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Stabilization in an optical fiber interferometer using a semiconductor laser

Stabilization in an optical fiber interferometer using a sem...

Micro-optical Technologies for Measurement, Sensors and Microsystems ii and optical Fiber Sensor Technologies and Applications

作者： Lamela, Horacio Garcia, J.A. Leones, M. Santos, J.I. Vazquez, C. Univ. Carlos III de Madrid Leganes-Madrid Spain

ISBN: (纸本)0819425192

In this paper we present results of our stabilization scheme for an optical fiber Mach-Zehnder interferometer with a diode laser as light source. It is developed for compensating the drift path difference produced by external parameters as the environmental temperature. The optoelectronic setup in which the interference signal is fed back to the injection current of the laser diode is investigated in order to obtain a stabilized system. Details on parameter characterization, system design and the results observed are given.

关键词： Interferometers

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Improved performance iiI-V quantum well IR photodetectors: review of current and potential focal plane technology

Improved performance III-V quantum well IR photodetectors: r...

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Photodetectors: Materials and Devices ii

作者： Claiborne, Lewis T. Lockheed Martin Vought Systems Dallas TX USA

ISBN: (纸本)0819424102

The maturation of the iiI-V materials technology has provided an opportunity for the development of a producible and affordable class of IR detector arrays. designs based on the GaAs compounds permit the realization of multiple quantum well IR photodetectors (QWIPs) which are useful for long wavelength focal plane arrays with sizes demonstrated up to 640 × 480. Similar designs using InP based materials can cover an even broader IR spectral region with lattice matched structures. QWIP demonstrations have been made for midwave detectors and very long wave detectors as well. New detector structures that improve optical performance and reduce bias current can lead to higher performance QWIPs which approach the performance of mercury cadmium telluride at moderate operating temperatures. These developments offer the possibility of practical, large, affordable IR focal plane arrays in the near future.

关键词： Infrared detectors

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current status of the British Aerospace resistor array IR scene projector technology

Current status of the British Aerospace resistor array IR sc...

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2nd Conference on Technologies for Synthetic Environments - Hardware-in-the-Loop Testing

作者： Pritchard, AP Lake, SP Balmond, MD Gough, DW Venables, MA Sturland, IM Crisp, G Watkin, SC British Aerospace PLC (United Kingdom)

ISBN: (纸本)0819424994

This paper describes the cumulative status to-date, and current developments in the British Aerospace IR scene projector system technology in early 1997. The systems have been developed for Hardware-in-the-loop (HWIL) simulation in missile test and evaluation facilities. Historically, the technology has been called ''Thermal Picture Synthesis'' an early equivalent of what is now known as Infra-red Scene Projection (IRSP). Earlier generations of system were based on a monolithic resistor-substrate construction, a modification of which is still used for ground target simulations (TPS3), whereas the more recent systems for air target simulations are based on fully suspended resistor designs (TPS4). These projector systems incorporating full scale arrays have been fabricated at up to 256 x 256 complexity. Research work is being carried out on high temperature arrays for air-to-air countermeasure simulations, and the first TPS5 full system at 512 x 512 complexity has completed its design stage and has recently moved into fabrication. Research testbed arrays of 768 x 768 have just been made, and 1024 x 1024 arrays are presently being fabricated. The paper includes an initial introduction to the basics of the technology, and is followed by a section on certain specialised features to combat inherent issues in the technology. Specifications and the current status of each category of device is then given.

关键词： infra-red scene projectors resistor arrays hardware-in-the-loop simulation

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Computer-aided fit testing: An approach for examining the user/equipment interface

Computer-aided fit testing: An approach for examining the us...

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Conference on Three-Dimensional Image Capture

作者： Corner, B Beecher, R Paquette, S U.S. Army Natick Research Development & Engineering Ctr. (United States) Beecher Research (United States)

ISBN: (纸本)081942434X

developments in laser digitizing technology now make it possible to capture very accurate 3D images of the surface of the human body in less than 20 seconds. Applications for the images range from animation of movie characters to the design and visualization of clothing and individual equipment (CIE). In this paper we focus on modeling the user/equipment interface. Defining the relative geometry between user and equipment provides a better understanding of equipment performance, and can make the design cycle more efficient. Computer-aided fit testing (CAFT) is the application of graphical and statistical techniques to visualize and quantify the human/equipment interface in virtual space. In short, CAFT looks to measure the relative geometry between a user and his or her equipment. The design cycle changes with the introducing CAFT;now some evaluation may be done in the CAD environment prior to prototyping. CAFT may be applied in two general ways: 1) to aid in the creation of new equipment designs and 2) to evaluate current designs for compliance to performance specifications. We demonstrate the application of CAFT with two examples. First, we show how a prototype helmet may be evaluated for fit, and second we demonstrate how CAFT may be used to measure body armor coverage.

关键词： fit-testing visualization 3-D digitizing clothing equipment

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Architecture for distributed design and fabrication

Architecture for distributed design and fabrication

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Plug and Play Software for Agile Manufacturing

作者： McIlrath, Michael B. Boning, Duane S. Troxel, Donald E. Massachusetts Institute of Technology Microsystems Technology Laboratories Department of Electrical Engineering and Computer Science Cambridge MA 02139 United States

We describe a flexible, distributed system architecture capable of supporting collaborative design and fabrication of semi-conductor devices and integrated circuits. Such capabilities are of particular importance in the development of new technologies, where both equipment and expertise are limited. Distributed fabrication enables direct, remote, physical experimentation in the development of leading edge technology, where the necessary manufacturing resources are new, expensive, and scarce. Computational resources, software, processing equipment, and people may all be widely distributed;their effective integration is essential in order to achieve the realization of new technologies for specific product requirements. Our architecture leverages is essential in order to achieve the realization of new technologies for specific product requirements. Our architecture leverages current vendor and consortia developments to define software interfaces and infrastructure based on existing and merging networking, CIM, and CAD standards. Process engineers and product designers access processing and simulation results through a common interface and collaborate across the distributed manufacturing environment. ©2005 Copyright SPIE - The International Society for optical engineering.

关键词： Fabrication

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The current status of the ADEOS-ii/GLI mission

The current status of the ADEOS-II/GLI mission

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Conference on Advanced and Next-Generation Satellites ii

作者： Nakajima, T Awaya, Y Kishino, M Ohishi, T Saitou, G Uchiyama, A Nakajima, TY Nakajima, M Uesugi, T Center for Climate System Research University of Tokyo Meguro-ku Tokyo 153 4-6-1 Komaba Japan Foresty and Forest Products Research Insitute Japan Meteorological Research Insitute Japan Tokai University Japan Institute of Physical and Chemical Research Japan National Insitute of Agro-Environmental Sciences Japan National Space Development Agency of Japan

ISBN: (纸本)0819423610

The design of the Global Imager (GLI) on board the ADEOS-ii satellite is discussed to realize an efficient radiometer for monitoring the earth's surface and lower atmosphere. The GLI has 36 channels allocated over a wide spectral range between 0.38 mu m and 12 mu m for retrieving various geophysical parameters important for climate system studies, such as cloud and aerosol microphysical parameters, ocean color pigments, vegetation indices, snow/ice microphysical parameters, and so on. Land surface and cloud detections are further enhanced by its six 250 m channels spectrally similar to LANDSAT/TM channels. The science issues relevant for the GLI mission are also briefly discussed.

关键词： GLI ADEOS-ii visible spectrum infrared spectrum radiometer satellite

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Using the Laser Engineered Net Shaping (LENS) process to produce complex components from a CAD solid model

Using the Laser Engineered Net Shaping (LENS) process to pro...

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Lasers as Tools for Manufacturing ii

作者： Keicher, David M. Smugeresky, John E. Romero, Joseph A. Griffith, Michelle L. Harwell, Lane D. Sandia National Laboratories Albuquerque NM 87185 United States Sandia National Laboratories Livermore CA 94551-0969 United States Optomec Design Company Albuquerque NM 87123 United States

The laser engineered net shaping (LENS) process, currently under development, has demonstrated the capability to produce near-net shape, fully dense metallic parts with reasonably complex geometrical features directly from a CAD solid model. Results to date show that excellent mechanical properties can be achieved in alloys such as 316 stainless steel and Inconel 625. In fact, due to the highly localized nature of the laser heating, a fine grain structure will occur resulting in a significant increase in yield strength at no expense of ductility. The current approach lends itself to produce components with a dimensional accuracy of plus or minus.002 inches in the deposition plane and plus or minus.0.015 inches in the growth direction. These results suggest that this process will provide a viable mens for direct fabrication of metallic hardware directly from the CAD solid model. ©2005 Copyright SPIE - The International Society for optical engineering.

关键词： Computer aided design

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design issues relating to low-temperature dark current in quantum well infrared photodetectors

Design issues relating to low-temperature dark current in qu...

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Photodetectors: Materials and Devices ii

作者： Singh, Anjali Cardimona, David A. Air Force Phillips Lab. Kirtland Afb NM USA

ISBN: (纸本)0819424102

Quantum well infrared photodetectors (QWIPs) have emerged as a viable contender for many remote sensing applications, even in the space environment where low background fluxes are involved. There are, however, several issues that still need to be resolved in order to achieve optimum performance at low operating temperatures. One important issue is the dark current, which is dominated by Fowler-Nordheim and trap-assisted tunneling in this regime. In order to decrease the dark current of QWIPs at low temperatures, we are investigating these mechanisms to better understand them. Our preliminary investigations have uncovered another possible problem;offsets in the I-V characteristics which could impair the compatibility of a QWIP array with a readout circuit. In this paper we discuss these design issues.

关键词： Infrared detectors

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Requirements and design considerations of UV and x-ray detectors for astronomical purposes

Requirements and design considerations of UV and x-ray detec...

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Photodetectors: Materials and Devices ii

作者： Ulmer, Melville P. Northwestern Univ. Evanston IL USA

ISBN: (纸本)0819424102

Since our previous review, new developments have occurred which make it interesting to compare wide bandgap semiconductors with low temperature detectors. We compare the strengths and weaknesses of each of these devices. We show that there is a need for both types of devices. Furthermore, single or small-array versions of the low temperature devices have been shown to work as single photon-counting devices. This gives the low temperature devices a distinct advantage over wide bandgap detectors. The ability to operate at room temperature and to be able to use standard indium bump bonding techniques to allow for relatively routine fabrication of 500 × 500 pixel formats should, however, provide impetus to further development of wide bandgap semiconductor devices.

关键词： Ultraviolet detectors

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The growth and globalization of Japanese research

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TECHNOLOGY IN SOCIETY 1997年第3-4期19卷 507-524页

作者： Nakahara, T Sumitomo Elect Ind Ltd Osaka Japan

Research and development (R&D) in Japan began after the Meiji Restoration (1868) through the introduction and improvement of technology that originated in Europe and America. However, substantial R&D activity began after the end of World War Ⅱ, and this discussion refers to R&D activities after that time. During Japan's postwar economic reconstruction in the 1950s, technology from the United States and European countries was aggressively sought by Japanese industry, and both government and industry aggressively promoted R&D activities in order to increase competitiveness quickly. As a result, Japanese industry began producing high-quality, competitive products in the growth period of the 1960s.

关键词： World War ii Coating REMEDIAL design globalisation growth period Government Europe

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