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检索条件"任意字段=Conference on Solid State Sensor Arrays - Development and Applications"

共 1073 条记录，以下是351-360 订阅

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MiSPiA: Microelectronic Single-Photon 3D Imaging arrays for low-light high-speed Safety and Security applications

MiSPiA: Microelectronic Single-Photon 3D Imaging Arrays for ...

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conference on Emerging Technologies in Security and Defence;and Quantum Security II;and Unmanned sensor Systems X

作者： Tosi, Alberto Zappa, Franco Politecn Milan Dip Elettron Informaz & Bioingn I-20133 Milan Italy

ISBN: (纸本)9780819497680

This paper reports the achievements so far attained in the development of high-performance CMOS SPADs for single-photon sensitive 2D imagers, based on photon-counting and 3D ranging cameras. The latters are based on both the direct in-pixel measurement of the Time-of-Flight of each photon bouncing bounce from the scene back to the camera and the "indirect" phase-resolved method to count reflected photons in well-defined time slots, synchronous to the active illumination of the scene. MiSPiA SPADs are the new state-of-the-art among SPADs in CMOS technologies.

关键词： Single Photon Avalanche Diode (SPAD) 3D ranging photon counting Time-of-Flight (TOF)

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5.5 Dual-Tap Pipelined-Code-Memory Coded-Exposure-Pixel CMOS Image sensor for Multi-Exposure Single-Frame Computational Imaging

5.5 Dual-Tap Pipelined-Code-Memory Coded-Exposure-Pixel CMOS...

引用

2019 IEEE International solid-state Circuits conference, ISSCC 2019

作者： Sarhangnejad, Navid Katic, Nikola Xia, Zhengfan Wei, Mian Gusev, Nikita Dutta, Gairik Gulve, Rahul Haim, Harel Garcia, Manuel Moreno Stoppa, David Kutulakos, Kiriakos N. Genov, Roman University of Toronto Toronto Canada Synopsys Toronto Canada Fondazione Bruno Kessler Trento Italy Ams AG Ruschlikon Switzerland

ISBN: (纸本)9781538685310

Modern computational photography applications such as 3D sensing, gesture analysis, and robotic navigation drive the growing need for programmability, or coding, of the camera exposure at the individual-pixel level. Unlike conventional cameras, which record all light incident onto a pixel, the emerging class of coded-exposure-pixel (CEP) cameras can be programmed to selectively detect only some of that light [1] or, better, sort all of the light [2, 3], depending on the pixel code. In conjunction with a concurrently coded illumination, this enables a wide range of new coded multi-exposure single-readout-frame imaging capabilities at video rates. This work demonstrates such an image sensor where multiple pixel-wise-coded exposures, or subframes, are accumulated during one video frame. © 2019 IEEE.

关键词： Pixels

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Quantum efficiency and dark current evaluation of a backside illuminated CMOS image sensor

Quantum efficiency and dark current evaluation of a backside...

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International conference on solid state Devices and Materials (SSDM 2014)

作者： Vereecke, Bart Cavaco, Celso De Munck, Koen Haspeslagh, Luc Minoglou, Kyriaki Moore, George Sabuncuoglu, Deniz Tack, Klaas Wu, Bob Osman, Haris IMEC B-3001 Leuven Belgium Poongsan Corp CA Branch Sunnyvale CA 94085 USA

We report on the development and characterization of monolithic backside illuminated (BSI) imagers at imec. Different surface passivation, anti-reflective coatings (ARCs), and anneal conditions were implemented and their effect on dark current (DC) and quantum efficiency (QE) are analyzed. Two different single layer ARC materials were developed for visible light and near UV applications, respectively. QE above 75% over the entire visible spectrum range from 400 to 700nm is measured. In the spectral range from 260 to 400nm wavelength, QE values above 50% over the entire range are achieved. A new technique, high pressure hydrogen anneal at 20 atm, was applied on photodiodes and improvement in DC of 30% for the BSI imager with HfO2 as ARC as well as for the front side imager was observed. The entire BSI process was developed 200mm wafers and evaluated on test diode structures. The knowhow is then transferred to real imager sensors arrays. (C) 2015 The Japan Society of Applied Physics

关键词： Quantum efficiency

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Array of X and gamma ray scintillator detector for space gamma ray telescope application

Array of X and gamma ray scintillator detector for space gam...

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IEEE Nuclear Science Symposium/Medical Imaging conference

作者： Labanti, Claudio Marisaldi, Martino Fuschino, Fabio Bastia, Paolo Negri, Barbara Perotti, Francesco Soltau, Heike INAF IASF Dept Bologna Italy Thales Alenia Space Milano Milan Italy Agenzia Spaziale Italiana Rome Italy INAF IASF Dept Milan Italy PN Sensor Munche Germany Germany

ISBN: (纸本)9781424427147

A The instruments on board the latest gamma observatories (INTEGRAL, AGILE, GLAST) combines technologies based either on solid state or on scintillator detector, the first one being favorite when a low energy threshold and a good energy resolution is required, the latter being more convenient for large volume when worse performance are still acceptable. With the development of new scintillator materials and even more with new low-noise ligth readout devices the differences between the two techniques are narrowing and for some application the cheaper scintillator detector can compete with solid state devices. Furthermore both these detector concepts can be combined in a single compact device by means of the Pulse Shape Discrimination (PSD) technique that allows to discriminate direct interactions in silicon from scintillation events. Combined in arrays they can be the base for position senstive planes to be combined with coded mask in imaging instruments or the component of new generation Compton based telescopes. For this purpose two prototype systems have been designed and realized, both based on a 20 channels Silicon Drift Detectors (SDD) monolithic array coupled to individual 1 cm thick CsI(TI) scintillator crystals. In the first system the detector readout is implemented with ASICs tailored specifically to the SDD readout, while in the second system the PSD readout of the array is implemented. The performance of these kind of detectors tested in the various prototypes as well as their applications in new generation space telescopes are discussed.

关键词： Cesium iodide

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Fabrication and Electrochemical Characterization of Micro- and Nanoelectrode arrays for sensor applications

Fabrication and Electrochemical Characterization of Micro- a...

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16th conference in the Biennial sensors and their applications

作者： Said, Nur Azura Mohd Twomey, Karen Ogurtsov, Vladimir I. Arrigan, Damien W. M. Herzog, Gregoire Univ Coll Cork Tyndall Natl Inst Cork Ireland Malaysian Agr Res & Dev Inst Biotechnol Res Ctr Serdang Selangor Malaysia Curtin Univ Nanochem Res Inst Dept Chem Perth WA Australia

This paper describes the fabrication of microelectrode arrays, with two different geometries: disc (Designs d1 and d2) and band (Designs b1, b2 and b3) using three critical dimensions (100 nm, 1 mu m and 10 mu m) leading to 5 different designs, fabricated by the combination of UV photolithographic and e-beam lithographic techniques. Three silicon nitride layer thicknesses (200, 300 and 500 nm) were chosen to determine an optimized transducer design and fabrication process. Cyclic voltammetry characterisation using a simple redox probe ion, ferreocenecarboxylic acid in phosphate buffered saline electrolyte solution, demonstrated steady-state voltammetric curves for dl, d2, b1 and b2. A good agreement between experimental and theoretical data is found for devices dl, d2, b1 and b2. The experimental current for b3, on the other hand, is much lower compared to the calculated one- perhaps due to the overlapping of the diffusion layers of neighbouring microelectrodes in the array.

关键词： Fabrication

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In-Tube-Center Packaging of Flexible MEMS Airflow-Rate sensor and Its Sensitivity Enhancement 22

In-Tube-Center Packaging of Flexible MEMS Airflow-Rate Senso...

引用

22nd International conference on solid-state sensors, Actuators and Microsystems, Transducers 2023

作者： Al Farisi, Muhammad Salman Wang, Yang Hasegawa, Yoshihiro Matsushima, Miyoko Kawabe, Tsutomu Shikida, Mitsuhiro Hiroshima City University Hiroshima Japan Nagoya University Nagoya Japan

ISBN: (纸本)9784886864352

Micro-electro mechanical systems (MEMS) thermal flow sensors have been widely utilized for a wide spectrum of applications. Innovative fabrication processes using polymers have resulted in the development of their flexible alternatives which allowed mounting in a wider range of situations. To accurately measure airflow-rate using a MEMS flow sensor, the airflow region has to be defined and encapsulated. In this study, we propose a facile packaging method of flexible MEMS airflow-rate sensor. The thermal sensing structure was fabricated on a flexible polyimide film. The film was inserted into a resin tube through its taper-cut end and fixed at the center of the tube taking advantage of its buckling. Sensitivity and response speed enhancement were demonstrated by limiting the thermal loss to the substrate by introducing a sensor structure with double-layer substrate. © 2023 IEEJ.

关键词： Airflow-Rate sensor Flexible Device Packaging Thermal sensor

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FORCE SENSING CHIP DESIGNED FOR ROBOTIC AND MANUFACTURING AUTOMATION applications.

FORCE SENSING CHIP DESIGNED FOR ROBOTIC AND MANUFACTURING AU...

引用

Transducers '85: 1985 International conference on solid-state sensors and Actuators - Digest of Technical Papers.

作者： Petersen, Kurt Kowalski, Carl Brown, Joseph Allen, Henry Knutti, Jim Transensory Devices Fremont CA USA Transensory Devices Fremont CA USA

A novel, silicon-based force sensor has been developed which can be used either as single-element sensors or configured into dense tactile sensor arrays. The individual devices are composed of a micromachined silicon chip bonded to a micromachined glass substrate. The silicon chip contains transconduction and addressing circuitry on one side and is machined with a force concentrating bump on the back side. The glass substrate contains bonding pad metallization and recessed areas into which the silicon chip can be deflected. A special bonding pad arrangement provides each device with an X-Y wiring capability.

关键词： sensorS

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development of Long Term Stable Multiple-Ion-Selective sensors for Agriculture and Aquaculture applications 70

Development of Long Term Stable Multiple-Ion-Selective Senso...

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70th IEEE Electronic Components and Technology conference (ECTC)

作者： Chen, Yu Goh, Shermin S. Damalerio, Ramona Chen, Weiguo Choong, David Lim, Jason Y. C. Moh, Lionel C. H. Seah, Georgina E. K. K. Tan, Angeline Y. X. Inst Microelect IME SiP Medtech Singapore Singapore Inst Mat Res & Engn Soft Mat Singapore Singapore Inst Mat Res & Engn Elect Mat Singapore Singapore Inst Mat Res & Engn Adv Characterisat & Instrumentat Singapore Singapore Inst Mat Res & Engn Polymer Composite Singapore Singapore

ISBN: (纸本)9781728161808

An integrated multiplex all-solid-state, polymer membrane-based ion-selective-electrode was designed and fabricated. The device includes an on-chip Pt pseudo-reference electrode and three independent Au working electrode. Nitrate, potassium, and phosphate selective membranes are coated on three electrodes independently. The sensitivity, selectivity, and stability of the device are evaluated using a laboratory-made measurement circuit board for ion concentrations from 10 mu M to 100 mM.

关键词： Ion-selective-electrode all-solid-state sensor

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Three-dimensional laser radar with APD arrays

Three-dimensional laser radar with APD arrays

引用

conference on Laser Radar Technology and applications VI

作者： Heinrichs, RM Aull, BF Marino, RM Fouche, DG McIntosh, AK Zayhowski, JJ Stephens, T O'Brien, ME Albota, MA MIT Lincoln Lab Lexington MA 02420 USA

ISBN: (纸本)0819440728

M.I.T. Lincoln Laboratory is actively developing laser and detector technologies that make it possible to build a three-dimensional laser radar (3-D ladar) with several attractive features, including capture of an entire 3-D image on a single laser pulse, tens of thousands of pixels, few-centimeter range resolution, and small size, weight, and power requirements. The laser technology is based on diode-pumped solid-state microchip lasers that are passively Q-switched. The detector technology is based on Lincoln-built arrays of avalanche photodiodes (APD s) operating in the Geiger mode, with integrated timing circuitry for each pixel. The advantage of these technologies is that they offer the potential for small, compact, rugged, high-performance, systems which are critical for many applications.

关键词： Avalanche photodetectors LIDAR 3D image processing Laser development sensors Laser applications Pulsed laser operation Image processing Mirrors Semiconductor lasers

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A Run-time Temperature Monitoring with Adaptive Duty Cycle Control for FPGA applications 17

A Run-time Temperature Monitoring with Adaptive Duty Cycle C...

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17th IEEE International conference on solid-state and Integrated Circuit Technology, ICSICT 2024

作者： Li, Weizhi Chen, Wangyong Chen, Haifeng Zhang, Haoyu Cai, Linlin School of Microelectronics Science and Technology Sun Yat-sen University Guangzhou510275 China

ISBN: (纸本)9798350361834

To assist dynamic thermal management in FPGA based prototype system, this paper proposes a run-time temperature monitoring solution utilizing ring oscillators to monitor the temperature on different modules of FPGA projects and construct visual thermal maps of the full chips in HOST. To reduce the thermal overhead of the sensors based on ring oscillators, this paper proposes a feedback-driven adaptive duty cycle control technique and provides an indicator to quantify the cooling performance of this technique. Furthermore, the performance of monitoring system in terms of the thermal overhead, resolution and sensitivity of the configurable sensor network is comprehensively analyzed by experiments. © 2024 IEEE.

关键词： Field programmable gate arrays (FPGA)

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