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检索条件"任意字段=Conference on Solid State Sensor Arrays and CCD Cameras"

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Camera on a chip

Camera on a chip

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： B. Ackland A. Dickinson AT and T Bell Laboratories Inc. Holmdel NJ USA

Recent advances in video compression and digital networking technology, combined with the ever increasing power of PCs and workstations, are creating enormous opportunities to develop new multimedia products and services built upon sophisticated voice, data, image and video processing. This will create a significant demand for compact, low-cost, low-power electronic cameras for video and still image capture. These cameras will be a standard peripheral on all PCs bundled for multimedia applications. Given that in excess of 60M PCs will be sold this year, a sizable new market for electronic cameras is being created.

关键词： cameras sensor arrays Charge coupled devices Costs Charge-coupled image sensors Personal communication networks Video compression Layout Streaming media Video equipment

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Improved color filter process for ccd and CMOS imagers

Improved color filter process for CCD and CMOS imagers

引用

IEEE/SEMI conference and Workshop on Advanced Semiconductor Manufacturing

作者： H. Miller Image Sensor Technology Polaroid Corporation Cambridge MA USA

Several different methods exist for converting monochromatic solid-state imagers into color. One of the first techniques was to rotate a color filter wheel in front of the sensor for each exposure. More recently, high-definition cameras align three different sensors and separate the color signals using dichroic filters mounted on a prism. Yet another method, known as "on-chip" color filters, applies a pattern of colored elements directly to the surface of the sensor. This type of filter is commonly produced by depositing successive layers and transferring a dye through a patterned photoresist. At Polaroid Corporation, color filters are produced in a unique, single-step photolithographic process by incorporating a dye directly into the resist prior to coating. The patterned photoresist and dye combination is then baked to stabilize the filter element against the next coating of colored photoresist. These color filters can often be sensitive to the high temperature bakes as well as other heat treatments found in the packaging process. Often the resist will reflow and discolor, thus reducing the resolution, sensitivity and production yield of the device. We are proposing a solution for eliminating or reducing the hard bakes between color by treating the filter elements with a silylating compound capable of cross-linking the photoresist by incorporating silicon into the polymeric chain. This process eliminates three baking steps and reduces the risk of reflowing and yellowing the resist as well as degrading the dye. Furthermore, the filters are sufficiently stabilized by silylation such that they can survive the high temperatures required for producing microlenses and completing the packaging process. A preferred silylation compound is hexamethylcyclotrisilazane (HMCTS). This same silylation compound can also be used to promote adhesion of the dyed photoresist layers and to replace a separate treatment by other commonly used silylation compounds such as hexamethyldisila

关键词： Color Filters Charge coupled devices CMOS process Resists Coatings Packaging CMOS image sensors Image converters solid state circuits

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1/3-Inch 630 k-pixel IT-ccd image sensor with multi-function capability

1/3-Inch 630 k-pixel IT-CCD image sensor with multi-function...

引用

Proceedings of the 1995 IEEE International solid-state Circuits conference

作者： Fujikawa, Kazuhide Hirota, Isao Mori, Hiroyuki Matsuda, Takeshi Sato, Mitsuru Takamura, Youji Kitayama, Satoshi Suzuki, Junya SONY Corp Kanagawa Japan

Added to a vibration stabilizer and an electronic zoom now considered indispensable functions, high-quality 16:9 wide pictures that follow wide-aspect TV sets increasing in consumer markets, enhanced picture resolution and special features of consumer video cameras are anticipated. A 1/3-inch 630 k-pixel IT-ccd image sensor with multi-function capability meets these demands. For lower power consumption, 3.3 V driving horizontal-ccd is used. Bias-preadjust circuits using analog memories are built on the ccd chip, enabling a substrate bias to be free from external adjustment and a reset gate to be driven with 3.3 V pulses without external bias adjustment.

关键词： Image sensors

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INTELLIGENT CMOS IMAGING

INTELLIGENT CMOS IMAGING

引用

conference on Charged-Coupled Devices and solid state Optical sensors V

作者： DENYER, PB RENSHAW, D SMITH, SG VLSI VISION LTD EDINBURGH EH12 7BFSCOTLAND

ISBN: (纸本)0819417629

We report on the integration of computational and control functions with image sensor arrays using commodity CMOS processes. The sensors are highly efficient, high density arrays of photo-diodes, with a minimal overhead of one transistor per pixel. We report production arrays of up to 786 X 576 pixels of 10.5 micrometers pitch in 0.8 micrometers double metal single poly CMOS. We also report techniques presently in development to achieve 7.5 micrometers pitch in the same technology. These sensors are fully self-contained with regard to drive and sense electronics. Typical off-chip needs are limited to a clock crystal, supply regulator and some decoupling capacitors. `Intelligence' is provided in the form of analogue and digital functions integrated on the same chip as the sensors. Such functions can include 8- bit ADC, on-chip exposure control and computational functions to achieve color restoration. Integration of these parts allows us to construct a single chip color camera. Results from a proto-type color CMOS camera system are given. Successful realization of these functions leads to order of magnitude reductions in system cost, size and power-consumption when compared to the ccd alternative.

关键词： PASSIVE PIXEL sensor INTEGRATED CMOS sensor-PROCESSOR COLOR CMOS CAMERA

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E-O framing: Technology overview and demonstration results

E-O framing: Technology overview and demonstration results

引用

Optical Engineering Midwest 95 conference

作者： LAREAU, AG RECON OPT INC BARRINGTONIL 60010

ISBN: (纸本)0819419869

Electronic imaging technology has advanced to the point where sophisticated wafer-scale imaging devices are on the verge of being fielded for demanding military reconnaissance applications. High-density, 4-Mpixel, and 25-Mpixel silicon ccd detectors have been fabricated and integrated into a proof-of-concept reconnaissance sensor, the CA-260. One unique feature of this sensor is its ability to compensate for image motion during very high- speed imaging conditions. This paper discusses the patented detector architecture and system design considerations of the CA-260, and review the results of flight tests conducted on various military aircraft during 1993 and 1994.

关键词： cameras sensors Reconnaissance Fourier transforms Image quality ccd image sensors Image sensors Staring arrays Power supplies Patents

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Zoom lens calibration for wind tunnel measurements

Zoom lens calibration for wind tunnel measurements

引用

Videometrics IV conference

作者： BURNER, AW NASA LANGLEY RES CTRHAMPTONVA 22381

ISBN: (纸本)0819419621

This report summarizes an investigation of zoom lens calibration, with emphasis on the effects of lens-image-plane misalignment. Measurements have been made of the photogrammetric principal point and radial (symmetrical) and decentering (asymmetrical) distortion components as a function of the principal distance (zoom setting) of several zoom lenses. Data were also taken with the axis of symmetry (optical axis) of a zoom lens aligned and misaligned to the same solid-state video camera. An explanation is offered regarding the variation of the principal point as a function of zoom setting based on these measurements. In addition the relationship of the decentering distortion to radial distortion, principal distance, and lens- image-plane misalignment angle is discussed. A technique for determining the proper point of symmetry to be used for distortion computations (as opposed to the principal point) is also suggested. A simple technique for measuring the misalignment angle of zoom lenses when attached to video cameras is presented, along with measurements for seven solid-state cameras. A method to reduce the additional error introduced by zoom lens misalignment is presented. The implications of this study are that special measures to properly align a zoom lens to the sensor image plane are probably not necessary, but that as the accuracy obtainable in digital photogrammetry approaches the 0.01 or less pixel level, additional calibration including the point of symmetry for distortion computation should be considered.

关键词： CALIBRATION ZOOM LENSES DECENTERING DISTORTION ASYMMETRICAL DISTORTION MISALIGNED IMAGE PLANE POINT OF SYMMETRY VIDEO cameras ccd WIND TUNNEL

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Magnetic pattern recognition sensor arrays using ccd readout 25

Magnetic pattern recognition sensor arrays using CCD readout

引用

25th European solid state Device Research conference, ESSDERC 1995

作者： Nixon, O. Nathan, Arokia Electrical and Computer Engineering University of Waterloo WaterlooONN2L 3G1 Canada Physical Electronics Laboratory ETH Hoenggerberg ZurichCH-8093 Switzerland

ISBN: (纸本)286332182X

Magnetic encoding is currently widely employed in cheques, transaction cards, access cards and bank notes because of its robustness, economy, security, and ease of updating coded information. Coded magnetic information is currently read using either inductive metal-in-gap (MIG) or magnetoresistive (MR) heads.1)Due to various loss mechanisms, the signal-to-noise ratio of MIG heads peaks at around 100 kHz, decreasing rapidly at higher frequencies. The fabrication of both the MIG head2)as well as the accompanying signal processing circuitry3)is also non-trivial. MR heads provide higher SNR and signals that are independent of spatial frequency. They are however fragile, non-linear, and have a high temperature coefficient In cheques and bank notes, human-readable magnetic ink character recognition (MICR) characters are employed. Each MICR character has been designed to produce a distinct inductive head signal pattern. Unlike magnetic stripes, MICR characters signals are not binary when read using conventional read heads, resulting in increased read error rates. To avoid costly misreads, a closely spaced array of magnetic sensors can be utilized. Fabrication of read head arrays is, however, difficult in both technologies. A silicon magnetic sensor array fabricated using the charge-coupled device (ccd) technology has been designed to overcome these limitations. The magnetic sensor pixels are buried-channel MOSFET's with geometries designed to optimize magnetic sensitivity. The use of buried-channel, as opposed to surface-channel, MOSFET's results in enhanced sensitivity, lower noise, and higher signal resolution. © 1995 Editions Frontieres.

关键词： Signal to noise ratio

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A 5k-pixel ccd linear image sensor with adjacent RGB photodiode rows

A 5k-pixel CCD linear image sensor with adjacent RGB photodi...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： M. Kojima T. Watanabe K. Hirata T. Takamura Y. Hiroshima Matsushita Electronics Corporation Kyoto Japan

A 5000-element ccd linear image sensor with adjacent RGB photodiode rows has read-out signal charge of the middle row by charge transfer through a vacant neighboring photodiode row. Conventional color sensors have an interval from 6 to 8 lines between neighboring photodiode rows, and have several disadvantages, such as large memory required to compensate positional differences in red, green, and blue arrays, weakness against fluctuation of scan speed and so on. The device reported in this paper eliminates the above problems.

关键词： Charge coupled devices Image sensors Photodiodes Shift registers Charge transfer sensor arrays Clocks Circuits Fluctuations Filters

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Magnetic pattern recognition sensor arrays using ccd readout

引用

1995年 273-273页

作者： Nathan, N.O.A.

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A 1/3-inch 630 k-pixel IT-ccd image sensor with multi-function capability

A 1/3-inch 630 k-pixel IT-CCD image sensor with multi-functi...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： K. Fujikawa I. Hirota H. Mori T. Matsuda M. Sato Y. Takamura S. Kitayama J. Suzuki SONY Corporation Atsugi Kanagawa Japan Sony Corp. Kanagawa Japan

Recent agreement on specifications for DV-C (digital video for consumer) is going to accelerate enhancing of picture resolution and special features of consumer video cameras. Added to a vibration stabilizer and an electronic zoom now considered indispensable functions, high-quality 16:9 wide picture that follows wide-aspect TV sets increasing in consumer markets is anticipated. This high-resolution multi-function ccd meets these demands. For lower power consumption, 3.3 V driving of H-ccd is used. Bias-preadjust circuits using analog memories are built on the ccd chip, enabling a substrate (VOFD) bias to be free from external adjustment and a reset gate to be driven with 3.3V pulses without external bias adjustment.

关键词： Image sensors Charge coupled devices Circuits Roentgenium Consumer electronics Energy consumption Frequency Clocks TV Analog memory

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