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检索条件"任意字段=Conference on Solid State Sensor Arrays - Development and Applications"
1073 条 记 录,以下是821-830 订阅
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Composite photopolymer microstructures: from planar to 3D devices
Composite photopolymer microstructures: from planar to 3D de...
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International conference on solid state sensors and Actuators (TRANSDUCERS)
作者: P. Renaud S. Metz S. Jiguet A. Bertsch EPFL Microsystem LaboratorySTI-LMIS EPFL Lausanne Switzerland
In this paper, a survey is made of some technologies in which the photo-definable polymer is used as structural material and where physical properties of polymers are modified to change porosity, mechanical or electri... 详细信息
来源: 评论
A CMOS photodiode array with in-pixel data acquisition system
A CMOS photodiode array with in-pixel data acquisition syste...
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European conference on solid-state Circuits (ESSCIRC)
作者: R. Steadman A. Kemna F. Morales G. Vogtmeier E. Ozkan W. Brockherde B. Hosticka Philips Research Laboratories Aachen Germany Fraunhofer Institute of Microelectronic Circuits and System Duisburg Germany
A CMOS photodetector array with in-pixel electronics has been developed for computed tomography (CT) applications. Consisting of 10/spl times/20 pixel array in-pixel electronics has been designed to achieve 17 bits dy... 详细信息
来源: 评论
A 16b microprocessor for realtime applications
A 16b microprocessor for realtime applications
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IEEE International conference on solid-state Circuits (ISSCC)
作者: S. Mor H. Hingarh M. Vora D. Wilnai T. Longo Fairchild Advanced Research and Development Laboratories Palo Alto CA USA
A 160K transistor/16b microprocessor, using a 20MHz clock which executes additions in 200ns and multiplies in 1.85μs, will be discussed. The chip (128K mil 2 I 3 L) includes floating point instructions, 16 levels of ... 详细信息
来源: 评论
sensor packaging method based on the solid tire sole of wheel-legged robot
Sensor packaging method based on the solid tire sole of whee...
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Artificial Intelligence, Robotics, and Communication (ICAIRC), IEEE International conference on
作者: Chao Huang Yaodong Wang Min Guo Meng Hong Hubei Provincial Engineering Research Center of Robotics&Intelligent Manufacturing Wuhan University of Technology Wuhan China
For wheel-legged robots, the unique wheel-legged structure significantly influences the dynamics and kinematic behavior of the foot during ground contact. This paper presents a resistive strain gauge sensor integratio... 详细信息
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The direct field sensor: a mature solid state metering technology
The direct field sensor: a mature solid state metering techn...
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Sixth International conference on Metering Apparatus and Tariffs for Electricity Supply 1990
作者: N.R. Hannah M.R. Pollock Landis and Gyr Energy Management (UK) Limited UK
The trend towards solid-state solutions in electricity metering is well established. Many technologies have become available each with its claim to special suitability for particular applications but none has yet esta... 详细信息
来源: 评论
Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects
Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-W...
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2023 IEEE Biomedical Circuits and Systems conference, BioCAS 2023
作者: Dawes, Jacob Chou, Tzu-Hsuan Johnston, Matthew L. Oregon State University School of Electrical Engineering and Computer Science CorvallisOR United States
Heterogeneous integration of integrated circuits with microfluidic devices and front-end sensors/transducers has demonstrated potential to improve the performance of biological and chemical instrumentation due the clo...
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Investigation of volumetric three-dimensional display technologies
Investigation of volumetric three-dimensional display techno...
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International conference on Display Technology, ICDT 2020
作者: Yan, Gewei Li, Jiayi Zhao, Chenxi Lu, Zengxiang Liu, Zhaojun Department of Electric and Electronic Engineering Southern University of Science and Technology Shenzhen China Faith Billion Technology Development Co. Ltd. Hong Kong
The three-dimensional display is an important future land for the display industry. To reach a three-dimensional display, several methods have been improved. For volumetric three-dimensional display, due to a physical... 详细信息
来源: 评论
ACE16K: An advanced focal-plane analog programmable array processor
ACE16K: An advanced focal-plane analog programmable array pr...
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European conference on solid-state Circuits (ESSCIRC)
作者: G. Linan R. Dominguez-Castro S. Espejo A. Rodriguez-Vazquez CNM-CSIC Edificio CICA-CNM Instituto de Microelectrónica de Sevilla (IMSE-CNM) Seville Spain
This paper presents a new generation 128×128 Focal-Plane Analog Programmable Array Processor (FP-APAP), from a system level perspective. It has been manufactured in a 0.35µm standard digital 1P-5M CMOS Techn... 详细信息
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Investigation of bowing effect of 4’’ epitaxial wafer and reliability of gan-based micro-led devices  57th
Investigation of bowing effect of 4’’ epitaxial wafer and ...
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57th SID International Symposium, Seminar and Exhibition, Display Week, 2020
作者: Zhang, Ke Liu, Yibo Cha, Ka Wah Yeung, Sze-Yan Sun, Xiaowei Liu, Zhaojun Kwok, Hoi-Sing State Key Laboratory of Advanced Displays and Optoelectronics Technologies The Hong Kong University of Science and Technology Hong Kong Department of Electrical and Electronic Engineering Southern University of Science and Technology China
GaN-based Micro-LEDs have shown great potential in various filed, such as solid-state lighting, display, sensor, visible light communication and multifunctional devices. The performance of Micro-LEDs in various operat... 详细信息
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The development and evaluation of solid-state detector arrays for high energy x-ray imaging
The development and evaluation of solid-state detector array...
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IEEE Symposium on Nuclear Science (NSS/MIC)
作者: Yulan Li Yuanjing Li Shaofeng Wang Shuwei Li Huilin He Department of Engineering Physics Tsinghua University Beijing China Nuctech Company Limited Beijing China
Several detector modules which consist of linear CdWO/sub 4/ crystal arrays optically coupled to photodiode arrays were developed for a high energy X-ray NDT system. An electron linear accelerator (LINAC) which produc... 详细信息
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