A compact and superdirective particle velocity gradient (PVG) sensor based on two MEMS hot-wire acoustic particle velocity sensor (APVS) chips is proposed. The capability of directly measurement of second-order direct...
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ISBN:
(纸本)9780738125626
A compact and superdirective particle velocity gradient (PVG) sensor based on two MEMS hot-wire acoustic particle velocity sensor (APVS) chips is proposed. The capability of directly measurement of second-order directionality of acoustic field makes the PVG sensors are more competitive than currently used acoustic vector sensors or microphone arrays, while the compact design can broaden their working frequency. With the APVS spacing of 3.6mm, the measured directional patterns are all cosine squared shape up to 5 kHz, which demonstrated the feasibility for directly acquirement of second-ordered directionality. The sensor could be monolithic integrated to further shorten the spacing of velocity sensors, and to be more competitive for high-sound-frequency and narrow space directional acoustic sensing applications.
In this paper, we present experimental results from measurements on CMOS APS imager designed by CIMI-SUPAERO on two different technologies. In both cases, pixels with photoMos and photodiode structures have been desig...
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ISBN:
(纸本)0819427411
In this paper, we present experimental results from measurements on CMOS APS imager designed by CIMI-SUPAERO on two different technologies. In both cases, pixels with photoMos and photodiode structures have been designed. The first circuit has been developed using a standard CMOS DLP/DLM 1.2 mu m process from Austria Micro Systems. The detector array consists of 32x32 square pixels with 50 mu m pixel pitch;fill factor is 75 % for photodiode (PD) and 50 % for photoMos (PM). The circuit is also including row and column address decoders and the readout circuitry so as to perform on-chip correlated double-delta sampling to reduce column to column fixed pattern noise. Two other chips have been developed with a standard CMOS SLP/DLM process from MIETEC with 0.7 mu m design rules, which includes a 128x128 pixels array, with 21 mu m pixel pitch and analogue readout circuitry. Among 10 different arrays, no faulty one was observed for both circuits. In this paper, we compare both performances of 32x32 pixels and 128x128 pixels in terms of dark current, quantum efficiency, conversion gain, dynamic range, linearity and spatial uniformity.
Time-of-flight (ToF) sensors using light pulses or continuous waves allow accurate distance measurements. Three-dimensional imagers can be based on an array of timing or time-gated integration pixels. Single-photon av...
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Time-of-flight (ToF) sensors using light pulses or continuous waves allow accurate distance measurements. Three-dimensional imagers can be based on an array of timing or time-gated integration pixels. Single-photon avalanche diodes (SPADs) have been increasingly chosen as the pixel's photodetector device to develop fast, long-range ToF sensors. solid-state ToF cameras are replacing other alternatives, showing attractive characteristics and bringing up new potential applications. This paper presents the technical evolution of SPAD ToF 3D imaging sensors, and provides insight into their development over the last few decades. Starting with the first SPAD imagers reported in the early 2000's, various direct and indirect arrays up to present day state-of-the-art prototypes are referenced. The existing methods, options and possible implementations are described, addressing their advantages and drawbacks, and showing the progress yet to be made. The performance of the different presented approaches are given and compared.
This work presents an overview of progress and developments in the field of fiber optic sensor technology, highlighting the major issues underpinning recent research and illustrating a number of important applications...
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This work presents an overview of progress and developments in the field of fiber optic sensor technology, highlighting the major issues underpinning recent research and illustrating a number of important applications and key areas of effective fiber optic sensordevelopment. (C) 2000 Elsevier Science S.A. All rights reserved.
This paper presents three-axis micro strain gauge force-sensitive pillar arrays constructed of multiple layers of SU-8 and metal on quartz substrates to create transparent sensors for use in standard inverted microsco...
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ISBN:
(纸本)9781424408412
This paper presents three-axis micro strain gauge force-sensitive pillar arrays constructed of multiple layers of SU-8 and metal on quartz substrates to create transparent sensors for use in standard inverted microscopes. The sensor meets specific requirements for measuring tactile sensitivity and forces exerted during locomotion by small organisms such as fruit flies (Drosophila melanogaster), including: 1 mu N force sensitivity, >25 mu N range, and bio-compatibility. By virtue of its three-axis capability, this sensor has flexible applications for biological and non-biological force sensing.
Amorphous silicon diodes can be used as simple, two-terminal switches in active matrix addressing of display and image sensorarrays. These switching diodes provide an alternative to transistors with a simpler technol...
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Amorphous silicon diodes can be used as simple, two-terminal switches in active matrix addressing of display and image sensorarrays. These switching diodes provide an alternative to transistors with a simpler technology and fewer pixel connections. This paper discusses different addressing schemes in which switching diodes can be used and it reviews the device physics for these applications. In particular, it addresses the mechanisms of the dark steady-state I-V characteristics and the transient response of the diodes under typical operation conditions. The discussion gives a qualitative approach to the device physics, which is supported by computer modelling that uses complete expressions for occupancy, charge density and recombination. The defect density distribution is calculated from first principles using the defect-pool model.
Polymer-like silicon-rich SiNx:H films suitable for transparent VIS/NIR/MIR-range optical coatings were deposited by PECVD at a substrate temperature of 80 and 150 degreesC. Optical properties and film microstructure ...
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Polymer-like silicon-rich SiNx:H films suitable for transparent VIS/NIR/MIR-range optical coatings were deposited by PECVD at a substrate temperature of 80 and 150 degreesC. Optical properties and film microstructure were investigated by transmission/reflection measurements and by FTIR. Air exposure for more than 1 year reveals no post-oxidation with time. The application as an antireflective coating for IR-sensorarrays is demonstrated. (C) 2001 Elsevier Science BN. All rights reserved.
Self sharpening tips have been integrated on arrays of cantilevers provided with self exciting piezoelectric sensors (ZnO) by using monocrystalline silicon micromachining. Atomic force microscopy (AFM) images of grids...
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ISBN:
(纸本)0780338294
Self sharpening tips have been integrated on arrays of cantilevers provided with self exciting piezoelectric sensors (ZnO) by using monocrystalline silicon micromachining. Atomic force microscopy (AFM) images of grids with periods of 0.25 mu m, 1 mu m and 5 mu m and with height differences of 100 nm, 15 nm and 180 nm respectively have been achieved with single cantilevers.
Electron field emission from an array of patterned pyramids of polycrystalline diamond has been investigated for microsensorapplications. Selective deposition and molding of a polycrystalline diamond film in a silico...
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Electron field emission from an array of patterned pyramids of polycrystalline diamond has been investigated for microsensorapplications. Selective deposition and molding of a polycrystalline diamond film in a silicon cavity mold and subsequent creation of a freestanding polycrystalline diamond diaphragm with diamond pyramidal microtips has been achieved, The processing techniques are compatible with IC and micromachining technologies. High current emission from the patterned diamond microtip arrays is obtained at low electric fields. Field emission for these diamond microtips exhibits significant enhancement in total emission current compared to silicon emitters. Moreover, field emission from patterned polycrystalline diamond pyramidal-tip arrays is unique in that the applied field is found to be lower than that required for emission from Si, Ge, GaAs, and metal surfaces. The findings suggest the potential use of diamond-based field-emitter arrays in microsensors such as pressure sensors, accelerometers, and tactile sensors.
In recent years, increasing knowledge about in vitro cell handling and culturing has encouraged a variety of CMOS-based approaches to stimulate and detect electrical activity of biological cells. This paper outlines i...
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In recent years, increasing knowledge about in vitro cell handling and culturing has encouraged a variety of CMOS-based approaches to stimulate and detect electrical activity of biological cells. This paper outlines in a topical review the scope of cell-based biosensors and actuators for in vitro applications ranging from single-cell detection to multisite probing of complex neural tissue. Recent examples are selected to demonstrate how standard CMOS processes have been used to engineer arrays with different functionality.
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