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检索条件"任意字段=Conference on Solid State Sensor Arrays - Development and Applications"

共 1073 条记录，以下是771-780 订阅

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19.1 Optical Phased-Array FMCW LiDAR with On-Chip Calibration

19.1 Optical Phased-Array FMCW LiDAR with On-Chip Calibratio...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： SungWon Chung Makoto Nakai Samer Idres Yongwei Ni Hossein Hashemi University of Southern California Los Angeles CA

ISBN: (数字)9781728195490

ISBN: (纸本)9781728195506

Light detection and ranging (lidar) sensors provide high resolution and high accuracy for diverse applications such as autonomous vehicles and three-dimensional imagers. Over the past few years, there has been significant development towards compact, low-power, and low-cost realization of lidars. Recently, silicon-based large-scale optical phased arrays operating at around 1550nm [1 -4] along with their application in lidar [5] [6] have been demonstrated. A major challenge associated with large-scale optical phased arrays is the inevitable mismatches across the array that necessitate array calibration. At present, all large-scale arrays are calibrated by using an external optical detector for measuring focused far-field beam spot intensity [3] or infrared image sensors for measuring the far-field radiation patterns in the lab [1] [2] [6]. This solution, which requires an external detector at a far-field distance, naturally does not lend itself to large-scale field deployment of optical phased arrays for commercial applications with a compact form factor.

关键词： Phased arrays Laser radar Optical detectors Optical variables measurement Optical imaging Calibration Optical arrays

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A 4-Channel Ultrafast Wavelength-Swept REC-DFB Laser Array for Fiber Bragg Grating Interrogation

A 4-Channel Ultrafast Wavelength-Swept REC-DFB Laser Array f...

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2023 Asia Communications and Photonics conference/2023 International Photonics and Optoelectronics Meetings, ACP/POEM 2023

作者： Meng, Lingxin Dai, Pan Ban, Qilu Xu, Kaichuan Wang, Jiacheng Li, Zhen Wang, Feng Zeng, Jie Li, Shaobo Ma, Xiang Chen, Xiangfei Res. Center of Precision Photonics Integration and System Application of the Ministry of Education College of Engineering and Applied Sciences Nanjing University Key Lab. of Intelligent Optical Sensing and Manipulation of the Ministry of Education Engineering National Laboratory of Solid State Microstructures Nanjing210023 China Nanjing University of Aeronautics and Astronautics State Key Laboratory of Mechanics and Control for Aerospace Structures Nanjing210016 China The 54th Research Institute of China Electronics Technology Group Corporation Optical Communication Research and Development Center Shijiazhuang050081 China

ISBN: (纸本)9798350312614

We present a four-channel ultrafast wavelength-swept distributed feedback (DFB) semiconductor laser array based on the reconstruction-equivalent-chirp (REC) technique using instantaneous injection current modulation. With the aid of our designed laser driving circuit system consists of the microcontroller unit (MCU), field-programmable gate array (FPGA) and negative metal-oxide-semiconductor field effect transistors (n-MOSFETs), the precise pulse driving current for the 4-channel wavelength-swept REC-DFB laser array can be generated and a fast tuning of 16.424 nm within 10 μs is achieved. To further investigate the tuning performance of the proposed wavelength-swept laser source, we then applied it to the fiber Bragg grating (FBG) interrogation system and four FBG temperature sensor arrays were successfully demodulated. The development of high-efficient optical sensing systems heavily relies on the significance of the ultrafast wavelength-swept laser source, which has the potential to greatly enhance FBG interrogator performance in the future. © 2023 IEEE.

关键词： DFB laser array fast wavelength-swept fiber Bragg grating interrogation REC technique

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Flexible NH3 sensor Based on Polyaniline/Carbon Nanotubes with Detection Limit Down to PPB-Level

Flexible NH3 Sensor Based on Polyaniline/Carbon Nanotubes wi...

引用

International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： Xue Wang Changhui Zhao Gaoqiang Niu Fei Wang School of Microelectronics Southern University of Science and Technology China Institutes of Physical Science and Information Technology Anhui University China

We have developed a flexible gas sensor with MWCNT/PANI for ammonia detection. With a response of over 500% to 100 ppm of NH 3 , the sensor has shown excellent limit of detection as low as 300 ppb. The gas sensing performance of the device has been tested under various bending angles and cycles, showing its remarkable reliability and longevity. In addition, the sensor exhibits superior moisture resistance. Finally, the practical application of the sensor in an STM32-based embedded system is also demonstrated, which makes it a promising choice for the wearable electronics applications.

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Shape recovery from medical image data using extended superquadrics

Shape recovery from medical image data using extended superq...

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DETC2005: ASME International Design Engineering Technical conferences and Computers and Information in Engineering conference

作者： Bhabhrawala, Talib Krovi, Vankat View Engineering Inc. 1175 North Street Rochester NY 14621 United States Mechanical and Aerospace Engineering State University of New York at Buffalo 318 Jarvis Hall Buffalo NY 14260 United States

ISBN: (纸本)079184739X

Rapid and representative reconstruction of geometric shape models from surface measurements has applications in diverse arenas ranging from industrial product design to biomedical organ/tissue modeling. However, despite the large body of work, most shape models have had limited success in bridging the gap between reconstruction, recognition, and analysis due to conflicting requirements. On one hand, large numbers of shape parameters are necessary to obtain meaningful information from noisy sensor data. On the other hand, search and recognition techniques require shape parameterizations/abstractions employing few robust shape descriptors, The extension of such shape models to encompass various analysis modalities (in the form of kinematics, dynamics and FEA) now necessitates the inclusion of the appropriate physics (preferably in parametric form) to support the simulation based refinement process. Thus, in this paper we discuss development of a class of parametric shape abstraction models termed as extended superquadrics, The underlying geometric and computational data structure intimately ties together implicit-, explicit- and parametric- surface representation together with a volumetric solid representation that makes them well suited for shape representation. Furthermore, such models are well suited for transitioning to analysis, as for example, in model-based non rigid structure and motion recovery or for mesh generation and simplified volumetric-FEA applications. However, the development of the concomitant methods and benchmarking is necessary prior to widespread acceptance. We will explore some of these aspects further in this paper supported with case studies of shape abstraction from image data in the biomedical/life-sciences arena whose diversity and irregularities pose difficulties for more traditional models. Copyright © 2005 by ASME.

关键词： Medical imaging

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Arc suppression coatings for electrodynamic tethers and spacecraft cabling

Arc suppression coatings for electrodynamic tethers and spac...

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作者： Bilén, Sven G. Gilchrist, Brian E. Pennsylvania State University Department of Engineering Design Electrical Engineering and Aerospace Engineering 213N Hammond Bldg. PA 16802 United States University of Michigan Electrical Engineering and Space Science 1301 Beal Ave. Ann Arbor MI 48109 United States

ISBN: (纸本)9781563479793

Advanced insulation materials are needed to support future electrodynamic tether missions as well as for other high voltage applications requiring direct exposure to vacuum/space plasma conditions, such as cabling to solar arrays. Some of the desired characteristics of these materials include the ability to resist damage from low-Earth-orbit environments (including atomic oxygen and micrometeoroids);insulating materials with high dielectric strengths and flexible enough to prevent damage;and conductors and coatings that have low electrical resistance. A particularly important concern is the need for electrical discharge/arc prevention and suppression if the electrical insulation is breached. In the case of discharges in a vacuum, the insulation material often becomes the gas source to feed the discharge. We have performed some preliminary work to identify, develop, and test these advanced coatings. The approach we are proposing for suppressing the discharge is including in the coating an encapsulated or entrapped electronegative gas, liquid, or solid that are released upon impact or at the onset of a discharge suppressing the growth and continuation of the discharge. This paper discusses the mechanisms for arc creation, preliminary tests we have preformed to suppress arc creation, and a path forward for development of such coatings. Copyright © 2009 by the American Institute of Aeronautics and Astronautics, Inc.

关键词： Coatings

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applications of a novel cell micropatterning process for long-term neuron and cell culture

Applications of a novel cell micropatterning process for lon...

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International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： W.C. Chang D.W. Sretavan Departments of Ophthalmology and Physiology University of California San Francisco USA

We show several applications for a unique method for creating user-friendly, micropatterned substrates for neuron and cell culture. With neurons, we demonstrated that our micropatterns can separate cell bodies and axons while organizing them in orderly arrays for easy experimentation. These micropatterned neuron cultures also persisted for weeks, enabling maturation and development of presynaptic structures and potentially allowing the explicit design of neuronal circuits. Beyond neurons, we also demonstrated the culture of fibroblasts on the patterned substrates and showed that these cell types likewise remained viable and highly compliant to a variety micropatterns.

关键词： Neurons Cells (biology) Nerve fibers Substrates Shape control Physiology Neuroscience Biomedical engineering Organizing Circuits

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Flexible, printed tactle, friction, and temperature sensor array for artificial skin

Flexible, printed tactle, friction, and temperature sensor a...

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International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： Shingo Harada Kenichiro Kanao Yuki Yamamoto Takayuki Arie Seiji Akita Kuniharu Takei Osaka Prefecture University Sakai Osaka Japan

This paper describes printed, flexible, tactile, friction, and temperature sensors for the applications of an artificial electronic skin (e-skin). Conventional e-skin reported previously does not have the capability to detect friction in addition to tactile and temperature that allows us to imitate human functionalities and hold an object without dropping and/or breaking. This is due to difficulty of device fabrication on a flexible substrate. Furthermore, a printing technique is required to realize macroscale and low-cost flexible devices for the practical application. Here, we address these two challenges by arranging the structure of devices and developing the inks and printing technique.

关键词： Strain Force Temperature sensors Friction Temperature measurement arrays

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"A low power, low noise, mixed signal switched CMOS charge sensitive readout chain"

"A low power, low noise, mixed signal switched CMOS charge s...

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European conference on solid-state Circuits (ESSCIRC)

作者： C. Kapnistis K. Misiakos N. Haralabidis Institute of Microelectronics N.C.S.R. Demokritos Athens Greece

A CMOS charge sensitive readout chain for pixel applications, has been designed and fabricated in 0.8 µm technology. The system is capable of simultaneous position sensing and energy measurement. Each pixel circuitry incorporates both analog and digital features to perform the dual tasks. The overall gain of the chain is 340 mV/fC. With an ENC of 61 e and a power consumption of 1.8 mW per pixel at 3.3V it is a promising solution for pixel X-ray detectors. The paper describes the system architecture and reports experimental measurements.

关键词： Detectors Switches Microelectronics Spectroscopy Energy measurement Energy consumption sensor arrays Integrated circuit noise Silicon Operational amplifiers

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Technology trend and challenges in high power semiconductor laser packaging

Technology trend and challenges in high power semiconductor ...

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Electronic Components and Technology conference (ECTC)

作者： Xingsheng Liu Wei Zhao State Key Laboratory of Transient Optics and Photonics Xi'an Institute of Optics and Precision Mechanics Chinese Academy and Sciences Xi'an China

High power semiconductor lasers have found increased applications in pumping of solid state laser systems for industrial, military and medical applications as well as direct material processing applications such as welding, cutting, and surface treatment. Driven by low cost, longer lifetime and new applications, the requirements of high power semiconductor lasers have been changed and the demand for new products has been accelerated in recent years. As a result, the packaging technologies of high power semiconductor lasers have been highly developed and have become more sophisticated. In this paper, we review and discuss the technology development trend of high power semiconductor lasers, including single emitters, bars, horizontal bar arrays and vertical bar stacks. However, the packaging technology is still one of the bottlenecks of the advancement of high power semiconductor lasers. We will discuss the challenges and issues in high power laser packaging and some approaches and strategies in addressing the challenges and issues will be presented.

关键词： Power lasers Semiconductor lasers Semiconductor device packaging Surface emitting lasers Semiconductor laser arrays Laser beam cutting Pump lasers solid lasers Laser excitation Defense industry

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Aids to developing testable custom LSI

Aids to developing testable custom LSI

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IEEE International conference on solid-state Circuits (ISSCC)

作者： D. Caughey Bell-Northern Research Ottawa Canada

The development of adequate, economical tests for custom LSI circuits is a vital, but increasingly difficult task. Custom chips of VLSI circuit complexity will soon be the norm, with ever widening applications in new products. This session will accent approaches to testing and testability of custom LSI. The usefulness of computer aids for circuit design verification and test vector generation, and the merits of rigorous design philosophies which guarantee testability, will be assessed.

关键词： Large scale integration Logic testing Circuit testing Circuit simulation Circuit faults Design automation Logic arrays Chip scale packaging Logic design Logic circuits

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