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IEEE International conference on solid-state Circuits (ISSCC)

作者： Albert Wang Patrick R. Gill Alyosha Molnar Cornell University Ithaca NY USA

Conventional cameras capture 2D photographs at a single plane of focus. Acquisition of a 3D photograph with multiple planes of focus typically requires scanning the focus of a single camera, or using arrays of cameras or lenses. This paper demonstrates a 150kpixel image sensor, which captures 3D scenes. The chip is manufactured in commodity 0.18μm CMOS and requires only a single convex lens at a fixed focal length in ambient light. As traditional image sensors only capture the intensity of the light at each location, they lose significant information about out-of-focus objects. Recovering the angular distribution of incident light permits recovery of the blurred, out-of-focus objects. This paper presents a CMOS imager that locally captures both the intensity and incident angle of the light striking it.

关键词： Gratings Three dimensional displays Diffraction gratings Image sensors CMOS integrated circuits Pixel Lenses

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Graphical User Interface for a Dual-Module EMccd X-ray Detector Array

Graphical User Interface for a Dual-Module EMCCD X-ray Detec...

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conference on Medical Imaging 2011 - Physics of Medical Imaging

作者： Wang, Weiyuan Ionita, Cipnan Kuhls-Gilcrist, Andrew Huang, Ying Qu, Bin Gupta, Sandesh K. Bednarek, Daniel R. Rudin, Stephen SUNY Buffalo Toshiba Stroke Res Ctr Buffalo NY 14214 USA

ISBN: (纸本)9780819485038

A new Graphical User Interface (GUI) was developed using Laboratory Virtual Instrumentation Engineering Workbench (LabVIEW) for a high-resolution, high-sensitivity solid state X-ray Image Intensifier (SSXII), which is a new x-ray detector for radiographic and fluoroscopic imaging, consisting of an array of Electron-Multiplying ccds (EMccds) each having a variable on-chip electron-multiplication gain of up to 2000x to reduce the effect of readout noise. To enlarge the field-of-view (FOV), each EMccd sensor is coupled to an x-ray phosphor through a fiberoptic taper. Two EMccd camera modules are used in our prototype to form a computer-controlled array;however, larger arrays are under development. The new GUI provides patient registration, EMccd module control, image acquisition, and patient image review. Images from the array are stitched into a 2kx1k pixel image that can be acquired and saved at a rate of 17 Hz (faster with pixel binning). When reviewing the patient's data, the operator can select images from the patient's directory tree listed by the GUI and cycle through the images using a slider bar. Commonly used camera parameters including exposure time, trigger mode, and individual EMccd gain can be easily adjusted using the GUI. The GUI is designed to accommodate expansion of the EMccd array to even larger FOVs with more modules. The high-resolution, high-sensitivity EMccd modular-array SSXII imager with the new user-friendly GUI should enable angiographers and interventionalists to visualize smaller vessels and endovascular devices, helping them to make more accurate diagnoses and to perform more precise image-guided interventions.

关键词： Image Guided Interventions Graphical User Interface solid state X-ray Image Intensifier (SSXII) Electron-Multiplying ccd (EMccd) Laboratory Virtual Instrumentation Engineering Workbench (LabVIEW) System

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Display Verification IP Core Design Based on Star-Extraction and Star-Recognition Image Processing on FPGA

Display Verification IP Core Design Based on Star-Extraction...

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International conference on Innovative Mobile and Internet Services in Ubiquitous Computing (IMIS)

作者： Linyang Sheng Jingbo Shao Min Xu Yuanquan Cui College of Computer Science and Information Engineering Harbin Normal University Harbin China Computer Teaching and Research Office Engineer Command College Xuzhou China Harbin Normal University Harbin China

This paper presents FPGA based VGA display interface design for image display verification during test procedure in the star sensor debugging phase. Methods of asynchronous FIFO, methods for data update during line blanking interval and vertical blanking interval were adopted, and ccd camera's requirements for special sequential order were satisfied, and the metastable state problem caused by data's cross clock domain were solved. Experiment results show that the system provides effective verification platform for ground function test of star sensor.

关键词： Field programmable gate arrays Pixel cameras Blanking Charge coupled devices Random access memory Timing

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A 1/13-inch 30fps VGA SoC CMOS image sensor with shared reset and transfer-gate pixel control

A 1/13-inch 30fps VGA SoC CMOS image sensor with shared rese...

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Robert Johansson A. Storm C. Stephansen S. Eikedal T. Willassen S. Skaug T. Martinussen D. Whittlesea G. Ali J. Ladd X. Li S. Johnson V. Rajasekaran Y. Lee J. Bai M. Flores G. Davies H. Samiy A. Hanvey D. Perks Aptina Oslo Norway Aptina Bracknell United Kingdom Aptina Imaging Inc. San Jose CA USA Aptina San Jose CA Aptina Corvallis OR USA

This paper presents a VGA 1/13-inch system-on-chip (SoC), primarily targeted for the consumer camera mobile phone market. In this market low cost, ease of product integration, low module height, and low light image quality are important features. The SoC simplifies integration of the sensor into the final product by providing camera functions such as: automatic exposure control, automatic white balance, flicker detection and avoidance, etc. This reduces cost and saves power since no companion chip is required, and the internal image-processing data rate of the SoC is higher than the output data rate [1], which keeps the inter chip communication data rate as low as possible. The small optical format enables a low camera module height. However, the choice of the small optical format also restricts the pixel pitch to 1.75μm, which influences both image quality and die size. The low light image quality, in this sensor, is improved by incorporating a 1.75μm pixel architecture, and the size of the sensor core is greatly reduced by removing the dark pixel reference rows and columns, using a single side dual bank of double-pitch sampling capacitors, a class-AB pro grammable-gain amplifier (PGA), followed by an inter-stage shared pipeline ADC.

关键词： Pixel arrays System-on-a-chip Dark current Noise cameras Capacitors

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Challenges of image-sensor development

Challenges of image-sensor development

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Tomoyuki Suzuki Sony Tokyo Japan

Due to steady advancements in semiconductor technology, greatly-enhanced memory capacity and high-speed data processing are now available, creating many evolving types of audio and video electronic products. The digital camera represents this trend well, where image sensor evolution has been responsible for enabling strong market growth. ccd image sensors have contributed to the miniaturization of cameras by their continuous march toward smaller pixel size and improved resolution, leading to more megapixels and enhanced image quality. Recently, the image-sensor shift from ccds to CMOS has enabled faster capture speeds and convenient HD (High Definition). The result of this evolution has been the impressive growth of the digital camera market. This presentation will illustrate the achievements of image-sensor development, and will outline the corresponding advancements in digital cameras. Further, the future of digital cameras will be elaborated, illustrating the way in which image sensors are leading camera growth .

关键词： Digital cameras Image sensors Charge-coupled image sensors Data processing Consumer electronics Pixel Image resolution Image quality CMOS image sensors High definition video

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An 80×60 range image sensor based on 10µm 50MHz lock-in pixels in 0.18µm CMOS

An 80×60 range image sensor based on 10µm 50MHz lock-in pi...

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IEEE International conference on solid-state Circuits (ISSCC)

作者： David Stoppa Nicola Massari Lucio Pancheri Mattia Malfatti Matteo Perenzoni Lorenzo Gonzo Fondazione Bruno Kessler - IRST Trento Italy

A lock-in pixel array based on a fast charge transfer pinned photo-detector for time-of-flight range imaging is presented. Distance measurements at 5-to-20 fps on a 6-to-3m range are reported with a linearity error lower than 0.7% and a repeatability of 5-to-16 cm, while the best achievable precision is 2.7 cm. A demodulation frequency up to 50 MHz is demonstrated with a contrast of 29.5%.

关键词： Image sensors Pixel CMOS image sensors sensor arrays Demodulation Phase modulation Testing Frequency modulation Layout cameras

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F4: High-speed image sensor technologies

F4: High-speed image sensor technologies

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IEEE International conference on solid-state Circuits (ISSCC)

作者： Johannes Solhusvik Jung-Chak Ahn Jan Bosiers Boyd Fowler Makoto Ikeda Shoji Kawahito Jerry Lin Dan McGrath Katsu Nakamura Jun Ohta Ramchan Woo Aptina Imaging Oslo Norway Samsung Gveonggi-Do Korea DALSA Eindhoven The Netherlands Fairchild Imaging Milpitas CA University of Tokyo Tokyo Japan Shizuoka University Hamamatsu Japan Ralink Technology Jhubei City Taiwan Rochester NY Analog Devices Wilmington MA Nara Institute of Science & Technology Nara Japan LG Electronics Seoul Korea

High speed imaging is one of the fastest growing semiconductor markets. Growth is currently driven by consumer and industrial applications such as HD video, slow motion play-back, machine vision, 3D range capture, and robotics. This forum will present chip architectures, circuits, and system-level solutions used in ccd and CMOS image sensors for high speed cameras. Technology topics include photon detection devices, pixel circuits and array readout circuits, A/D converters, image processing and interface circuits presented by world leading experts from industry and academia. The potential applications of this technology will be demonstrated by ultra high speed capture solutions for 3D range imaging and robotics. For advanced applications, techniques for outputing high-throughput pixel data using analog or digital interfaces are described. The forum will conclude with a panel discussion where the attendees have the opportunity to ask questions and to share their views, and this all-day forum encourages open information exchange. The targeted participants are circuit designers and concept engineers working on image sensor and camera system design.

关键词： Image sensors Circuits CMOS technology Service robots Robot vision systems CMOS image sensors cameras High definition video Machine vision Robot sensing systems

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Hydrogel-actuated tunable-focus microlens arrays mimicking compound eyes

Hydrogel-actuated tunable-focus microlens arrays mimicking c...

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TRANSDUCERS 2009 - 15th International conference on solid-state sensors, Actuators and Microsystems

作者： Zhu, D. Li, C. Zeng, X. Jiang, H. Department of Electrical and Computer Engineering University of Wisconsin-Madison Madison WI United States

ISBN: (纸本)9781424441938

Inspired by the structure of natural compound eyes, a liquid tunable-focus microlens array omnidirectionally arranged on a transparent hemispherical dome is demonstrated. Benefiting from the dome structure, this microlens array exceeds traditional planar ones with wide field of view (FOV). Each microlens in this microlens array was formed by a curved water-oil meniscus. The focal length of the microlenses could be individually tuned by a thermo-responsive hydrogel microactuator. Planar and hemispherical microlens arrays were tested and the focal length of the hemispherical microlens array varied from 3 mm to 32 mm. Focused images from the microlens arrays were recorded by a ccd-coupled stereoscope. ©2009 IEEE.

关键词： Microlenses

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A 4-side tileable back illuminated 3d-integrated Mpixel CMOS image sensor

A 4-side tileable back illuminated 3d-integrated Mpixel CMOS...

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2009 IEEE International solid-state Circuits conference ISSCC 2009

作者： Vyshnavi, Suntharalingam Robert, Berger Stewart, Clark Jeffrey, Knecht Andrew, Messier Kevin, Newcomb Dennis, Rathman Richard, Slattery Antonio, Soares Charles, Stevenson Keith, Warner Douglas, Young Lin, Ping Ang Barmak, Mansoorian David, Shaver MIT Lincoln Laboratory Lexington MA United States Irvine Sensors Costa Mesa CA United States Forza Silicon Pasadena CA United States

ISBN: (纸本)1424434580

The dominant trend with conventional image sensors is toward scaled-down pixel sizes to increase spatial resolution and decrease chip size and cost. While highly capable chips, these monolithic image sensors devote substantial perimeter area to signal acquisition and control circuitry and trade off pixel complexity for fill factor. For applications such as wide-area persistent surveillance, reconnaissance, and astronomical sky surveys it is desirable to have simultaneous near-real-time imagery with fast, wide field-of-view coverage. Since the fabrication of a complex large-format sensor on a single piece of silicon is cost and yield-prohibitive and is limited to the wafer size, for these applications many smaller-sized image sensors are tiled together to realize very large arrays. Ideally the tiled image sensor has no missing pixels and the pixel pitch is continuous across the seam to minimize loss of information content. ccd-based imagers have been favored for these large mosaic arrays because of their low noise and high sensitivity, but CMOS-based image sensors bring architectural benefits, including electronic shutters, enhanced radiation tolerance, and higher data-rate digital outputs that are more easily scalable to larger arrays. In this report the first back-illuminated, 1 Mpixel, 3D-integrated CMOS image sensor with 8 mum-pitch 3D via connections. The chip employs a conventional pixel layout and requires 500 mum of perimeter silicon to house the support circuitry and protect the array from saw damage. In this paper we present a back-illuminated 1 Mpixel CMOS image sensor tile that includes a 64-channel vertically integrated ADC chip stack, and requires only a few pixels of silicon perimeter to the pixel array. The tile and system connector design support 4-side abuttability and fast burst data rates.

关键词： CMOS image sensors sensor arrays Image sensors Pixel Silicon Costs Circuits Tiles Spatial resolution Surveillance

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Robust autonomous detection of the defective pixels in detectors using a probabilistic technique

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APPLIED OPTICS 2008年第36期47卷 6904-6924页

作者： Ghosh, Siddhartha Froebrich, Dirk Freitas, Alex Univ Kent Comp Lab Canterbury CT2 7NF Kent England Univ Kent Sch Phys Sci Ctr Astrophys & Planetary Sci Canterbury CT2 7NH Kent England

Detection of defective pixels in solid-state detectors/sensor arrays has received limited research attention. Few approaches currently exist lior detecting the defective pixels using real images captured with cameras equipped with such detectors, and they are ad hoe and limited in their applicability In this paper, we present a probabilistic novel integrated technique for autonomously detecting the defective pixels in image sensor arrays. It can be applied to images containing rich scene information, captured with any digital camera equipped with a solid-state detector, to detect diffierent kinds of defective pixels in the detector. We apply our technique to the detection of various defective pixels in an experimental camera equipped with a charge coupled device (ccd) array and two out of the four HgCdTe detectors of the UKIRT's wide field camera (WFCAM) used for infrared (IR) astronomy [Astron. Astrophys. 467, 777-784 (2007)]. (C) 2008 Optical Society of America

关键词： ccd cameras Detector arrays Digital image processing Digital imaging Image processing solid state detectors

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