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检索条件"任意字段=Conference on Solid State Sensor Arrays and CCD Cameras"

共 194 条记录，以下是11-20 订阅

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Performances of a solid Streak Camera Based on Conventional ccd with Nanosecond Time Resolution

Performances of a Solid Streak Camera Based on Conventional ...

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International conference on Photonics and Optical Engineering (icPOE)

作者： Wang, Bo Bai, Yonglin Zhu, Bingli Gou, Yongsheng Xu, Peng Bai, Xiaohong Liu, Baiyu Qin, Junjun Chinese Acad Sci Xian Inst Opt & Precis Mech State Key Lab Transient Opt & Photon Xian 710119 Peoples R China Chinese Acad Sci Xian Inst Opt & Precis Mech Key Lab Ultra Fast Photoelect Diagnost Technol Xian 710119 Peoples R China Chinese Acad Sci Grad Sch Beijing 100049 Peoples R China

ISBN: (纸本)9781628415650

The classical streak cameras use a vacuum tube making thus fragile, cumbersome and expensive. Here we report a monolithic solid-state streak camera that overcomes these limitations and offers nanosecond temporal resolution. It consists of a 1-D linear array of 512 integrated photodiodes, followed by fast analog buffers and onchip, 511-deep analog frame storage. As a proof of concept, the dynamic operation of the sensors is exposed. Measurements show that time resolution better than 15 ns.

关键词： solid streak camera CMOS image sensor nanosecond time resolution

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6.2 133Mpixel 60fps CMOS image sensor with 32-column shared high-speed column-parallel SAR ADCs

6.2 133Mpixel 60fps CMOS image sensor with 32-column shared ...

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Ryohei Funatsu Steven Huang Takayuki Yamashita Kevin Stevulak Jeff Rysinski David Estrada Shi Yan Takuji Soeno Tomohiro Nakamura Tetsuya Hayashida Hiroshi Shimamoto Barmak Mansoorian NHK Science & Technology Research Laboratories Tokyo Japan Forza Silicon Pasadena CA

To realize next-generation highly realistic sensation broadcasting systems, the research and development of 8K ultrahigh-definition television (UHDTV) systems have been promoted. To realize 8K video cameras, 33Mpixel sensors [1-2] and a full-resolution camera system that uses three 33Mpixel sensors [3] have been reported. However, the weight of the camera with three sensors is over 40kg because the camera requires a large-format color-separation prism. To reduce the size of the camera, single-chip imaging is a promising approach, and a compact single-chip 8K camera that weighs only 2kg has already been developed using a color 33Mpixel CMOS image sensor [4]. However, a conventional single-chip camera has a lower image quality than a full-resolution camera because the total pixel count of the single-sensor camera is only one-third of that of the three-sensor camera, and pixel interpolation is required to configure a full-resolution image. In this paper, a 133Mpixel sensor that can be operated at 60fps to realize a full-resolution 8K single-chip camera is described. To achieve both high speed and suitable ADC resolution, 32-column multiplexing analog readout circuitry and 14b high-speed redundant successive approximation register (SAR) ADCs [5] are adopted. As a result, a full-size image with a data rate of 128.71Gb/s at 60fps has been captured.

关键词： sensors cameras Timing arrays Image sensors Random access memory Electronics packaging

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7.6 A 512×424 CMOS 3D Time-of-Flight image sensor with multi-frequency photo-demodulation up to 130MHz and 2GS/s ADC

7.6 A 512×424 CMOS 3D Time-of-Flight image sensor with mult...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： Andrew Payne Andy Daniel Anik Mehta Barry Thompson Cyrus S. Bamji Dane Snow Hideaki Oshima Larry Prather Mike Fenton Lou Kordus Pat O'Connor Rich McCauley Sheethal Nayak Sunil Acharya Swati Mehta Tamer Elkhatib Thomas Meyer Tod O'Dwyer Travis Perry Vei-Han Chan Vincent Wong Vishali Mogallapu William Qian Zhanping Xu Microsoft Mountain View CA

Interest in 3D depth cameras has been piqued by the release of the Kinect motion sensor for the Xbox 360 gaming console. This paper presents the pixel and 2GS/s signal paths in a state-of-the-art Time-of-Flight (ToF) sensor suitable for use in the latest Kinect sensor for Xbox One. ToF cameras determine the distance to objects by measuring the round trip travel time of an amplitude-modulated light from the source to the target and back to the camera at each pixel. ToF technology provides an accurate high pixel resolution, low motion blur, wide field of view (FoV), high dynamic range depth image as well as an ambient light invariant brightness image (active IR) that meets the highest quality requirements for 3D motion detection.

关键词： Logic gates cameras Dynamic range Modulation arrays CMOS integrated circuits Clocks

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Kirana: a solid-state megapixel uCMOS image sensor for ultra-high speed imaging

Kirana: a solid-state megapixel uCMOS image sensor for ultra...

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conference on sensors, cameras, and Systems for Industrial and Scientific Applications XIV

作者： Crooks, J. Marsh, B. Turchetta, R. Taylor, K. Chan, W. Lahav, A. Fenigstein, A. STFC Rutherford Appleton Lab Didcot Oxon England

ISBN: (纸本)9780819494320

This paper describes a solid-state sensor for ultra-high-speed (UHS) imaging. The 'Kirana' sensor was designed and manufactured in a 180 nm CMOS technology to achieve full-frame 0.7 Megapixel video capture at speeds at 2 MHz. The 30 mu m pixels contain a pinned photodiode, a set of 180 low-leakage storage cells, a floating-diffusion, and a source follower output structure. Both the individual cells and the way they are arranged in the pixel are novel. The pixel architecture allows correlated double sampling for low noise operation. In the fast mode, the storage cells are operated as a circular buffer, where 180 consecutive frames are stored until receipt of a trigger;up to 5 video-bursts per second can be read out. In the 'slow' mode, the storage cells act like a pipeline;the sensor can be read out like a conventional sensor at a continuous frame rate of 1,180 fps. The sensor architecture is fully scalable in resolution since memory cells are located inside each pixel. The pixel architecture is scalable in memory depth (number of frames) as a trade-off with pixel size, dependent on application. The present implementation of 0.7 Mpixels has an array focal plane which is optimized for standard 35 mm optics, whilst offering a competitive 180-frame recording depth. The sensor described has been manufactured and is currently being characterized. Operation of the sensor in the fast mode at 2 million frames per second has been achieved. Details on the camera/sensor operation are presented together with first experimental results.

关键词： High speed imaging ccd in CMOS Burst mode Million frames per second

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A 1024×8 700ps time-gated SPAD line sensor for laser raman spectroscopy and LIBS in space and rover-based planetary exploration

A 1024×8 700ps time-gated SPAD line sensor for laser raman ...

引用

IEEE International conference on solid-state Circuits (ISSCC)

作者： Yuki Maruyama Jordana Blacksberg Edoardo Charbon Delft University of Technology Delft Netherlands Jet Propulsion Laboratory Pasadena CA USA

In this paper, we present an all-digital, 1024x8, time-resolved SPAD line sensor designed for time-resolved laser Raman spectroscopy and laser induced breakdown spectroscopy (LIBS). The block diagram of the system is shown in Fig. 6.7.1. The sensor consists of 16 groups of 64x8 SPAD arrays with fast readout interface electronics. The SPAD gate width and its delay are controlled by a combination of off-chip (Maxim DS1020, 1ns/tap) and on-chip delay lines (250ps/tap) resulting in a temporal resolution of 250ps through typical scan ranges of 32ns. Properly balanced binary trees allow less than 98.5ps skew variation across the entire chip. The proposed line sensor has a fill factor of 44.3% with a photon detection probability (PDP) of 21% at 475nm at an excess bias of 3.5V. The 24.6mm long focal plane matches the format of a typical detector that would be used at the output of a Raman spectrometer (e.g. ccd), allowing the observation of the entire Raman spectrum without the use of any moving parts, thus reducing complexity, overall power consumption, and weight.

关键词： Logic gates Raman scattering Fluorescence arrays Photonics Semiconductor device measurement Lasers

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An APS-C format 14b digital CMOS image sensor with a dynamic response pixel

An APS-C format 14b digital CMOS image sensor with a dynamic...

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2011 IEEE International solid-state Circuits conference, ISSCC 2011

作者： Pates, Dan Lyu, Jeong-Ho Osawa, Shinji Takayanagi, Isao Sato, Toshiaki Bales, Tim Kawamura, Katsuyuki Pages, Eduard Matsuo, Shinichiro Kawaguchi, Tetsuji Sugiki, Tadashi Yoshimura, Norio Nakamura, Junichi Ladd, John Yin, Zhiping Iimura, Russell Fan, Xiaofeng Johnson, Scott Rayankula, Aditya Mauritzson, Rick Agranov, Gennadiy Aptina San Jose CA United States Aptina Tokyo Japan Aptina Bracknell United Kingdom

ISBN: (纸本)9781612843001

CMOS image sensors are now used in a variety of camera applications, such as mobile phones, camcorders, and digital still cameras (DSCs). In particular, most digital single-lens reflex (DSLR) cameras and so called "mirror-less" cameras that require a large-format sensor also employ CMOS image sensors due to their lower power consumption and higher readout speed compared to their ccd counterparts. © 2011 IEEE.

关键词： CMOS integrated circuits

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An angle-sensitive CMOS imager for single-sensor 3D photography

An angle-sensitive CMOS imager for single-sensor 3D photogra...

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2011 IEEE International solid-state Circuits conference, ISSCC 2011

作者： Wang, Albert Gill, Patrick R. Molnar, Alyosha Cornell University Ithaca NY United States

ISBN: (纸本)9781612843001

Conventional cameras capture 2D photographs at a single plane of focus. Acquisition of a 3D photograph with multiple planes of focus typically requires scanning the focus of a single camera [1], or using arrays of cameras or lenses [2]. This paper demonstrates a 150kpixel image sensor, which captures 3D scenes. The chip is manufactured in commodity 0.18μm CMOS and requires only a single convex lens at a fixed focal length in ambient light. © 2011 IEEE.

关键词： CMOS integrated circuits

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An APS-C format 14b digital CMOS image sensor with a dynamic response pixel

An APS-C format 14b digital CMOS image sensor with a dynamic...

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Dan Pates Jeong-Ho Lyu Shinji Osawa Isao Takayanagi Toshiaki Sato Tim Bales Katsuyuki Kawamura Eduard Pages Shinichiro Matsuo Tetsuji Kawaguchi Tadashi Sugiki Norio Yoshimura Junichi Nakamura John Ladd Zhiping Yin Russell Iimura Xiaofeng Fan Scott Johnson Aditya Rayankula Rick Mauritzson Gennadiy Agranov Aptina Imaging Inc. San Jose CA USA Aptina Imaging Inc. Tokyo Japan Aptina Imaging Inc. Bracknell UK

CMOS image sensors are now used in a variety of camera applications, such as mobile phones, camcorders, and digital still cameras (DSCs). In particular, most digital single-lens reflex (DSLR) cameras and so called “mirror-less” cameras that require a large-format sensor also employ CMOS image sensors due to their lower power consumption and higher readout speed compared to their ccd counterparts.

关键词： Pixel CMOS image sensors Noise Logic gates arrays cameras

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A micro camera utilizing a microlens array for multiple viewpoint imaging

A micro camera utilizing a microlens array for multiple view...

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International conference on solid state sensors and Actuators (TRANSDUCERS)

作者： B. Aldalali C. Li L. Zhang H. Jiang Department of Electrical and Computer Engineering University of Wisconsin Madison Madison WI USA Eye Research Institute University of Wisconsin Madison WI USA University of Wisconsin Madison Madison WI US

We present the concept and realization of a micro plenoptic camera to achieve multiple viewpoint imaging with one single image capture and without moving the camera. The micro plenoptic camera is based on lightfield photography where the camera captures the 4-dimensional lightfield and images it onto a 2-dimensional ccd sensor through the use of a microlens array. The microlens array was fabricated using the photoresist reflow process. We realized both a simulated micro camera with a 2mm aperture, a 69×69 microlens array of 50μm pitch size and a 5 megapixel ccd, as well as an experimental camera with a 15.2mm aperture, a 97×97 microlens array of 240μm pitch size and a 1 megapixel ccd.

关键词： Lenses Microoptics cameras arrays Resists Pixel Charge coupled devices

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Multisensor Configurations for Early Sniper Detection

Multisensor Configurations for Early Sniper Detection

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conference on Electro-Optical Remote Sensing, Photonic Technologies, and Applications V

作者： Lindgren, D. Bank, D. Carlsson, L. Dulski, R. Duval, Y. Fournier, G. Grasser, R. Habberstad, H. Jacquelard, C. Kastek, M. Otterlei, R. Piau, G-P. Pierre, F. Renhorn, I. Sjoqvist, L. Steinvall, O. Trzaskawka, P. FOI Swedish Def Res Agcy Box 1165 SE-58111 Linkoping Sweden EADS Deutschland GmbH D-89077 Ulm Germany Mil Univ Technol PL-00908 Warsaw Poland EADS France Innovat Works F-92152 Suresnes France CILAS F-45063 Orleans France Snipos AS N-3606 Kongsberg Norway

ISBN: (纸本)9780819488145

This contribution reports some of the fusion results from the EDA SNIPOD project, where different multisensor configurations for sniper detection and localization have been studied. A project aim has been to cover the whole time line from sniper transport and establishment to shot. To do so, different optical sensors with and without laser illumination have been tested, as well as acoustic arrays and solid state projectile radar. A sensor fusion node collects detections and background statistics from all sensors and employs hypothesis testing and multisensor estimation programs to produce unified and reliable sniper alarms and accurate sniper localizations. Operator interfaces that connect to the fusion node should be able to support both sniper countermeasures and the guidance of personnel to safety. Although the integrated platform has not been actually built, sensors have been evaluated at common field trials with military ammunitions in the caliber range 5.56 to 12.7 mm, and at sniper distances up to 900 m. It is concluded that integrating complementary sensors for pre- and post-shot sniper detection in a common system with automatic detection and fusion will give superior performance, compared to stand alone sensors. A practical system is most likely designed with a cost effective subset of available complementary sensors.

关键词： sensors Acoustics Radar Sniper detection Short wave infrared radiation Data fusion cameras Interfaces sensor fusion Infrared sensors

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