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Architecture for distributed design and fabrication

Architecture for distributed design and fabrication

引用

Plug and Play Software for Agile Manufacturing

作者： McIlrath, Michael B. Boning, Duane S. Troxel, Donald E. Massachusetts Institute of Technology Microsystems Technology Laboratories Department of Electrical Engineering and Computer Science Cambridge MA 02139 United States

We describe a flexible, distributed system architecture capable of supporting collaborative design and fabrication of semi-conductor devices and integrated circuits. Such capabilities are of particular importance in the development of new technologies, where both equipment and expertise are limited. Distributed fabrication enables direct, remote, physical experimentation in the development of leading edge technology, where the necessary manufacturing resources are new, expensive, and scarce. Computational resources, software, processing equipment, and people may all be widely distributed;their effective integration is essential in order to achieve the realization of new technologies for specific product requirements. Our architecture leverages is essential in order to achieve the realization of new technologies for specific product requirements. Our architecture leverages current vendor and consortia developments to define software interfaces and infrastructure based on existing and merging networking, CIM, and CAD standards. Process engineers and product designers access processing and simulation results through a common interface and collaborate across the distributed manufacturing environment. ©2005 Copyright SPIE - The International Society for optical engineering.

关键词： Fabrication

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Review of the technology for the manufacturing of large format DCG-holograms for technical applications

Review of the technology for the manufacturing of large form...

引用

Conference on Practical Holography XI and Holographic Materials iii

作者： Stojanoff, CG Technical Univ. Aachen (Germany)

ISBN: (纸本)0819424226

Large format holograms are of potential interest to the energy and building sectors. Such holograms are considered at present for photovoltaic power generation and for daylighting or glazing in buildings. Dichromated gelatin (DCG) exhibits properties that are nearly ideal for these applications. Both sectors require large format holograms with accurately controlled properties, such as: spectral bandwidth, operating wavelength and diffraction efficiency. The required properties are attained by exactly controlling the thickness of the gelatin layer and the refractive index variation over the entire aperture as a function of layer depth. The information presented in this paper is based on ten years' efforts that includes layer deposition and film drying techniques with controlled thickness, development process and an inexpensive dry copying procedure for the industrial fabrication of the holograms on a flexible film substratum. design criteria and experimental results for large format holographic gratings, lenses and mirrors are presented and discussed. The current technology facilitates the manufacturing of HOEs that operate between 400 nm and 1500 nm in various applications: photovoltaic solar concentrators for multicolor operation, hybrid collectors for simultaneous thermal and PV application, holographic stacks for white light (RGB) daylighting and wideband sun shading and holographic concentrators with spectral bandwidths that are adapted to particular photochemical reactions far solar chemistry.

关键词： Holograms Holography Glasses Diffraction Modulation Holographic optical elements Holographic concentrators Solar concentrators Manufacturing Refractive index

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Performance of flat panel (AMLCD) units installed in the aft end of drug interdiction P-3s

Performance of flat panel (AMLCD) units installed in the aft...

引用

4th Conference on Cockpit Displays - Flat Panel Displays for Defense Applications

作者： Sola, KE Sankovic, M Naval Air Warfare Ctr. (United States)

ISBN: (纸本)0819424722

The U.S. Navy is preactively upgrading its fleet of P-3 Maritime Patrol Aircraft to continue to meet current and near future challenges to national security. The traditional P-3 role of Anti-Submarine Warfare, though retained, is being expanded to include Anti-Surface Warfare, increased reconnaissance and surveillance, and other missions. As part of the overall improvement program, P-3 cockpit and tactical crewstations throughout the aircraft are being upgraded to improve crew performance. Flat panel display technology is replacing CRTs in five on-going crewstation improvements. This paper reports on one of them: the replacement of CRT displays in a prototype EO/IR crewstation with a suite of four color AMLCDs, one of which is configured with a surface acoustic wave touch overlay to serve as a programmable touch interface. This upgrade is already in service with the fleet.

关键词： AMLCD military FPD P-3 title iii navy crew performance workstation design ergonomics

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current status of the British Aerospace resistor array IR scene projector technology

Current status of the British Aerospace resistor array IR sc...

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2nd Conference on Technologies for Synthetic Environments - Hardware-in-the-Loop Testing

作者： Pritchard, AP Lake, SP Balmond, MD Gough, DW Venables, MA Sturland, IM Crisp, G Watkin, SC British Aerospace PLC (United Kingdom)

ISBN: (纸本)0819424994

This paper describes the cumulative status to-date, and current developments in the British Aerospace IR scene projector system technology in early 1997. The systems have been developed for Hardware-in-the-loop (HWIL) simulation in missile test and evaluation facilities. Historically, the technology has been called ''Thermal Picture Synthesis'' an early equivalent of what is now known as Infra-red Scene Projection (IRSP). Earlier generations of system were based on a monolithic resistor-substrate construction, a modification of which is still used for ground target simulations (TPS3), whereas the more recent systems for air target simulations are based on fully suspended resistor designs (TPS4). These projector systems incorporating full scale arrays have been fabricated at up to 256 x 256 complexity. Research work is being carried out on high temperature arrays for air-to-air countermeasure simulations, and the first TPS5 full system at 512 x 512 complexity has completed its design stage and has recently moved into fabrication. Research testbed arrays of 768 x 768 have just been made, and 1024 x 1024 arrays are presently being fabricated. The paper includes an initial introduction to the basics of the technology, and is followed by a section on certain specialised features to combat inherent issues in the technology. Specifications and the current status of each category of device is then given.

关键词： infra-red scene projectors resistor arrays hardware-in-the-loop simulation

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developments of optimum flip-chip bonding process

Developments of optimum flip-chip bonding process

引用

Conference on Microelectronic Packaging and Laser Processing

作者： Jang, DH Kang, SY Lee, YM Oh, SY Samsung Electronics Co. Ltd. (South Korea)

ISBN: (纸本)0819426113

Flip-chip soldering is the critical technology for solving the current issues of electronic packaging industries that require the high I/O's. In order to increase the manufacturing ability of flip-chip technology, however, yield and reliability issues should overcome. In this study, optimum flip-chip bonding process has been developed by using the test chips that had the electroplated solder bumps. Test chips are composed of three different types that are i) peripheral array pad chip (116 of I/O and 8.25 x 8.25 mm(2)), ii) peripheral array pad chip (196 of I/O and 13.75 x 13.75 mm(2)), and iii) area array pad chip (448 I/O and 11.66 x 11.66 mm(2)) Each test chip has the daisy chain to consider the effect of reliability test. The electrical resistance was measured before and after reliability test. Based on these measurement, failure mode resulted from the moisture absorption was studied using scanning acoustic microscope. To achieve an optimum reflow profile of solder bump, correct temperature profile was set up with respect to the resin base flux. Different bonding forces were tested. Four underfill encapsulants were evaluated for minimum voids that caused the severe defects after reliability test. Also, the gap heights were measured with respect to applied bonding force after underfill was performed. Results from the moisture absorption and thermal cycling were discussed for flip-chip bonding on BT-resin substrates. The test vehicles using flip-chip technology have passed moisture preconditioning and temperature cycling test.

关键词： flip-chip bonding soldering daisy chain reflow solder interconnection cleaning underfill reliability

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Application of fibre optical current transducer to protection

Application of fibre optical current transducer to protectio...

引用

Sixth International Conference on developments in Power System Protection (Conf. Publ. No. 434)

作者： H.Y. Li P.A. Crossley R.K. Aggarwal Manchester Centre for Electrical Energy UMIST (University of Manchester Institute of Science and Technology) Manchester UK School of Electronic and Electrical Engineering University of Bath Bath UK

This paper describes the design of a fibre optical current transducer based on a mirror Faraday rotator. Computer simulation techniques are used to model the transducer, and to assess its operating performance. The transducer is used to measure the fault current waveforms encountered on a 33 kV distribution feeder. The measured waveforms are processed by a current differential scheme applied to the protection of this feeder. The operating performance of the protection is analysed and compared with the performance obtained when using conventional current transformers. Conclusions are drawn regarding the advantages and disadvantages of using fibre optical current transducers in protection relaying.

关键词： Power system protection

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Multipass gray printing for the new MEBES 4500S mask lithography system

引用

Photomask and X-Ray Mask Technology IV

作者： Abboud, Frank E. Dean, Robert L. Doering, Janine J. Eckes, W. Gesley, Mark A. Hofmann, Ulrich Mulera, Terry Naber, Robert J. Pastor, M. Phillips, Wayne Raphael, John Raymond, F.iii Sauer, Charles A. Etec Systems Inc. Hayward CA USA

ISBN: (纸本)0819425168

Etec Systems, Inc. has developed a new e-beam mask lithography system, the MEBES 4500S, featuring a higher productivity writing strategy called multipass gray and a number of mechanical and electrical improvements. This new system, based on the proven technologies introduced in the MEBES 4500 system, provides improved throughput and accuracy. The MEBES 4500S system with multipass gray supports smaller mask design addresses needed for high resolution masks, while providing higher dose for high contrast processes with low sensitivity and improved CD linearity. Improved print performance is achieved by the introduction of several system design changes that work in conjunction with the multipass gray writing mode. These changes include improved column deflection system temperature control, enhanced TFE current control, improved work chamber thermal management, and improved stage drive vibration damping. Details of these features are presented along with first performance data for the new system.

关键词： Masks

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current developments in optical design and optical engineering iii

Current Developments in Optical Design and Optical Engineeri...

引用

current developments in optical design and optical engineering iii

The proceedings contains 44 papers. Some of the specific topics discussed are: multiple-temperature lens design optimization;engineering an agile beam director for laser radar;beam design of a noncooperative interfero... 详细信息

ISBN: (纸本)081941249X

关键词： optical systems

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current developments in optical design and engineering VI

Current Developments in Optical Design and Engineering VI

引用

current developments in optical design and engineering VI 1996

The proceedings contain 53 papers. The topics discussed include: development of a three-channel SWIR camera, for ground-based astronomical imaging. (two micron all sky survey, 2MASS);evaluation of a demonstration telescope for the pluto express mission;impact of zonal irregularity and refractive index errors on infrared lens performance;optical performance budget for the far ultraviolet spectroscopic explorer;compact prism-based optics for two-axis gimbal systems allowing large aperture and field of regard;using wavefront sensor information in image post-processing to improve the resolution of telescopes with small aberrations;scanning near-field infrared microscope with a free electron laser illumination source;infrared incoherent imaging: elements of rotary encoder optical design;and dry resist technology to fabricate optimized microlenses centered to the end of a monomode fiber with electron-beam lithography.

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Genetic algorithm and its application in lens design 6

Genetic algorithm and its application in lens design

引用

current developments in optical design and engineering VI Conference

作者： Chen, XG Yamamoto, K Olympus Optical Co. Ltd. (Canada) Olympus Optical Co. Ltd. (Japan)

ISBN: (纸本)0819422517

Genetic algorithm and its application in lens design is studied. A new algorithm is presented which includes a genetic algorithm (GA) and damped least square (DLS) method. The convergence property of GA in lens design is demonstrated. A GA. generated design is obtained without artificial intervention. The aberration correction has to be done by DLS, and the result is close to the starting configuration generated by GA.

关键词： genetic algorithm lens design optimization

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