This paper describes the methodology, which is used in IMEC for the realization of very high resolution linear image sensors. The key elements in design and processing are the use of the DEPLI-sensor principle, a quad...
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The proceedings contain 24 papers. The topics discussed include: the solidstate image sensor's contribution to the development of silicon technology;CCD charge collection efficiency and the photon transfer techni...
The proceedings contain 24 papers. The topics discussed include: the solidstate image sensor's contribution to the development of silicon technology;CCD charge collection efficiency and the photon transfer technique;high density frame transfer image sensors with vertical anti-blooming;advances in CCD technology;digital charge coupled device (CCD) camera system architecture;backside charging of the CCD;large area CCD image sensors for scientific applications;enhancement of x-ray performance with new GEC charged coupled devices (CCD);simplified technique of hologram generation and transmission;and performance analysis of the photon-counting image acquisition system.
Summary form only given. Quantum well heterojunction laser diodes were characterized in unmounted form for power output. Following the test, multidiode arrays were fabricated via mounting the bars p-side down with har...
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Summary form only given. Quantum well heterojunction laser diodes were characterized in unmounted form for power output. Following the test, multidiode arrays were fabricated via mounting the bars p-side down with hard solder to a substrate. Initially, light output on a watts/diode basis was observed to have decreased. Extensive laser bar processing development effort and assembly process refinement yielded laser diode arrays operating at power output levels consistent with unmounted individual diodes. The optimized arrays were then treated as building blocks to a larger array and were tested at a constant 1% duty cycle with pulse widths being varied from 1 to 200 mu s. Thermal effects were addressed. The resulting arrays are shown to be capable of operating at conditions suitable for pumping solid-state lasers.
A novel, silicon-based force sensor has been developed which can be used either as single-element sensors or configured into dense tactile sensorarrays. The individual devices are composed of a micromachined silicon ...
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A novel, silicon-based force sensor has been developed which can be used either as single-element sensors or configured into dense tactile sensorarrays. The individual devices are composed of a micromachined silicon chip bonded to a micromachined glass substrate. The silicon chip contains transconduction and addressing circuitry on one side and is machined with a force concentrating bump on the back side. The glass substrate contains bonding pad metallization and recessed areas into which the silicon chip can be deflected. A special bonding pad arrangement provides each device with an X-Y wiring capability.
With the advent of solid-state lasers and fiber-optic technology, it is now possible to remotely sense localized vibrations with a compact portable instrumentation package. The package, known as the fiber-optic laser ...
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ISBN:
(纸本)0876648677
With the advent of solid-state lasers and fiber-optic technology, it is now possible to remotely sense localized vibrations with a compact portable instrumentation package. The package, known as the fiber-optic laser vibration sensor (FOLVS), is the result of extensive research and development efforts conducted at United Technologies Research Center. The laser vibration sensor, as presently configured, is composed of an electro-optic processing unit with an attached fiber-optic wand. The wand has been designed so that it can be used in a variety of applications and can be easily positioned where noncontact vibration measurements are required. The data provided by the FOLVS are an absolute measure of the surface movement over an extremely wide dynamic range of frequencies. These data are also suitable for subsequent processing by micro-computers to extract vital diagnostic information.
arrays of circuit elements are fabricated on the surface of a silicon wafer and are interconnected by gold metallization. A layer of polyimide is then formed on the wafer surface by spinning on a layer of polyamic aci...
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arrays of circuit elements are fabricated on the surface of a silicon wafer and are interconnected by gold metallization. A layer of polyimide is then formed on the wafer surface by spinning on a layer of polyamic acid and curing it at high temperature. Masking and etching from the backside of the wafer leaves separate silicon islands supported on a flexible polymide substrate, interconnected by the flexible gold metalization. Size is smaller than tape-bonded hybrids. applications include linear thermometer arrays and two-dimensional arrays of sensors for robotic and biomedical uses.
The introduction of polarography has a means for oxygen detection was the first successful quantification of dissolved oxygen in liquid mediums. The design of present oxygen sensors requires a large ratio of anode to ...
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The introduction of polarography has a means for oxygen detection was the first successful quantification of dissolved oxygen in liquid mediums. The design of present oxygen sensors requires a large ratio of anode to cathode surface area to minimize the current density at the anode. This study was directed toward development of an electrochemical sensor that eliminates the need for a large ratio of anode to cathode surface area, thereby increasing the feasibility of fabricating miniature sensors suitable for medical applications. The improved sensor makes use of steady-state cyclic voltammograms at high scan rates. The resulting measurements are considerably less sensitive to flow fluctuation than are traditional measurements of limiting current.
The experiments and first realisations of solid-state colour cameras have proved a very promising future for a device which looks particularly adapted to applications such as videocommunication services and home video...
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The experiments and first realisations of solid-state colour cameras have proved a very promising future for a device which looks particularly adapted to applications such as videocommunication services and home video. In the field of researches on new wideband communication terminals, the C.C.E.T.T. (dept : Production-Présentation des Images) has implemented a real-time digital simulator for the study of various kinds of cameras incorporating 3, 2 or 1 solid-statesensor(s). The purpose of this simulator is mainly the definition of a single-sensor colour camera, considered as being an economical optimum for home-video applications.
A 1Mb PROGRAMMABLE ROM, with on-chip ECC(Error-Correcting Code) circuits for yield enhancement and an on-chip substrate bias generator for high speed, fabricated by polycide gate 2μ N-well CMOS technology, will be de...
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A 1Mb PROGRAMMABLE ROM, with on-chip ECC(Error-Correcting Code) circuits for yield enhancement and an on-chip substrate bias generator for high speed, fabricated by polycide gate 2μ N-well CMOS technology, will be described. Organized as 128Kx8b, the ROM occupies an area of 78.8mm^2. and is assembled in a 600-mil wide 28 pin DIP, as shown in Figure 1
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