propagation (GBP). Although this approach leads to a first order layout of a microlens system it does not include aberrations. Aberrations however and -spherical aberrations in particular- become important when lenses with a small focal number are implemented. This is especially true when surface emitting lasers with a relative high beam divergence such as e.g. vCSELs are used. In this paper we evaluate how these aberrations affect the performances of such optical interconnection systems and we verify the validity of the GBP method. We enter various GBP layouts in the photonics design software SOLSTIS, which traces real rays or propagates spatially coherent optical beams through the system. We model and compare the performances of different microlens-relay system configurations and we focus on optical efficiency and scalability issues of these micro-optical interconnection components. To conclude we relate optical pathway lengths to minimum microlens diameters and to maximum achievable channel densities.
This paper describes Ti-6Al-4v plate 1.3 mm thick welded by CO2 laser beam. The orthogonal test of 3-level and 3- factor is adopted and technological parameters are optimized. The shielding case full of Helium is put ...
详细信息
ISBN:
(纸本)0819422894
This paper describes Ti-6Al-4v plate 1.3 mm thick welded by CO2 laser beam. The orthogonal test of 3-level and 3- factor is adopted and technological parameters are optimized. The shielding case full of Helium is put behind the pool This experiment indicates that the tensile strength of the weld can reach up to that of parent metal, when the weld joint is regular. Moreover the joint structure is analyzed also.
Current excimer-laser processing techniques can be extended to a broader and more diverse range of materials by moving to the vacuum ultraviolet (vUv; 100-200 nm) spectral region. Most materials are highly opaque in t...
详细信息
Current excimer-laser processing techniques can be extended to a broader and more diverse range of materials by moving to the vacuum ultraviolet (vUv; 100-200 nm) spectral region. Most materials are highly opaque in the vUv and the harder photon energy readily breaks chemical bonds, minimizing thermal loading at target surfaces. Further, the short-wavelength radiation affords patterning of sub quarter-micron feature sizes. An experimental survey has been undertaken to evaluate laser etch rates and surface quality produced on several polymer, glass, and semiconductor materials by both ArF and F/sub 2/ excimer lasers, with the hope of defining new processing applications. A summary of this investigation is presented in this paper.< >
Finely focused ion beams with current densities on the order of one A/cm 2 with beam diameters as small as 0.1 μm are used in a wide variety of surface processing applications in microelectronic research. Some of the...
详细信息
Finely focused ion beams with current densities on the order of one A/cm 2 with beam diameters as small as 0.1 μm are used in a wide variety of surface processing applications in microelectronic research. Some of the techniques include scanning ion microscopy and high spatial resolution SIMS, micromachining by physical sputtering, ion beam induced surface chemistry for etching and deposition, maskless implantations, and lithography. The primary commercial application to date has been defect repair for photomasks although integrated circuit modification for diagnostic purposes is emerging as important. Focused ion beams have also been applied to III–v materials for in situ processing, lithography, and fabrication of integrated optics devices by micromachining. Several focused ion beam techniques and applications will be reviewed. Particular emphasis will be placed on micromachining, deposition, and SIMS techniques.
作者：
D. J. RenderDirector
Transmission Technology and Engineering Center AT&T Bell Laboratories Holmdel New Jersey
Rapid progress in key technologies continues to be a major driver in the evolution of communications networks. In this paper we examine three critical technologies: microelectronics, photonics, and distributed process...
详细信息
Rapid progress in key technologies continues to be a major driver in the evolution of communications networks. In this paper we examine three critical technologies: microelectronics, photonics, and distributed processing. We review the current state of technology available in products, the likely trends in each based on research currently underway, and the resulting implications on network architecture capabilities.
The engineer of the 1990s will be—must be—different from the engineer of the 1980s. Consequently, engineering education also must change. That was the gist of a recent Purdue conference on University Programs in Com...
详细信息
The engineer of the 1990s will be—must be—different from the engineer of the 1980s. Consequently, engineering education also must change. That was the gist of a recent Purdue conference on University Programs in Computer-Aided Engineering, Design, and Manufacturing. More than 400 engineers, from industry as well as from engineering schools, *** meeting was organized by Purdue's school of mechanical engineering, so the program stressed the impact that modern information processing technology is having on mechanical engineers. However, much of what was said was just as applicable to other engineering *** the opening session, for example, Paul J. Wondrasch, vice president of technology planning for AT&T Technologies, told of the challenges that face U.S. industry. Meeting these challenges will place new demands on engineers and, by extension, on those who educate engineers."We live in a remarkably technology-rich era," Wondrasch observes, noting that three technologies in particular—microelectronics, photonics, and software—are developing extremely ...
暂无评论