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12th International conference on solid-state sensors, Actuators and Microsystems (TRANSDUCERS 03)

作者： Panchapakesan, B Cavicchi, R Semancik, S DeVoe, DL Univ Delaware Delware MEMS & Nanotechnol Lab Newark DE 19711 USA

ISBN: (纸本)0780377311

This paper describes 36-element arrays of surface micromachined microhotplates as thermal platforms for manipulating and controlling the morphology of tin oxide (SnO2) nanostructures for chemical sensing applications. A new technique of using metal nanoparticles as seed layers for the nucleation, growth and control of SnO2 nanostructures on microhotplate arrays is described. 16 Angstrom of metals such as nickel, cobalt, iron, copper and silver were selectively evaporated on each column of the microhotplate array. Following evaporation, the microhotplates were heated to 500 degreesC and SnO2 was deposited on top of the microhotplates using a self-aligned CVD process. SEM characterization revealed control of SnO2 nanostructures in the range of 20 nm to 121 nm. Gas sensing in seven different hydrocarbons revealed that metal nanoparticles that helped in faster nucleation of SnO2 resulted in smaller grain size and higher sensitivity. Temperature programmed sensing (TPS) on the devices yielded shape differences in the response between air and methanol illustrating selectivity. Spider web plots were used to monitor materials programmed selectivity (MPS). The shape differences between different gases in spider web plots illustrate materials selectivity as a powerful approach for monitoring selectivity in various gases. Continuous monitoring in alcoholic gases yielded stable sensor response for more than 200 hours. This comprehensive study illustrates the use of nanoparticle seeding approach for sensitive, selective and stable gas sensing applications.

关键词： Chemical vapor deposition Cobalt Gases Monitoring Nanoparticles Nanostructures Nickel Shape Surface morphology Tin

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development of micromachined switches with increased reliability

Development of micromachined switches with increased reliabi...

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Proceedings of the 1997 International conference on solid-state sensors and Actuators. Part 2 (of 2)

作者： Hiltmann, Kai M. Schmidt, Bertram Sandmaier, Hermann Lang, Walter Hahn-Schickard Soc Inst of Micro- and Informationtechnology Villingen-Schwenningen Germany

By micromachining of silicon and glass, an electrical switch with low-resistance metal contacts was made. The switch is aimed at applications as a binary pressure sensor and to replace conventional push-button switches. First measurements on switches yielded electrical lifetimes over 105 cycles and contact resistance clearly below 1 Ω.

关键词： Electric switches

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Analysis and applications of nanostructures created by stencil lithography

Analysis and applications of nanostructures created by stenc...

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TRANSDUCERS 2009 - 15th International conference on solid-state sensors, Actuators and Microsystems

作者： Vazquez-Mena, O. Sannomiya, T. Tosun, M. Villanueva, G. Vörös, J. Brugger, J. Lausanne Switzerland Zurich Switzerland

ISBN: (纸本)9781424441938

We present an analysis on the blurring, electrical and optical properties of nanostructures fabricated by stencil lithography and their application for biomolecular sensing. We analyze the effect of the stencil-substrate gap on the blurring, then we present the fabrication and electrical characteristics of nanowires on plastic substrates, and finally, we demonstrate the application of nanodots for biomolecular detection based on plasmon resonance. To study the effect of the gap, we have designed and fabricated stencils having plateaus with apertures at different heights. The measured blurring of the structures is ∼200 nm for a 40 μm gap. We have also observed a decrease in the thickness of the structure as the gap increases. Using stencil lithography, we have fabricated Au nanowires and arrays of Au nanodots. The nanowires were deposited on plastic substrates, having widths down to 80 nm and lengths up to 20 μm. The electrical resistivity of the wires is 7-10 μΩcm. Finally, we have deposited Au nanodot arrays on glass and silicon substrates. The arrays contain nanodots 65 nm and 100 nm in diameter with different spacing between them. The localized surface plasmon resonance wavelength of the dots is ∼800 nm. These arrays have been successfully used as biosensors, showing a resonance wavelength shift when biomolecules bind to the structures. ©2009 IEEE.

关键词： Biosensors

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development of a small semiconductor detector using a printed circuit silicon-board for a personal dosemeter

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RADIATION MEASUREMENTS 2008年第2-6期43卷 546-549页

作者： Ishikura, T. Aoyama, K. Fujimoto, T. Tomotaka, M. Nakamura, T. Fuji Elect Syst Co Ltd Tokyo Factory Tokyo 1918502 Japan

We developed a small size silicon detector composed of a silicon radiation sensor, an analogue amplifier circuit and a sensor bias filter circuit by using a silicon circuit board for use in digital circuit applications. Our detector could be downsized by forming built-in electrical parts of small thin film on the silicon circuit board with a narrow wiring patterns of 20 mu m width through the Micro Electronics Mechanical System manufacturing process and by eliminating the ceramic case through the direct silicon sensor mounting. Our detector is -85% smaller than the commercially available detector using the plastic circuit board that has the same sensor and the same circuit covered with a ceramic case. The physical characteristics, such as the energy response and the linearity to dose equivalent rate, of the newly developed detector were investigated by using Am-241, Co-57, Cs-137, Co-60 gamma-rays and 49-157 keV X-rays. (C) 2008 Elsevier Ltd. All rights reserved.

关键词： silicon sensor silicon circuit board built-in resistor and capacitor small-size photon dosemeter

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High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

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IEEE TRANSACTIONS ON ADVANCED PACKAGING 1999年第4期22卷 534-540页

作者： van der Linden, JE De Dobbelaere, PM Van Daele, PP Diemeer, MB European Patent Off NL-2280 HV Rijswijk Netherlands Univ Ghent IMEC INTEC Dept B-9000 Ghent Belgium Opt Micro Machines Inc San Diego CA 92121 USA Akzo Nobel Cent Res RGE Dept NL-6800 SB Arnhem Netherlands

We report on a hybrid integration concept which allows high-density and alignment-tolerant surface mount assembly of top-illuminated photodetector (PD) arrays onto polymeric guided-wave components by means of a micromachined submount with an integrated mirror, This research aims at the development of polymeric waveguide based devices with an embedded optical power monitoring capability for applications in optical fiber communication networks. A prototype integrated multichannel optical power monitor comprising an eight-channel PD module and a polymeric waveguide splitter array was demonstrated which exhibited an average insertion loss of 5.2 dg, a PD coupling efficiency of -2.6 dB, and a crosstalk value of -17.1 dB between adjacent channels, Low polarization and wavelength sensitivity (sigma < 0.1 dB) was confirmed over a spectral range of 40 nm in both telecom wavelength windows.

关键词： hybrid integration network monitoring and management optical fiber communication polymeric waveguide components silicon micromachining

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Technology Trend and Challenges in High Power Semiconductor Laser Packaging

Technology Trend and Challenges in High Power Semiconductor ...

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59th Electronic Components and Technology conference

作者： Liu, Xingsheng Zhao, Wei Chinese Acad Sci State Key Lab Transient Opt & Photon Xian Inst Opt & Precis Mech Xian 710119 Peoples R China

ISBN: (纸本)9781424444755

High power semiconductor lasers have found increased applications in pumping of solid state laser systems for industrial, military and medical applications as well as direct material processing applications such as welding, cutting, and surface treatment. Driven by low cost, longer lifetime and new applications, the requirements of high power semiconductor lasers have been changed and the demand for new products has been accelerated in recent years. As a result, the packaging technologies of high power semiconductor lasers have been highly developed and have become more sophisticated. In this paper, we review and discuss the technology development trend of high power semiconductor lasers, including single emitters, bars, horizontal bar arrays and vertical bar stacks. However, the packaging technology is still one of the bottlenecks of the advancement of high power semiconductor lasers. We will discuss the challenges and issues in high power laser packaging and some approaches and strategies in addressing the challenges and issues will be presented.

关键词： Military applications

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32.10 A Compact Broadband VSWR-Resilient True-Power-and-Gain sensor with Dynamic-Range Compensation for Phased-Array applications

32.10 A Compact Broadband VSWR-Resilient True-Power-and-Gain...

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2024 IEEE International solid-state Circuits conference, ISSCC 2024

作者： Liu, Edward Munzer, David Lee, Jeongseok Wang, Hua ETH Zurich Zurich Switzerland Georgia Institute of Technology AtlantaGA United States

ISBN: (纸本)9798350306200

With the rapid growth of mm-wave wireless technologies, phased arrays are essential to meet the stringent link-budget requirements under path losses. However, antenna array inter-element coupling distorts each antenna load from its nominal 50Ω impedance, commonly known as antenna voltage standing wave ratio (VSWR), degrading the array radiation pattern and each transmitter-element performance. Moreover, an antenna VSWR depends on the array-element location and the beamforming coefficients, complicating any correction/compensation schemes [1]. With mismatched antenna loads, the desired actual element gain, radiated power, and radiation pattern often deviate significantly from the target values. © 2024 IEEE.

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New polysilicon sensor and actuator technology for the development of a thermal platform

New polysilicon sensor and actuator technology for the devel...

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TRANSDUCERS 2009 - 15th International conference on solid-state sensors, Actuators and Microsystems

作者： Marty, B. Camps, T. Tasselli, J. Marty, A. Lagrange, D. CNRS LAAS 7 avenue du colonel Roche F-31077 Toulouse France Université de Toulouse UPS LAAS F-31077 Toulouse France

ISBN: (纸本)9781424441938

This paper reports on a generic approach for the development of polysilicon diodes on glass wafers for thermal sensing and control applications. The capabilities of polysilicon diodes as thermal sensors are demonstrated on glass wafers with good thermal sensitivities about 40mV/°C. A simple experimental set-up has been developed to evaluate the potentialities of these devices in microfluidics operating conditions. First encouraging results of temperature detection are presented. ©2009 IEEE.

关键词： Actuators

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High performance large infrared and visible astronomy arrays for low background applications: Instruments performance data and future developments at Raytheon

High performance large infrared and visible astronomy arrays...

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conference on Infrared Systems and Photoelectronic Technology II

作者： Beuville, Eric Acton, David Corrales, Elizabeth Drab, John Levy, Alan Merrillb, Michael Peralta, Richard Ritchie, William Raytheon Vis Syst Goleta CA 93117 USA Natl Opt Astron Observ Tucson AZ 85719 USA

ISBN: (纸本)9780819468086

Raytheon Vision Systems (RVS) has developed a family of high performance large format infrared detector arrays for astronomy and civil space applications. RVS offers unique off-the-shelf solutions to the astronomy community. This paper describes mega-pixel arrays, based on multiple detector materials, developed for astronomy and low-background applications. New focal plane arrays under development at RVS for the astronomy community will also be presented. Large sensor Chip Assemblies (SCAB) using various detector materials like Si:PINT, HgCdTe, InSb, and Si:As IBC, covering a detection range from visible to large wavelength infrared (LWIR) have been demonstrated with an excellent quantum efficiency and very good uniformity. These focal plane arrays have been assembled using state-of-the-art low noise, low power, readout integrated circuits (ROIC) designed at RVS. Raytheon packaging capabilities address reliability, precision alignment and flatness requirements for both ground-based and space applications. Multiple SCAs can be packaged into even larger focal planes. The VISTA telescope, for example, contains sixteen 2k X 2k infrared focal plane arrays. RVS astronomical arrays are being deployed world-wide in ground-based and space-based applications. A summary of performance data for each of these array types from instruments in operation will be presented (VIRGO Array for large format SWIR, the ORION and VISTA arrays, NEWFIRM and other solutions for MWIR spectral ranges).

关键词： infrared astronomy readouts megapixel focal plane array InSb HgCdTe Si : PIN Raytheon

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development and commercialization of MEMS in Taiwan - A bumpy exciting experience

Development and commercialization of MEMS in Taiwan - A bump...

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14th International conference on solid-state sensors, Actuators and Microsystems/21st European conference on solid-state Transducers

作者： Huang, Star Rueyshing Asia Pacific Microsyst Inc Hsinchu Taiwan

ISBN: (纸本)9781424408412

Advanced MEMS technologies, devices, applications, and commercialization have been in the focus of many international conferences for nearly two decades. However, successful commercialization of MEMS devices with volumes is only limited to a few products. This paper will discuss from various aspects how to enable this so-called enabling technology starting from development going through commercialization more effectively to shorten product's time-to-market.. The paper is organized in two parts;one is dealing with the infrastructure build-up for MEMS industry, and the other is sharing the personal experience in bringing a MEMS company from ground zero to the number three MEMS wafer foundry provider in the world within five years. It is identified that joint efforts and work together closely from the MEMS interested community right from the beginning is a key successful factor.

关键词： MEMS commercialization foundry Taiwan

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