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检索条件"任意字段=Conference on Solid State Sensor Arrays and CCD Cameras"
195 条 记 录,以下是61-70 订阅
排序:
A low-power parallel processor IC for digital video cameras
A low-power parallel processor IC for digital video cameras
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European conference on solid-state Circuits (ESSCIRC)
作者: A.A. Abbo R.P. Kleihorst L. Sevat P. Wielage R. van Veen M.J.R. Op de Beeck A. van der Avoird Philips Research Laboratories Eindhoven Netherlands
We present a digital signal processor to be combined with a 30 frames per second VGA-format CMOS or ccd image sensor or any other source of digital video data. The processor is fully programmable and therefore able to... 详细信息
来源: 评论
A progressive scan ccd image sensor for DSC applications
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IEEE JOURNAL OF solid-state CIRCUITS 2000年 第12期35卷 2044-2054页
作者: Yamada, T Ikeda, K Kim, YG Wakoh, H Toma, T Sakamoto, T Ogawa, K Okamoto, E Masukane, K Oda, K Inuiya, M Fuji Photo Film Co Ltd Kanagawa Japan
A progressive-scan ccd image sensor with a standard double-layer poly-silicon is designed on a new architecture of pixel interleaved array named PIAccd, The pixel layout is estimated to enlarge the saturation voltage ... 详细信息
来源: 评论
A 1/3-inch 1.3Mpixel single-layer electrode ccd with a high-frame-rate skip mode
A 1/3-inch 1.3Mpixel single-layer electrode CCD with a high-...
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2000 IEEE International solid-state Circuits conference 47th Annual ISSCC
作者: Hatano, K. Furumiya, M. Murakami, I. Kawasaki, T. Ogawa, C. Nakashiba, Y. ULSI Device Development Laboratory NEC Corp. Sagamihara Kanagawa Japan
A 1/3-inch 1.3Mpixel interline-transfer charge-coupled-device (ccd) image sensor was described for digital camera applications. The vertical ccd (V-ccd) of the image sensor was provided with ten-phase metal wiring to ... 详细信息
来源: 评论
A 1/3-inch 1.3M pixel single-layer electrode ccd with a high-frame-rate skip mode
A 1/3-inch 1.3M pixel single-layer electrode CCD with a high...
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IEEE International conference on solid-state Circuits (ISSCC)
作者: K. Hatano M. Fummiya I. Murakami T. Kawasaki C. Ogawa Y. Nakashiba Nihon Denki Kabushiki Kaisha Minato-ku Tokyo JP ULSI Device Development Laboratory NEC Corporation Limited Sagamihara Kanagawa Japan
A 1/3-inch 1.3M pixel interline-transfer charge-coupled-device (IT-ccd) image sensor is described for digital camera applications. A 0.25 /spl mu/m-gap single-layer poly-Si is used for the ccd electrodes. The vertical... 详细信息
来源: 评论
A CMOS image sensor with a simple FPN-reduction technology and a hole accumulated diode
A CMOS image sensor with a simple FPN-reduction technology a...
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IEEE International conference on solid-state Circuits (ISSCC)
作者: K. Yonemoto H. Sumi R. Suzuki T. Ueno Camera System Department CCD System Division Semiconductor Company CNC Sony Corporation Kanagawa Japan
CMOS image sensors are generally characterized by their low power consumption, single power supply and capability for on-chip system integration in contrast with ccd image sensors. Even though CMOS image sensors have ... 详细信息
来源: 评论
Conditioning analysis of missing data estimation for large sensor arrays
Conditioning analysis of missing data estimation for large s...
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conference on Computer Vision and Pattern Recognition (CVPR)
作者: H. Qi W.E. Snyder ECE Department Ferris Hall University of Tennessee Knoxville Knoxville TN USA CACC North Carolina State University Raleigh NC USA
Optimal missing data estimation algorithms including deblurring and denoising are designed to restore images captured from large ccd sensor arrays using a butting technique, where 1 to 2 columns of data are missed at ... 详细信息
来源: 评论
A 1/2-in, 1.3M-pixel progressive-scan ccd image sensor employing 0.25-μm gap single-layer poly-Si electrodes
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IEEE JOURNAL OF solid-state CIRCUITS 1999年 第12期34卷 1835-1842页
作者: Furumiya, M Hatano, K Nakashiba, Y Murakami, I Yamada, T Nakano, T Kawakami, Y Kawasaki, T Hokari, Y NEC Corp Ltd USLI Device Dev Lab Kanagawa 2292298 Japan NEC Corp Ltd Silicon Syst Res Labs Kanagawa 2292298 Japan
A 1/2-in, 1.3M-pixel progressive-scan interline-transfer charge-coupled-device (IT-ccd) image sensor has been developed for row-power and high sensitivity digital cameras. The image sensor uses 0.25-mu m gap single-la... 详细信息
来源: 评论
Robust digitization and digital non-uniformity correction in a single-chip CMOS camera
Robust digitization and digital non-uniformity correction in...
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European conference on solid-state Circuits (ESSCIRC)
作者: I. Koren U. Ramacher H. Geib S. Kirmser C. Heer J. Schlussler J. Dohndorf J. Werner Infineon Technologies Inc. USA Technische Universität Dresden Germany AMI Inc. USA
Analog circuitry, digitization and subsequent digital non-uniformity correction in a single-chip digital CMOS camera are described. The sensor array of 720 × 576 active pixels is followed by a simple circuit impl... 详细信息
来源: 评论
A 1/2-inch 1.3 MPixel progressive-scan ccd image sensor employing 0.25 /spl mu/m gap single-layer poly-Si electrodes
A 1/2-inch 1.3 MPixel progressive-scan CCD image sensor empl...
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IEEE International conference on solid-state Circuits (ISSCC)
作者: M. Furumiya K. Hatano Y. Nakashiba I. Murakami T. Yamada T. Nakano Y. Kawakami T. Kawasaki Y. Hokari Nihon Denki Kabushiki Kaisha Minato-ku Tokyo JP
A 1/2-inch 1.3 Mpixel progressive-scan interline-transfer charge-coupled device (IT-ccd) image sensor for low-power high-sensitivity digital cameras uses 0.25 /spl mu/m-gap single-layer poly-Si for ccd electrodes to r... 详细信息
来源: 评论
Electron bombardment ccd camera
Electron bombardment CCD camera
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conference on Digital solid state cameras - Designs and Applications
作者: Maruno, T Shirai, M Iwase, F Hakamata, N Hamamatsu Photon KK Syst Div Hamamatsu Shizuoka 43131 Japan
Two kinds of Electron Bombardment ccd (EB-ccd) camera are newly developed, employing an Electron Bombardment ccd sensor made by Hamamatsu Photonics. The slow scan cooled ccd camera installs the full frame transfer typ... 详细信息
来源: 评论