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62nd IEEE International solid-state Circuits conference (ISSCC)

作者： Myers, James Savanth, Anand Howard, David Gaddh, Rohan Prabhat, Pranay Flynn, David ARM Cambridge England

ISBN: (纸本)9781479962242

The Internet of Things is widely expected to comprise billions of connected devices, many of which will be wireless sensor nodes (WSN). One challenge this poses is energy efficiency, as it will prove cost-prohibitive to regularly replace billions of batteries. Node cost is another concern, which will demand ever-greater integration. Ease of SW development must also remain a priority to HW designers. Addressing all of the above, this paper presents an 11.7pJ/cycle subthreshold WSN processing sub-system implemented in low-leakage 65nm CMOS, scalable from 850nW active power at 250mV to 66MHz at 900mV, with a fully integrated 82% peak-efficiency voltage regulator for direct-battery operation, and supporting 80nW CPU and RAM state-retention power gating for SW-transparent leakage reduction. © 2015 IEEE.

关键词： Voltage regulators

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The development of scalable sensor arrays using standard CMOS technology

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sensorS AND ACTUATORS B-CHEMICAL 2004年第1-2期103卷 37-42页

作者： Milgrew, MJ Hammond, PA Cumming, DRS Univ Glasgow Dept Elect & Elect Engn Glasgow G12 8LT Lanark Scotland

This paper describes an approach to developing MOSFET-based scalable sensor arrays in an unmodified standard CMOS process. The multiplexed design can be used as either a single-ended or differential circuit to make potentiometric measurements in each cell of the array. The FET-based sensors employ a floating gate electrode structure and use the nitride passivation layer as a pH-sensitive membrane. An implementation of a single-chip 2 x 2 array fabricated in an unmodified commercial 0.35 mum CMOS process is presented. All signal acquisition is performed in-situ and all readout circuitry is located on-chip. On return from the foundry, the devices are exposed to ultraviolet light to eliminate any difference in threshold voltage. The circuit provides a sufficient linear range that allows the FET devices to operate as pH sensors in the array. A double layer of SU-8 photoresist is used to provide both a biocompatible and waterproof package for the chip. The biocompatibility of the chip surface is investigated using a well-established cell line. (C) 2004 Elsevier B.V. All rights reserved.

关键词： sensor array CMOS ISFET cell culture in-vitro

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Femtosecond pulse structuring of multicore fibers for development of advanced fiber lasers and sensors 5th

Femtosecond pulse structuring of multicore fibers for develo...

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5th Asian School-conference on Physics and Technology of Nanostructured Materials, ASCO-Nanomat 2020

作者： Dostovalov, Alexandr V. Wolf, Alexey A. Bronnikov, Kirill A. Skvortsov, Mikhail I. Churin, Alexey E. Babin, Sergey A. Institute of Automation and Electrometry of the SB RAS 1 Acad. Koptyug Ave Novosibirsk630090 Russia

ISBN: (纸本)9783035737936

In this paper we investigate the fiber Bragg grating (FBG) arrays selectively inscribed in a multicore fiber for a different sensor and laser applications. Particularly, wavelength-switchable and tunable fiber laser was realized based on uniform and non-uniform FBGs precisely positioned in the selected cores. A quasi-distributed 3D shape sensor based on FBG array inscribed in a multicore fiber with helically twisted side cores was fabricated and applied for shape reconstruction of papillotome. © 2020 Trans Tech Publications Ltd, Switzerland.

关键词： Fiber lasers

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Beam shaping for kilowatt fiber-coupled diode lasers by using one-step beam cutting-rotating of prisms

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APPLIED OPTICS 2016年第34期55卷 9769-9773页

作者： Wu, Yulong Dong, Zhiyong Chen, Yongqi Qi, Yaoyao Yuan, Xiandan Qi, Yunfei Xu, Li Lin, Xuechun Zou, Yonggang Zhao, Pengfei Changchun Univ Sci & Technol State Key Lab High Power Semicond Lasers Changchun 130022 Jilin Peoples R China Chinese Acad Sci Inst Semicond Lab All Solid State Light Sources Beijing 100083 Peoples R China

The beam quality mismatch of laser diode stacks in both axes limits many direct applications for fiber or solid laser pumping and material processing. In this paper, a one-step cutting-rotating beam shaping system has been designed to homogenize the beam quality of two polarization-multiplexing laser diode stacks. Coupling laser diode stacks consisting of eight bars into a standard fiber with a core diameter of 600 mu m and an NA of 0.22 is achieved. The simulative result shows that the system will have an output power over 1056 W. By using the technique, the production of compact and high brightness fiber-coupling diode lasers can be directly used for laser cladding and laser surface hardening processes. (C) 2016 Optical Society of America

关键词： Diode laser arrays Diode lasers Fiber lasers Laser beam shaping Laser beams Laser materials processing

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A 12-Bit Cyclic ADC for Image sensor 13

A 12-Bit Cyclic ADC for Image Sensor

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2016 13th IEEE International conference on solid-state and Integrated Circuit Technology (ICSICT)

作者： Can Peng Shuang Cui Chao Wang Xiao-Tian Yang Yu-Chun Chang State Key Laboratory on Integrated Optoelectronics College of Electronic Science and EngineeringJilin University Jilin Provincial Key Laboratory of Architectural Electricity & Comprehensive Energy Saving Jilin Jianzhu University

ISBN: (纸本)9781467397209

This paper describes a low-power fully differential cyclic analog-to-digital converter（ADC） for CMOS image sensor readout circuits. The Cyclic ADC with redundant signed digital（RSD） algorithm has various obviously advantages, such as simpler circuit configuration and more tolerance to offset error of comparator. An operational amplifier with gain-boosting is used to increase the accuracy of the ADC. A prototype ADC is fabricated in 0.15 um 1P6M CMOS technology. The results indicate that the ADC has a signal-to-noise and distortion ratio（SNDR） of 72.4dB and a spurious free dynamic range（SFDR） of 80.4d B. The power dissipation is 140 uW with a 5V supply, and the chip size is 9um×570um.

关键词： Estimation Field programmable gate arrays OFDM Modulation Filtration Clocks Signal processing algorithms

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Investigations on pressure sensors for medical applications based on fiber Bragg gratings

Investigations on pressure sensors for medical applications ...

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2013 17th International conference on solid-state sensors, Actuators and Microsystems, TRANSDUCERS and EUROsensorS 2013

作者： Voigt, S. Rothhardt, M. Becker, M. Mehner, J. Chemnitz University of Technology Department of Microsystems Chemnitz Germany Institute for Photonic Technology IPHT Jena Germany

ISBN: (纸本)9781467359818

The concept of fiber-Bragg grating (FBG) arrays was investigated regarding its potential to serve as a new method to fabricate cost efficient and high performance pressure sensor catheters for hollow organs. Draw tower fibers with a reduced diameter of 80 μm and a co-extrusion fabrication process were used in order to keep the catheter simple and prone to be used as one way product. The total diameter of these catheters can range literally from the fiber diameter of 80 μm up to 5 mm. Finite element based investigations on the design were followed by experimental characterization of the material parameters and the fabrication of samples. These samples were thoroughly examined regarding pressure, tension and temperature sensitivity as well as their mechanical properties like stiffness, tensile strength and geometry. As a result of these studies pressure sensor catheter designs for hollow organs in human medicine are proposed. With state of the art interrogation systems for FBG-sensor readout different kinds of measurement catheters are possible to be designed. Possible applications are motility measurements ranging from the human esophagus to the gut, containing rectum, colon and small intestine and even sphincter of Oddi which are accessible by placing the catheter via endoscopic techniques. The use in cardiac arrangements is in preparation. © 2013 IEEE.

关键词： Pressure sensors

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Via-free interconnection in quasi-hermetic wafer-level packaging for RF-MEMS applications and 3D integration

Via-free interconnection in quasi-hermetic wafer-level packa...

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14th International conference on solid-state sensors, Actuators and Microsystems/21st European conference on solid-state Transducers

作者： Phommahaxay, Alain Lissorgues, Gaelle Rousseau, Lionel Perrais, Vincent Marty, Frederic Bourouina, Thrik Nicole, Pierre ESIEE Paris ESYCOM Noisy Le Grand France Thales Airborne Syst Elancourt France

ISBN: (纸本)9781424408412

The development of an interconnection method based on electromagnetic coupling for hermetic or vacuum packaging in RF-MEMS applications is presented in this paper. Combined with wafer-level packaging by anodic bonding, it minimizes the leakage probability of such package by avoiding the use of vertical interconnections or horizontal feedthroughs. Electromagnetic simulations will be discussed and compared to microwave measurements on coupling structures.

关键词： electromagnetic coupling interconnection microwave transition wafer-level packaging

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Automotive applications for micromachining

Automotive applications for micromachining

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conference on Micromachining and Microfabrication Process Technology III

作者： Sparks, DR Chang, SC Delco Electronics Corp. (United States) General Motors Research and Development Ctr. (United States)

ISBN: (纸本)0819426555

High volume silicon micromachining has been employed by the automotive industry for 20 years. This paper will examine past, current and future applications of MEMS to the automobile. Both sensor and the application of micromachining to other automotive areas will be covered. Technologies such as wet and plasma etching, wafer bonding, LIGA, circuit integration and packaging will be discussed.

关键词： micromachine pressure sensor accelerometer angular rate sensor valve nozzle LIGA wafer bonding etching silicon

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Composite photopolymer microstructures: From planar to 3D devices 12

Composite photopolymer microstructures: From planar to 3D de...

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12th International conference on solid-state sensors, Actuators and Microsystems (TRANSDUCERS 03)

作者： Renaud, P Metz, S Jiguet, S Bertsch, A Ecole Polytech Fed Lausanne Microsyst Lab STI LMIS CH-1015 Lausanne Switzerland

ISBN: (纸本)0780377311

In this paper, a survey is made of some technologies in which the photo-definable polymer is used as structural material and where physical properties of polymers are modified to change porosity, mechanical or electrical properties. The paper is organized in three sections: (a) 2D, multilayer photopolymers, (b) High aspect ratio and (c) 3D micro-stereolithography technologies. In addition the authors mention some development in which photo-polymerization is used to locally create special structures. © 2003 IEEE.

关键词： Electrodes Etching Laboratories Micromechanical devices Microstructure Polyimides Polymers Resists sensor arrays Silicon

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sensor packaging method based on the solid tire sole of wheel-legged robot 4

Sensor packaging method based on the solid tire sole of whee...

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4th International conference on Artificial Intelligence, Robotics, and Communication, ICAIRC 2024

作者： Huang, Chao Wang, Yaodong Guo, Min Hong, Meng Wuhan University of Technology Hubei Provincial Engineering Research Center of Robotics&Intelligent Manufacturing Wuhan China

ISBN: (纸本)9798331531225

For wheel-legged robots, the unique wheel-legged structure significantly influences the dynamics and kinematic behavior of the foot during ground contact. This paper presents a resistive strain gauge sensor integration scheme for solid tires, wherein sensors are embedded within the tires to actively monitor the touchdown information of the foot-end. A method is proposed for embedding the solid tires in circumferential arrays to capture the plantar strain state, which supports the control system of wheel-legged robots. To evaluate the effectiveness of this sensor package, a simulated impact experiment was conducted to simulate the wheel-legged ground contact. The experimental results demonstrate that the strain gauge embedding method effectively detects the strain response of solid tires under impact. Since ground contact information is crucial for the autonomous switching of the wheel-legged structure in robots, the successful implementation of this sensing system for ground contact monitoring holds significant potential for both research and practical engineering applications. © 2024 IEEE.

关键词： Strain gages

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