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检索条件"任意字段=Conference on Solid State Sensor Arrays - Development and Applications"

共 1073 条记录，以下是11-20 订阅

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A Novel Multiple Modes Resonant sensor Featuring Blue Sideband Excitation 38

A Novel Multiple Modes Resonant Sensor Featuring Blue Sideba...

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38th IEEE International conference on Micro Electro Mechanical Systems, MEMS 2025

作者： Xu, Jiao Zheng, Zhuoyue Xi, Jingqian Zhang, Ziqian Liu, Huafeng Zhang, Pan Chen, Jianlin Wang, Chen Kraft, Michael Wang, Yuan Martins, R.P. Mak, Pui-In Huazhong University of Science and Technology Moe Key Laboratory of Fundamental Physical Quantities Measurement Pgmf School of Physics Wuhan430074 China University of Macau Institute of Microelectronics State Key Laboratory of Analog and Mixed-Signal Vlsi 999078 China Peking University National Key Laboratory of Advanced Micro and Nano Manufacture Technology School of Integrated Circuits 100871 China Shanghai University School of Microelectronics 200444 China Ku Leuven Department of Electrical Engineering-MNS Leuven3000 Belgium

ISBN: (纸本)9798331508890

This paper reports a novel MEMS resonant structure functioning as a baseline resonant electrostatic force/temperature sensor, highlighting its substantial potential in sensing applications. The resonator, characterized by a dual-cosine structure, is capable of simultaneous multiple resonant modes actuation within the 300 kHz range, through a sole-source drive approach using the recent emerging Blue Sideband Excitation (BSE) technique. This method enables a distinctive multi-modal response, essential for multi-parameter measurements. The research focuses on the sensor's temperature characteristics, electrostatic perturbation sensitivity, and noise floor. Notably, the study reveals intriguing temperature responses across different modes, where certain modes exhibit a significant frequency rise with increasing temperature, this is counter-intuitive with common MEMS resonator devices, prompting further investigation into the underlying mechanisms. The analysis of electrostatic perturbation sensitivity and noise background further unfolds the resonator's performance under various excitation conditions, laying a foundation for advancing sensor functionality, and providing solid evidence on the viability of the subject. To sum up, this study highlights the resonator's potential as a high-precision sensor, opening new opportunities for MEMS sensor design and multi-parameter measurement applications. © 2025 IEEE.

关键词： Microchannels

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A 74W/48V Monolithic-GaN Integrated Adjustable Multilevel Supply Modulator for 5G Base-Station Massive-MIMO arrays 72

A 74W/48V Monolithic-GaN Integrated Adjustable Multilevel Su...

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72nd IEEE International solid-state Circuits conference, ISSCC 2025

作者： Pham, Hieu Minh Asbeck, Peter Kimball, Donald F. Sharma, Navneet Dong, Shenggang Shahshahani, Masoud Choi, Won Suk Xu, Gary Michel, Marcus Das, Ratul Beach, Robert Le, Hanh-Phuc University of California San DiegoCA United States Samsung Research America PlanoTX United States Efficient Power Conversion El SegundoCA United States University of Minnesota-Twin Cities MinneapolisMN United States

ISBN: (纸本)9798331541019

Efficient power management for RF power amplifiers (PAs) is emerging as a critical requirement for the development and adoption of next-generation wireless communication systems. To achieve higher transmitter efficiency, envelope tracking (ET) using supply modulators (SM) is widely used in today's systems. However, the demands for high bandwidth, complex modulation and multiple access schemes in 5G and upcoming 6G systems have exposed serious limitations of analog ET (AET) that get worse in high-power high-voltage applications, e.g., base-station transmitters. As a promising alternative to AET, digital envelope tracking (DET) has proven its advantages and capabilities to support various signal bandwidths and power profiles [1]-[8]. DET architectures in Figure 9.3.1 achieve higher efficiency by separating the voltage generation (VG) stage and tracker (TR) stage, in which the former aimed for relatively slow but efficient generations of multiple voltage levels and the latter for fast voltage tracking. © 2025 IEEE.

关键词： 5G mobile communication systems

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20.1 A 3.5×3.5mm2 1.47mW/ch 16-Channel MSS-CMOS Heterogeneous Multi-Modal-Gas-sensor Chip Stack

20.1 A 3.5×3.5mm2 1.47mW/ch 16-Channel MSS-CMOS Heterogeneo...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： Kotaro Naruse Naru Kato Takuma Matsumori Jun Shlomi Yoshihiro Midoh Tetsuya Hirose Gaku Imamura Genki Yoshikawa Constantine Sideris Noriyuki Miura Osaka University Suita Japan National Institute for Materials Science Tsukuba Japan University of Tsukuba Tsukuba Japan University of Southern California Los Angels CA

ISBN: (数字)9798331541019

ISBN: (纸本)9798331541026

Miniaturizing and reducing the power consumption of multi-modal gas sensors with multiple channels can enable a wide array of applications, including integrating with wearable devices for daily breath analysis, encapsulation into ingestible pills for internal body measurements, and embedding into smart tags for food freshness management (Fig. 20.1.1). Traditional gas sensors typically have the transducer and CMOS chip connected via wiring on a substrate, leading to a large-form factor that requires complicated and expensive packaging and cannot readily scale to many-sensor arrays [1]. Recent studies have proposed gas sensors utilizing a MEMS-CMOS stack; however, these have yet to demonstrate responses to different gas types, and there are also challenges regarding increasing the number of channels and reducing the power consumption [2]. In this paper, we propose a heterogeneous multi-modal gas sensor that employs a Membrane-type Surface-stress sensor (MSS) as the transducer stacked on top of CMOS for analog frontend and digital readout.

关键词： Wiring Semiconductor device measurement Transducers Power demand Power measurement solid state circuits Wearable devices Gas detectors Substrates sensor arrays

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A 3-Stacked Hybrid-Shutter CMOS Image sensor with Switchable 1.2μm-Pitch 50Mpixel Rolling Shutter and 2.4μm-Pitch 12.5Mpixel Global Shutter Modes for Mobile applications 72

A 3-Stacked Hybrid-Shutter CMOS Image Sensor with Switchable...

引用

72nd IEEE International solid-state Circuits conference, ISSCC 2025

作者： Shim, Heesung Kim, Seung-Sik Seo, Min-Woong Park, Sangsu Kwon, Hyukbin Kim, Yongjun Lee, Sanggwon Park, Sungbong Bae, Daehee Koo, Si Gyoung Ito, Masamichi Jeon, Jae-Hoon Yoon, Sol Byun, Sung-Jae Kim, Sangyoon Kim, Kwansik Cho, Gihwan Lee, Joonho Kim, Tekyou Jun, Sungjae Lee, Jae-Kyu Moon, Chang-Rok Song, Jaihyuk Samsung Electronics Hwaseong Korea Republic of

ISBN: (纸本)9798331541019

In recent years, the development of CMOS image sensors (CISs), especially for mobile applications, has focused on pixel scaling to achieve ultra-high pixel resolutions of over 50 megapixels (Mp) [1]. In addition, various efforts have been actively devoted to strengthen the functionality of image sensors through advanced stacking process technologies, e.g., rolling shutter (RS) CIS with event vision sensors (EVS) for enhancing imaging quality [2]. A global shutter (GS) CIS is an excellent alternative to overcome the limitations of conventional RS CISs. GS CISs for mobile applications can create value as follows: 1) GS CISs can get distortion-free images when capturing fast-moving objects;2) GS CISs don't suffer from flicker-related artifacts because all pixels are exposed at the same time, while RS CISs require a tradeoff between a long exposure time such as 1/60 or 1/120 seconds to prevent the flicker phenomena and a short one to avoid image blurring;and 3) Flash banding caused by sudden camera flashes can be avoided. We believe that the aforementioned advantages of GS CISs have the potential to offer a valuable user experience in mobile devices. Despite these features, voltage-domain GS CISs exhibit a higher random noise (RN) level, generated by sampling capacitors, compared to RS CISs, which limits their applicability. Therefore, a hybrid shutter (HS) CIS capable of operating in both modes, RS and GS, is developed to maximize the benefits of each. © 2025 IEEE.

关键词： CMOS integrated circuits

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35.2 A Spatial-Domain Compressive-Sensing Photoacoustic Imager with Matrix-Multiplying SAR ADC

35.2 A Spatial-Domain Compressive-Sensing Photoacoustic Imag...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： Huan-Cheng Liao Shunyao Zhang Yumin Su Arvind Govinday Yiwei Zou Wei Wang Vivek Boominathan Ashok Veeraraghavan Lei Li Kaiyuan Yang Rice University Houston TX

ISBN: (数字)9798331541019

ISBN: (纸本)9798331541026

Wearable deep-tissue imaging technologies promise a paradigm shift to preventive, proactive, and accessible health care. Real-time and long-term imaging offers unprecedented insights into one's body conditions, enabling constant monitoring of high-risk patients (e.g., cardiovascular [1] and musculoskeletal [2]), tracking fetal development [3], and overseeing recovery after surgeries. These devices also make medical imaging more accessible and affordable in low-income countries. Ultrasound and photoacoustic (PA) imaging modalities are well suited for such applications because of their high resolution for imaging deep tissue and fewer safety concerns. Compared to the well-known ultrasound, emerging PA technology [4], [5] employs optical excitation and ultrasonic readout, governed by PA effects, to achieve higher molecular contrast and sensitivity based on the agents' optical absorption properties while offering similar depth and resolution. Thus, this work targets a compact and low-power PA RX with data compression as a key enabler of the envisioned wireless wearable PA imager. It is worth noting that PA and ultrasound RX share similar sensor arrays and readout circuits, except that the amplitude of received PA signals is roughly ten times smaller than that of ultrasound due to an extra stage of energy transduction and light exposure limits. Thus, we discuss and compare ultrasound and PA RX designs together in this paper.

关键词： Wireless communication Wireless sensor networks Ultrasonic imaging Image resolution Biomedical optical imaging Surgery Optical imaging solid state circuits Optical sensors Biomedical monitoring

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37.3 Monolithic in-Memory Computing Microprocessor for End-to-End DNN Inferencing in MRAM-Embedded 28nm CMOS Technology with 1.1Mb Weight Storage

37.3 Monolithic in-Memory Computing Microprocessor for End-t...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： Soonwan Kwon Sungmeen Myung Jangho An Hyunsoo Kim Minje Kim Hyungwoo Lee Wooseok Yi Seungchul Jung Daekun Yoon Shinhee Han Saeyoon Chung Kilho Lee Jeong-Heon Park Kangho Lee Sang Joon Kim Donhee Ham Samsung Advanced Institute of Technology Suwon Korea Seoul National University Seoul Korea Samsung Electronics Giheung Korea Harvard University Cambridge MA

ISBN: (数字)9798331541019

ISBN: (纸本)9798331541026

Always-on AI sensor applications–based on deep neural networks (DNNs)–with sparse inference require low power consumption during both computing and idle phases. In-memory computing (IMC) with non-volatile memory crossbar arrays could meet this demand. Concretely, the co-location of memory (DNN weight storage) and computing (analog matrix multiplications (MMs)) in crossbar arrays obviates the need to shuttle weight data, thus reducing the computing power consumption, while the use of the non-volatile memory minimizes the power consumption during idle states. Resistive, phase-change, and magneto-resistive random-access memory (RRAM, PRAM, and MRAM) and flash memory are well-known non-volatile memory types, with their own merits and drawbacks. Of these, MRAM boasts high endurance and low switching energy (with the drawback being 1b storage per cell) [1] and has been commercially embedded in CMOS logic technology, and thus MRAM is a good non-volatile memory candidate for IMC. However, previous MRAM IMC works [2]–[5] have been focused on individual crossbar arrays, which correspond only to a small fraction of a DNN.

关键词： Power demand Nonvolatile memory Artificial neural networks In-memory computing CMOS technology Phase change random access memory solid state circuits arrays Sparse matrices Switching circuits

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Proceedings of SPIE: solid state sensor arrays: development and applications II

Proceedings of SPIE: Solid State Sensor Arrays: Development ...

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solid state sensor arrays: development and applications II

This Volume 3301 of the conference proceedings contains 21 papers. Topics discussed include new devices and technologies, X ray sensors and CMOS sensors.

关键词： sensors

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20.4 MEMS-Free 4096-Pixel CMOS E-Nose Gas-sensor Array with Molecular-Selective Metal-Organic-Framework Sensing and In-Pixel Thermodynamic Modulation for Fast sensor Regeneration

20.4 MEMS-Free 4096-Pixel CMOS E-Nose Gas-Sensor Array with ...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： Marco Saif Fuze Jiang Shao–Wei Lo Adam Wang Zhikai Huang Jiachen Wang Hangxing Liu Chih–Jen Shih Thomas Burger Hua Wang ETH Zürich Zürich Switzerland

ISBN: (数字)9798331541019

ISBN: (纸本)9798331541026

Accurate and real-time sensing of gas molecule species and concentrations is critical for a myriad of applications, including environmental protection, industry automation, public health monitoring, and bio-/chemical-security surveillance. For example, gas sensing in large chemical plants is crucial for safety and production efficiency, with ammonia (NH3) being particularly important due to its extensive use [1]. Electronic noses (e-noses) consist of a chemical sensor array with surface recognition modules for capturing specific or multi-species gas molecules followed by electronic signal acquisition and processing [2]. Despite decades of exploration [3]–[5], the development of e-noses is still in its early stages, and existing e-noses continue to face major challenges as: (1) limited selectivity on target molecules (2) poor sensor regeneration due to slow and incomplete gas desorption process, which can result in sensing memory effect, i.e., affecting low-trace gas detection due to prior exposure to high concentrations, (3) a small number of sensing nodes instead of a large array, also lacking in-pixel signal processing and data digitization [6], [7]. To address these issues, we present a monolithically integrated molecular specific metal-organic-frameworks (MOFs) CMOS e-nose sensor array with in-pixel fast capacitance-gas interfacing, readout, and data digitization with local temperature regulation and sensing. For demonstration, NiNi-Pyz MOFs have been employed to achieve NH3 specificity. In particular, the in-pixel temperature regulation can modulate the thermodynamic of NH 3 adsorption and desorption at the sensor interfaces, significantly improving the sensitivity and allowing rapid sensor regeneration.

关键词： Temperature sensors Thermodynamics Temperature distribution Array signal processing Surveillance Electronic noses Regulation sensors Surface treatment sensor arrays

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27.3 A Sub-1V 14b 5.8nW/Hz BW/Power-Scalable CT sensor Interface with a Frequency-Controlled Current Source Achieving a 225× Scalable Range

27.3 A Sub-1V 14b 5.8nW/Hz BW/Power-Scalable CT Sensor Inter...

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Xinjie Wu Yuyan Liu Xiaopeng Yu Nick Nianxiong Tan Zhong Tang Zhejiang University Hanoghou China Vango Technologies Hangzhou China

ISBN: (数字)9798331541019

ISBN: (纸本)9798331541026

Precision and energy-efficient sensor interfaces have always been needed in loT applications. To digitize weak signals (tens of mVs), such as shunt-based current and biomedical sensors, the interface should have low noise [1]–[4]. Moreover, to accommodate different use cases, the bandwidth (BW) and power dissipation of sensor interfaces should be highly scalable [5]–[7]. sensor interfaces based on discrete-time (DT) ADCs, such as SAR ADCs [8], [9] and FIA-based ΔΣ ADCs [5]–[7] are BW/power scalable, but they usually suffer from kT/C noise (Fig. 27.3.1 top, left). Using a continuous-time (CT) first stage, such as an instrumentation amplifier (IA) [1], [3], [4] (Fig. 27.3.1 top, right), or an active RC integrator [10], [11], can suppress the sampling noise of the following stages, however, they usually consume fixed static power, limiting their BW/power scalability.

关键词： Limiting Scalability Instruments Noise Bandwidth Energy efficiency solid state circuits Power dissipation Biosensors

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1.2 From Chips to Thoughts: Building Physical Intelligence into Robotic Systems

1.2 From Chips to Thoughts: Building Physical Intelligence i...

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Daniela Rus CSAIL Massachusetts Institute of Technology Cambridge MA

ISBN: (数字)9798331541019

ISBN: (纸本)9798331541026

The rapid growth of AI technologies has brought unprecedented advancements across numerous domains, from healthcare to autonomous systems, yet this progress has been accompanied by substantial energy demands. Generative AI has revolutionized the accessibility of advanced machine learning models, putting powerful AI capabilities directly into the hands of everyday users. Tools that generate text, images, video, and audio have made AI more democratic, fueling creativity, productivity, and innovation across industries. This explosion of generative AI applications, from chatbots to art generators, has transformed AI from a niche tool into an indispensable asset in our digital lives, as many can now access these technologies through their phones or computers. However, this widespread accessibility comes with significant trade-offs, particularly in terms of the energy required to train and deploy these enormous models. Large generative models such as GPT, DALL-E, and other multi-modal AI systems demand immense computational resources, translating to high energy consumption both during the extensive training process and when they are used in practice.

关键词： Energy consumption Technological innovation Liquids Generative AI Computational modeling Energy efficiency state-space methods Smart grids Artificial intelligence sensor arrays

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