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检索条件"任意字段=Conference on Solid State Sensor Arrays - Development and Applications"

共 1073 条记录，以下是821-830 订阅

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Composite photopolymer microstructures: from planar to 3D devices

Composite photopolymer microstructures: from planar to 3D de...

引用

International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： P. Renaud S. Metz S. Jiguet A. Bertsch EPFL Microsystem LaboratorySTI-LMIS EPFL Lausanne Switzerland

In this paper, a survey is made of some technologies in which the photo-definable polymer is used as structural material and where physical properties of polymers are modified to change porosity, mechanical or electrical properties. The paper is organized in three sections: (a) 2D, multilayer photopolymers, (b) High aspect ratio and (c) 3D micro-stereolithography technologies. In addition the authors mention some development in which photo-polymerization is used to locally create special structures.

关键词： Microstructure Electrodes Polymers Polyimides Silicon Etching sensor arrays Resists Laboratories Micromechanical devices

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A CMOS photodiode array with in-pixel data acquisition system

A CMOS photodiode array with in-pixel data acquisition syste...

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European conference on solid-state Circuits (ESSCIRC)

作者： R. Steadman A. Kemna F. Morales G. Vogtmeier E. Ozkan W. Brockherde B. Hosticka Philips Research Laboratories Aachen Germany Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany

A CMOS photodetector array with in-pixel electronics has been developed for computed tomography (CT) applications. Consisting of 10/spl times/20 pixel array in-pixel electronics has been designed to achieve 17 bits dynamic range and a quantum limited system under CT operating range. A series of limitations have been overcome to integrate both photodiode and a charge-sensing amplifier at pixel level.

关键词： Photodiodes Data acquisition Computed tomography Photodetectors sensor arrays CMOS process Capacitance Capacitors Laboratories Microelectronics

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A 16b microprocessor for realtime applications

A 16b microprocessor for realtime applications

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IEEE International conference on solid-state Circuits (ISSCC)

作者： S. Mor H. Hingarh M. Vora D. Wilnai T. Longo Fairchild Advanced Research and Development Laboratories Palo Alto CA USA

A 160K transistor/16b microprocessor, using a 20MHz clock which executes additions in 200ns and multiplies in 1.85μs, will be discussed. The chip (128K mil 2 I 3 L) includes floating point instructions, 16 levels of ... 详细信息

关键词： Microprocessors Registers Central Processing Unit Circuit faults Read only memory Throughput Clocks Pipeline processing Logic design Programmable logic arrays

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sensor packaging method based on the solid tire sole of wheel-legged robot

Sensor packaging method based on the solid tire sole of whee...

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Artificial Intelligence, Robotics, and Communication (ICAIRC), IEEE International conference on

作者： Chao Huang Yaodong Wang Min Guo Meng Hong Hubei Provincial Engineering Research Center of Robotics&Intelligent Manufacturing Wuhan University of Technology Wuhan China

ISBN: (数字)9798331531225

ISBN: (纸本)9798331531232

For wheel-legged robots, the unique wheel-legged structure significantly influences the dynamics and kinematic behavior of the foot during ground contact. This paper presents a resistive strain gauge sensor integration scheme for solid tires, wherein sensors are embedded within the tires to actively monitor the touchdown information of the foot-end. A method is proposed for embedding the solid tires in circumferential arrays to capture the plantar strain state, which supports the control system of wheel-legged robots. To evaluate the effectiveness of this sensor package, a simulated impact experiment was conducted to simulate the wheel-legged ground contact. The experimental results demonstrate that the strain gauge embedding method effectively detects the strain response of solid tires under impact. Since ground contact information is crucial for the autonomous switching of the wheel-legged structure in robots, the successful implementation of this sensing system for ground contact monitoring holds significant potential for both research and practical engineering applications.

关键词： Switches Robot sensing systems solids Strain measurement Tires sensors Mobile robots Robots Monitoring Strain

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The direct field sensor: a mature solid state metering technology

The direct field sensor: a mature solid state metering techn...

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Sixth International conference on Metering Apparatus and Tariffs for Electricity Supply 1990

作者： N.R. Hannah M.R. Pollock Landis and Gyr Energy Management (UK) Limited UK

The trend towards solid-state solutions in electricity metering is well established. Many technologies have become available each with its claim to special suitability for particular applications but none has yet established itself as the successor to the once-dominant Ferraris metering element. The reason for this is that Ferraris metering elements were widely applicable to the whole range of prevailing market needs, whether for simple single-rate domestic devices or for the most complex polyphase devices with capabilities for reactive energy measurement and impulsing outputs. No solid-state technology was able to offer the same universal flexibility, but a breakthrough in the development of a Hall-effect based transducer has changed this. The new technology is known as Vertical Hall and it overcomes the hitherto practical difficulties, namely temperature, linearity and offset problems, which have excluded it from metering applications in the past. The authors describe the Vertical Hall devices in particular the direct field sensor.< >

关键词： Hall effect devices Magnetic transducers Power system measurements Watthour meters

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Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects

Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-W...

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2023 IEEE Biomedical Circuits and Systems conference, BioCAS 2023

作者： Dawes, Jacob Chou, Tzu-Hsuan Johnston, Matthew L. Oregon State University School of Electrical Engineering and Computer Science CorvallisOR United States

ISBN: (纸本)9798350300260

Heterogeneous integration of integrated circuits with microfluidic devices and front-end sensors/transducers has demonstrated potential to improve the performance of biological and chemical instrumentation due the close coupling of front-end electronics with the sensor interface. Due to scale mismatch between electrical and microfluidic interconnects/devices, integration of these lab-on-CMOS systems often necessitates large, planar packages. Wafer-level overmolding, a commonly used approach for manufacturing system-in-package components, has been shown as a promising packaging solution for hybrid integration of CMOS and microfluidic systems;integrated circuit dice can be packaged in a common, compression-molded epoxy substrate with planar electrical and microfluidic redistribution layers defined photolithographically. However, fixed-mask approaches limit the ability to rapidly prototype, reconfigure, and re-design, increasing time for development cycles. Recent developments in high resolution direct-write 3D-printing have proven viable in depositing a wide range of materials at the package level. In this work, we demonstrate the use of high-resolution 3D-printing for direct-write fabrication of electrical interconnects in conjunction wafer-level overmolding and planar co-integration of CMOS with microfluidic structures. The fabrication process flow is detailed along with functional demonstrations of on-chip optical transmission measurements and particle counting in a microfluidic channel, demonstrating future utility in cytometry and other emerging lab-on-CMOS applications. © 2023 IEEE.

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Investigation of volumetric three-dimensional display technologies

Investigation of volumetric three-dimensional display techno...

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International conference on Display Technology, ICDT 2020

作者： Yan, Gewei Li, Jiayi Zhao, Chenxi Lu, Zengxiang Liu, Zhaojun Department of Electric and Electronic Engineering Southern University of Science and Technology Shenzhen China Faith Billion Technology Development Co. Ltd. Hong Kong

The three-dimensional display is an important future land for the display industry. To reach a three-dimensional display, several methods have been improved. For volumetric three-dimensional display, due to a physical three-dimensional display volume, the three-dimensional image can provide an all-around viewing without wearing any equipment. This article reviews several volumetric display methods using solid-state volumetric display technology, free-space volumetric technology, swept volume display technology combined with light field display technology. We discuss the benefits of using various display mediums and structure for a good performance in different situations. © 2021, John Wiley and Sons Inc. All rights reserved.

关键词： Three dimensional displays

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ACE16K: An advanced focal-plane analog programmable array processor

ACE16K: An advanced focal-plane analog programmable array pr...

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European conference on solid-state Circuits (ESSCIRC)

作者： G. Linan R. Dominguez-Castro S. Espejo A. Rodriguez-Vazquez CNM-CSIC Edificio CICA-CNM Instituto de Microelectrónica de Sevilla (IMSE-CNM) Seville Spain

This paper presents a new generation 128×128 Focal-Plane Analog Programmable Array Processor (FP-APAP), from a system level perspective. It has been manufactured in a 0.35µm standard digital 1P-5M CMOS Technology. The chip has been designed to achieve the high-speed and moderate-accuracy (∼8bits) requirements of most real time image processing applications. It has been designed to be easily embedded in conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four millions transistors, 80% of them working in analog mode, and exhibits a relatively low power consumption (<4W, i.e. less than 1µW per transistor). Computing vs. power peak values are in the order of 1TeraOPS/W, while maintained VGA (640×480)processing throughputs of 100Frames/s are possible with about 10-20 basic image processing tasks on each frame.

关键词： Hip Image processing Circuits Pixel Machine vision Retina Optical arrays sensor arrays Optical sensors Electronic mail

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Investigation of bowing effect of 4’’ epitaxial wafer and reliability of gan-based micro-led devices 57th

Investigation of bowing effect of 4’’ epitaxial wafer and ...

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57th SID International Symposium, Seminar and Exhibition, Display Week, 2020

作者： Zhang, Ke Liu, Yibo Cha, Ka Wah Yeung, Sze-Yan Sun, Xiaowei Liu, Zhaojun Kwok, Hoi-Sing State Key Laboratory of Advanced Displays and Optoelectronics Technologies The Hong Kong University of Science and Technology Hong Kong Department of Electrical and Electronic Engineering Southern University of Science and Technology China

GaN-based Micro-LEDs have shown great potential in various filed, such as solid-state lighting, display, sensor, visible light communication and multifunctional devices. The performance of Micro-LEDs in various operating environment drew enormous attention recently. We investigate the fabrication process of Micro-LED devices with 4’’ epitaxial wafer. The problems occurred during the process, especially bowing effect, were systematically introduced. Several solutions have been proposed and compared. In addition, the characterization and reliability test were measured to show sufficient quality of those devices. © 2020 SID.

关键词： Light emitting diodes

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The development and evaluation of solid-state detector arrays for high energy x-ray imaging

The development and evaluation of solid-state detector array...

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IEEE Symposium on Nuclear Science (NSS/MIC)

作者： Yulan Li Yuanjing Li Shaofeng Wang Shuwei Li Huilin He Department of Engineering Physics Tsinghua University Beijing China Nuctech Company Limited Beijing China

ISBN: (纸本)0780382579

Several detector modules which consist of linear CdWO/sub 4/ crystal arrays optically coupled to photodiode arrays were developed for a high energy X-ray NDT system. An electron linear accelerator (LINAC) which produces pulsive X rays with maximum energy of 9 MeV is used for X ray source. 16 channels were assembled in each module, with crystal size of 0.8 mm /spl times/ 5 mm /spl times/ 30 mm and pitch size of 1.3 mm. Lead spacers were placed between crystals to reduce the cross-talk. Based on M-C simulation, the detection efficiency of the detector can reach 70%, energy deposit rate 30%, while crosstalk can be reduced to 5%. After fabrication, we tested their performances under the radiation sources of /sup 60/Co, 6 MeV LINAC and 9 MeV LINAC. The results show that the arrays satisfy the meet of the NDT system.

关键词： solid state circuits X-ray detection X-ray detectors sensor arrays X-ray imaging Optical arrays Linear particle accelerator Electron optics Optical crosstalk Optical coupling

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