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IEEE International conference on solid-state Circuits (ISSCC)

作者： Hoi-Jun Yoo Alison Burdett KAIST Daejeon South Korea Toumaz Abingdon UK

Recently, wireless protocols related to BAN (Body Area Networks) are under standardization by the IEEE 802.15 (Personal Area Networks, PAN) committee, to enable interoperability of a wide range of applications in the areas of medical support, healthcare monitoring and con sumer wellness electronics. BAN requirements are closely related to PAN or WSN (wireless sensor network) technologies; however a major difference in BAN applications is that human body should be carefully considered not only as a possible communication medium or an obstacle to the signal transport, but also taking into account the possibility of physiological effects resulting from the chosen EM wave fre quency. This Special Evening Topic session will present the current status of Body Area Network standard development, and explore proposed solutions and applications with a strong focus on integrated circuit implementations. As an introduction, the IEEE BAN standard process will be reviewed, including its historical background and current status. Following this, further technical details including MAC and PHY layers and security protocols will be addressed. Integrated circuit solutions for BAN applications will be disclosed, and examples of BAN application requirements, especially for ambulatory patient monitoring, will be discussed.

关键词： Wireless sensor networks Body area networks Wireless communication Security Medical services Protocols Atmospheric modeling

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Skewed-redundant Hall-effect Magnetic sensor Fusion for Perturbation-free Indoor Heading Estimation 4

Skewed-redundant Hall-effect Magnetic Sensor Fusion for Pert...

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4th IEEE International conference on Robotic Computing (IEEE IRC)

作者： Karimi, Mojtaba Babaians, Edwin Oelsch, Martin Aykut, Tamay Steinbach, Eckehard Tech Univ Munich Dept Elect & Comp Engn Munich Germany Stanford Univ Dept Elect Engn Stanford CA 94305 USA

ISBN: (纸本)9781728152370

Robust attitude and heading estimation with respect to a known reference is an essential component for indoor localization in robotic applications. Affordable Attitude and Heading Reference Systems (AHRS) are typically using 9-axis solid-state MEMS-based sensors. The accuracy of heading estimation on such a system depends on the Earth's magnetic field measurement accuracy. The measurement of the Earth's magnetic field using MEMS-based magnetometer sensors in an indoor environment, however, is strongly affected by external magnetic perturbations. This paper presents a novel approach for robust indoor heading estimation based on skewed-redundant magnetometer fusion. A tetrahedron platform based on Hall-effect magnetic sensors is designed to determine the Earth's magnetic field with the ability to compensate for external magnetic field anomalies. Additionally, a correlation-based fusion technique is introduced for perturbation mitigation using the proposed skewed-redundant configuration. The proposed fusion technique uses a correlation coefficient analysis for determining the distorted axis and extracts the perturbation-free Earth's magnetic field vector from the redundant magnetic measurement. Our experimental results show that the proposed scheme is able to successfully mitigate the anomalies in the magnetic field measurement and estimates the Earth's true magnetic field. Using the proposed platform, we achieve a Root Mean Square Error of 12.74 degrees for indoor heading estimation without using an additional gyroscope.

关键词： Hall effect

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development of a wireless environmental sensor system and MEMS-based RF circuit components

Development of a wireless environmental sensor system and ME...

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International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： Euisik Yoon Kwang-Seok Yun Department of Electrical Engineering and Computer Science Korea Advanced Institute of Science and Technology Daejeon South Korea

ISBN: (纸本)0780389948

This paper reports a miniaturized environmental sensor system integrated with RF communication module. This system has been developed for on-site monitoring of water pollution by heavy metal ions. The system is composed of an electrochemical sensor, a custom potentiostat module, and an RF module for wireless communication. Also, the authors presented monolithic MEMS VCOs integrated with high-Q MEMS inductors and MEMS transmission lines for low-power wireless transceiver applications. Phase noise of the proposed MEMS VCOs has been improved by more than 7 dBc/Hz compared with their CMOS counterparts at 1MHz offset from center frequencies of 5GHz and 13 GHz, respectively.

关键词： Wireless sensor networks sensor systems Radio frequency Circuits Micromechanical devices Monitoring Water pollution Wireless communication Inductors Transmission lines

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Through the Looking Glass - The 2017 Edition: Trends in solid-state Circuits from ISSCC

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IEEE solid-state Circuits Magazine 2017年第1期9卷 12-22页

作者： Denis C. Daly Laura C. Fujino Kenneth C. Smith Omni Design Technologies Billerica MA USA University of Toronto Canada

The International solid-state Circuits conference (ISSCC) is the flagship conference of the IEEE solid-state Circuits Society. This year, the theme for ISSCC 2017 is "Intelligent Chips for a Smart World." Advances in solid-state circuits and systems continue to propel the ongoing fusion between the physical and virtual worlds. With the resulting growth in sensor deployment, data traffic, and data-center workloads, future systems must employ "intelligent" chips at all levels of the system stack to improve the efficiency at which we acquire, network, store, and process information. Modern applications centered around the Internet of Everything (IoE) and real-time data analytics are driving circuit and system designers toward new ways of leveraging the immense device density and processing power of modern technology. ISSCC covers a spectrum of design approaches in various technical areas and advances, broadly categorized as analog systems, analog-to-digital data-conversion systems, communication systems, digital systems, and innovative topics such as micromachines and microelectromechanical systems (MEMS), imagers, sensors, and biomedical devices, as well as forward-looking solutions that may be several years away from becoming commercial. The ten ISSCC technical subcommittees annually update their analyses of industry trends for the benefit of the community at large. This article summarizes some of these views in selected technical areas.

关键词： solid-state circuits Meetings Market research Random access memory Integrated circuits Standards development Memory management Nonvolatile memory CMOS technology

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LOW-COST LWIR-BAND CMOS INFRARED (CIR) MICROBOLOMETERS FOR HIGH VOLUME applications 33

LOW-COST LWIR-BAND CMOS INFRARED (CIR) MICROBOLOMETERS FOR H...

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33rd IEEE International conference on Micro Electro Mechanical Systems (MEMS)

作者： Akin, Tayfun MikroSens Elekt San & Tic AS Ankara Turkey Middle East Tech Univ METU MEMS Ctr Ankara Turkey Middle East Tech Univ Elect & Elect Engn Dept Ankara Turkey

ISBN: (纸本)9781728135816

This paper provides an overview of the studies and the current status for the development of a novel, low-cost, and CMOS foundry compatible approach for implementing microbolometers with standard CMOS and simple post-CMOS subtractive MEMS processes. This CMOS infrared detector technology is shortly called as the CMOS IR (CIR) technology, and it can be used to implement Focal Plane arrays (FPAs) for infrared imaging in the LWIR-band (8-12 mu m wavelength). Post-CMOS processes require only one mask lithography process and simple subtractive etching steps to obtain suspended bulk micromachined microbolometer pixels, where the detector element can be formed with standard CMOS layers and devices such as n-well layers, diodes, polysilicon, and some other CMOS layers and devices. sensors of various pitch sizes (such as 70 mu m, 60 mu m, 50 mu m, and 35 mu m) and various FPA formats (such as 160x120, 80x80, and 40x40) have been demonstrated;some of these studies resulted in real commercial products in a VC funded spin-off company. The recent commercial products have a 35 mu m pixel pitch implemented using a 0.18 mu m CMOS process. One of these is a 80x80 microbolometer FPA has a die size of 5.4mmx6.5 mm and dissipates 20mW;the fabricated sensor is measured to provide NETD values of 163 mK at 17 fps and 71 mK at 4 fps with f/1.0 optics in a dewar, while using only the standard CMOS layers. When this FPA is wafer level vacuum packaged with a silicon cap wafer with one side AR coating, it provides a 112 mK NETD at 4 fps with f/1.1 optics. Another commercial product is the 160x120 FPA, which has a die size of 9.3 mm x 9.1 mm and dissipates less than 50 mW at 30 fps while operating with a 3.3V suppy. The sensor is measured to provide peak NETD values of 161 mK, 117 mK, and 90 mK at 17 fps, 11 fps, and 4 fps, respectively, in a dewar with f/1.0 optics. These performances are more than enough for a number high volume low-cost consumer market applications like advanced presence det

关键词： Microbolometer low-cost thermal imaging uncooled thermal imaging CMOS Infrared (CIR) Technology CMOS MEMS LWIR thermal cameras readout integrated circuit (ROIC)

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A CMOS Molecular sensor for Personalized Diagnostics Featuring Enzyme-Free Reading and Encoding of Viral Variants at Single-Nucleotide Resolution

A CMOS Molecular Sensor for Personalized Diagnostics Featuri...

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European conference on solid-state Circuits (ESSCIRC)

作者： Marco Saif Fuze Jiang Hangxing Liu Adam Wang Zhikai Huang Yuguo Sheng Dongwon Lee Thomas Burger Hua Wang Integrated Devices Electronics And Systems (IDEAS) Group ETH Zürich Switzerland Integrated Systems Laboratory (IIS) ETH Zürich Switzerland

ISBN: (数字)9798350388138

ISBN: (纸本)9798350388145

This paper introduces a CMOS electrochemical molecular sensor array, specifically designed for personalized diagnostics. For the first time, it facilitates highly sensitive and time-effective detection of viral variants on CMOS at single-nucleotide polymorphism (SNP) resolution and demonstrates on-chip DNA reading and molecular-level digital encoding capabilities. The SARS-CoV-2 RNA and its D614G mutation are used to validate the CMOS molecular sensor performance. The sensor array comprises 4096 three-electrode electrochemical pixels with a pitch size of $36 \times 36 ~ \mu\mathrm{m}^sensor$ using 40 nm CMOS technology. Within each sensor pixel, the array integrates an ultra-compact current input continuous-time sigma-delta ADC (I- $\Sigma \Delta$ ADC) for direct current-to-digital conversion, ensuring robustness against environmental noise and interference during personalized diagnostic applications. Each CMOS sensor pixel consumes only $21.4 \mu\mathrm{W}$.

关键词： Sigma-delta modulation Working environment noise RNA DNA Metals Encoding Robustness System-on-chip sensors sensor arrays

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An energy-efficient ASIC with real-time work-on-demand for wireless body sensor network

An energy-efficient ASIC with real-time work-on-demand for w...

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IEEE conference on Electron Devices and solid-state Circuits

作者： Zhihua Wang Xiaoyu Zhang Xinkai Chen Lingwei Zhang Hanjun Jiang Institute of Microelectronics Tsinghua University Beijing China Department of Electronic Engineering Tsinghua University Beijing China

This paper presents an energy efficient ASIC design with the capability of real-time work-on-demand, targeting on the applications of wireless body sensor network (WBSN), especially on those for medical and heath purposes. Application specific requirements have been reviewed. A novel type of sensor node architecture is proposed with a hybrid of active/passive transceivers. The passive RF receiver with zero standby current gives the WBSN nodes the real capability of work-on-demand which is not allowed in previous architectures. A power management module with an optimized power mode control scheme has also implemented to provide various supply voltages for the sensor nodes, and in addition this module can provide the sensor nodes a flexible power mode control for the purpose of energy saving. An ultra-low-power MCU which supports the proposed architecture has been integrated in the ASIC, which can perform the functions of media access, signal flow control and networking. The proposed architecture has been verified through FPGA experiments, and the ASIC has been designed and fabricated using a standard 0.18 um CMOS process. The designed ASIC occupies a die area of 2 mm times 2.5 mm. The digital core of this ASIC has 72.8 K equivalent gate counts excluding the memories. A typical WBSN sensor node can be built with this ASIC in together with a commercial RF transceiver, the sensor parts and some other components, and our ASIC can serve as the main control part for such a node.

关键词： Energy efficiency Application specific integrated circuits Wireless sensor networks Body sensor networks Transceivers Radio frequency Voltage control Energy management Field programmable gate arrays CMOS process

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Continuous terahertz omnidirectional beam steering by dual diffraction of metagratings

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Photonics Research 2023年第1期11卷 44-54页

作者： JIE-RONG CHENG YANG YANG SAI CHEN QI-YE WEN YUN-YUN JI FEI FAN SHENG-JIANG CHANG Institute of Modern Optics Nankai UniversityTianjin 300350China Tianjin Key Laboratory of Micro-Scale Optical Information Science and Technology Tianjin 300350China School of Electronic and Information Engineering Beihang UniversityBeijing 100191China State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of ChinaChengdu 610054China Tianjin Key Laboratory of Optoelectronic Sensor and Sensing Network Technology Tianjin 300350China

Dynamic beam steering with unlimited angular range and fast speed remains a challenge in the terahertz gap,which is urgently needed for next-generation target tracking,wireless communications,and imaging *** from metasurface phased arrays with element-level phase control,here we steer the beam by globally engineering the diffraction of two cascaded metagratings during in-plane *** from large-angle diffraction and flexible on/off control of the diffraction channels,a pair of metagratings with optimized supercells and proper orientation successfully directs the incoming beam towards any arbitrary direction over the transmission half space,with the steering speed improved more than twice that of the small-angle diffractive ***-beam and dual-beam steering within the solid angle of 1.56πand elevation angle of±77°has been demonstrated with average throughput efficiency of 41.4%at 0.14 THz,which can be generalized to multiple-beam *** dual diffraction engineering scheme offers a clear physical picture for beamforming and greatly simplifies the device structure,with additional merits of large aperture and low power consumption.

关键词： beam directional globally

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Ti-Ni SMA Film-Actuated 2-D Multi-Probe Array for Scanning Probe Nano-Lithography on a Wide Area

Ti-Ni SMA Film-Actuated 2-D Multi-Probe Array for Scanning P...

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International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： Y. Okamura T. Namazu D. Kamoyama N. Urushihara T. Sasaki T. Nagamura Y. Isono Department of Mechanical and System Engineering University of Hyogo Hyogo Japan Department of Micro System Technology Ritsumeikan University Shiga Japan Project Development Department Unisoku Company Limited Osaka Japan Unisoku Company Limited Osaka Japan

This paper describes design and fabrication of a Ti-Ni shape-memory alloy (SMA) film-actuated single crystal silicon (SCS) multi-probe device utilized for scanning probe nano-lithography (SPNL). This research focuses on the development of the device that can realize fabrication of a nanoscale mask pattern on a few millimeters square area. The designed device consists of Ti-Ni SMA film-actuated 8 times 8 writing-probes with an Au film-coated tip, and 2 times 2 tilt-adjustment probes with a piezo-resistive sensor. The SMA actuation mechanism yields a contact or non-contact state between a probe-tip and a sample surface, which indicates that SPNL turns on or off . The tilt-adjustment system can make a spacing between the device and a wafer constant. We have succeeded in fabricating the SPNL multi-probe array device, which has the potential for realization of accurate mask patterning on a few millimeters square area.

关键词： Probes Fabrication Nanoscale devices Shape memory alloys Nanoelectromechanical systems Millimeter wave devices sensor arrays Silicon Micromechanical devices Lithography

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Evolving the Medipix2 Technology For Use As An Active Space Radiation Dosimeter

Evolving the Medipix2 Technology For Use As An Active Space ...

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IEEE conference on Aerospace

作者： L. Pinsky J. Chancellor D. Minthaka Physics Department University of Houston Houston TX USA

As reported last year, a new solid state detector, known as Medipix, developed by a consortium of academic institutions has been evolved from a technology originally created for use at the LHC at CERN in Geneva, Switzerland. This technology is being harnessed for use as an active personal dosimeter for space radiation applications. The pixel based technology embeds the entire required readout electronics for each pixel within the pixel's 55 micron square footprint. That allows the seamless tiling of multiple arrays of detectors. Ultimate versions may be deployed that are both wireless and self-contained, as well as having a package size comparable to current passive personal dosimeters. Prospect are excellent for building them into spacesuits, which would provide ground-based real-time monitoring of the detailed doses being taken by crew members during such high-risk periods as EVAs. These dosimeters could also be used as active area monitors in a variety of both space and ground-based applications. An advanced version of this technology, known as TimePix, that effectively incorporates a pixel-by-pixel Analog to Digital Conversion (ADC) capability has recently become available, and we anticipate that a report of initial accelerator tests of the capability of this version will be reported at the conference, although those results are not available at the time of the submission of this paper.

关键词： Space technology Detectors solid state circuits Large Hadron Collider Readout electronics sensor arrays Electronics packaging Monitoring Analog-digital conversion Life estimation

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