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The design of microscopic system using zoom structure with a fixed magnification and the independency on the variation of object distance

The design of microscopic system using zoom structure with a...

引用

Conference on current developments in Lens design and optical engineering V

作者： Ryu, JM Jo, JH Jung, JH Chun, YS Kang, GM Hannam Univ Sch Nat Sci Taejon 306791 South Korea

ISBN: (纸本)0819454613

The multi-configurative microscopic system for inspecting the wire-bonding of reed frame is designed. Object rays is nearly collimated by a objective lens group which is a common lens group of x2 and x6 imaging lens systems and is splitted by two beam-splitters composed of a penta-prism and a refracting prism. And object rays started from the central region and the boundary region(reed frame region) on semiconductor chip(that is, the object) are imaged at the two different imaging planes by x2 and x6 imaging lens groups, respectively. The x6 imaging lens system with a constant object distance and a constant magnification is well designed by general imaging optics system design method. However, since the depth of wire structure on the reed frame has about +/-3 mm, in order to observe by a constant magnification and at a fixed imaging plane without the dependency on the variation of objective distance generated by the depth of wire structure on the reed frame, the imaging lens system is composed of two separated groups, which should be moved along nonlinear locus like mechanically compensated zoom lenses. The nonlinear equations for zoom locus are derived by using the Gaussian bracket. Refraction powers and positions of each groups are numerically determined by solving the equations, and initial design data for each groups is obtained by using Seidel third order aberration theory. The optimization technique is finally utilized to obtain this multi-configurative microscopic system.

关键词： lens design equivalent lens imaging system microscopic system multi-configurative system

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Fielding of an imaging VISAR diagnostic at the National Ignition Facility (NIF)

Fielding of an imaging VISAR diagnostic at the National Igni...

引用

Conference on current developments in Lens design and optical engineering V

作者： Malone, RM Bower, JR Capelle, GA Celeste, JR Celliers, PM Frogget, BC Guyton, RL Kaufman, MI Lare, GA Lee, TL MacGowan, BJ Montelongo, S Ng, EW Thomas, TL Tunnell, TW Watts, PW Bechtel Nevada Los Alamos NM 87544 USA Lawrence Livermore Natl Lab Livermore CA 94551 USA

ISBN: (纸本)0819454613

The National Ignition Facility (NIF) requires diagnostics to analyze high-energy density physics experiments. As a core NIF early light diagnostic, this system measures shock velocities, shock breakout times, and shock emission of targets with sizes from I to 5 mm. A 659.5 nm VISAR probe laser illuminates the target. An 8-inch-diameter fused silica triplet lens collects light at f/3 inside the 33-foot-diameter vacuum chamber. The optical relay sends the image out an equatorial port, through a 2-inch-thick vacuum window, and into two VISAR (Velocity Interferometer System for Any Reflector) interferometers. Both streak cameras and CCD cameras record the images. Total track is 75 feet. The front end of the optical relay can be temporarily removed from the equatorial port, allowing for other experimenters to use that port. The first triplet can be no closer than 500 mm from the target chamber center and is protected from debris by a blast window that is replaced after every event. Along with special coatings on the mirrors, cutoff filters reject the NIF drive laser wavelengths and pass a band of wavelengths for VISAR, for passive shock breakout light, or for thermal imaging light (bypassing the interferometers). Finite Element Analysis was performed on all mounting structures. All optical lenses are on kinematic mounts, so that the pointing accuracy of the optical axis can be checked. A two-color laser alignment scheme is discussed.

关键词： VISAR optical relay interferometer National Ignition Facility (NIF) streak camera

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Measurement of lens focal length using multi-curvature analysis of Shack-Hartmann wavefront data

Measurement of lens focal length using multi-curvature analy...

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Conference on current developments in Lens design and optical engineering V

作者： Neal, DR Copland, J Neal, DA Topa, DM Riera, P WaveFront Sci Inc Albuquerque NM 87123 USA

ISBN: (纸本)0819454613

The lens is one of the most commonly used optical elements. Yet it is sometimes difficult to make accurate effective focal length and pupil position measurements, especially for long focal length lenses. Many measurement methods rely on a mechanical measurement to determine the back focal length, or may require careful operator discrimination in determining the best focus position. Aberrations may confuse an automatic focal length measurement system. However, an accurate determination of the optical properties of a lens is often critical for building an accurate system model. We have developed a method for measurement of the focal length, pupil plane and collimation positions of positive lenses using a Shack-Hartmann wavefront sensor. The SHWFS uses a micro-optic lens array to separate the incoming wavefront into a pattern of focal spots. The position of these focal spots is related to the local wavefront slope. Wavefront reconstruction allows the complete incident wavefront to be retrieved. A Zernike decomposition reconstructor is used to separate the effects of lens focal power from other aberrations. The lens under test is illuminated by a point source on a computer-controlled stage. The transmitted wavefront was recorded by the SHWFS while the source was translated over a few mm range. By analyzing the Zernike coefficient associated with defocus, we were able to extract the focal length, pupil plane and collimation positions using a least squares fitting procedure. This procedure was tested for a variety of lenses of varying focal lengths, from 10 to 1000 mm focal length, and showed excellent repeatability and accuracy. These measurements were compared to knife-edge, manufacturer's specification, and ray-tracing analysis for verification testing.

关键词： focal length wavefront sensor Shack-Hartmann Hartmann-Shack lens testing optical testing optical metrology lens testing focal length measurement lens power vergence

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Introduction to Microelectromechanical Systems engineering 2

引用

丛书名： Microelectromechanical systems series

2004年

作者： Nadim Maluf Kirt Williams

ISBN: (数字)9781580535915

ISBN: (纸本)9781580535908

Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, thisunique resource helps you determine whether your application can benefit from aMEMS solution, understand how other applications and companies have benefitedfrom MEMS, and select and define a manufacturable MEMS process for yourapplication. You discover how to use MEMS technology to enable newfunctionality, improve performance, and reduce size and cost. The book teachesyou the capabilities and limitations of MEMS devices and processes, and helpsyou communicate the relative merits of MEMS to your company’s management. Fromcritical discussions on design operation and process fabrication of devices andsystems, to a thorough explanation of MEMS packaging, this easy-to-understandbook clearly explains the basics of MEMS engineering, making it an invaluablereference for your work in the field. Contents: MEMS: A Technology from Lilliput - The Promise ofTechnology. What are MEMS? What is Micromachining? Applications and Markets. ToMEMS or not to MEMS. Standards. The Psychological Barrier. Journals, Conferences,and Web Sites. The Sandbox: Materials for MEMS - Silicon *** Materials and Substrates. Important Material Properties and PhysicalEffects. The Toolbox: Processes for Micromachining - BasicProcess Tools. Advanced Process Tools. Combining the Tools. MEM Structure and Systems in Industrial and AutomotiveApplications - General design Methodolog

关键词： Technology Electricity

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QWIP products and building blocks for high performance systems

QWIP products and building blocks for high performance syste...

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Conference on Infrared Technology and Applications XXX

作者： Costard, E Bois, P Marcadet, X Nedelcu, A THALES Res & Technol F-91404 Orsay France

ISBN: (纸本)0819453293

Standard GaAs/AlGaAs Quantum Well Infrared Photodetectors (QWIP) are coming out from the laboratory. In this presentation we demonstrate that production and research cannot be dissociated in order to make the new generation of thermal imagers benefit as fast as possible from the building blocks developed by researchers. Since 2002, the THALES Group has been manufacturing sensitive arrays using QWIP technology based on AsGa techniques through THALES Research and Technology Laboratory. This QWIP technology, integrated in IDDCA built by Sofradir, allows the realization of large staring arrays for Thermal Imagers (TI) working in the IR band iii (8-12 mum). A review of the current QWIP products, offered by Sofradir, is presented. In the past researchers claimed many advantages of QWIPs. Uniformity was one of these and was the key parameter for the production start. Another advantage widely claimed also for QWIPs was the so-called band-gap engineering, allowing the custom design of quantum structure to fulfill the requirements of specific applications like very long wavelength or multispectral detection. In this presentation, we present the performances for Middle Wavelength InfraRed (MWIR) detection and demonstrate the ability of QWIP to cover the two spectral ranges (3-5 mum and 8-20 mum). At last but not least, the versatility of the GaAs processing appeared for QWIPs as an important gift. This assumption was well founded. We give here some results achieved on building blocks for two color QWIP pixels. We also report the expected performances of focal plane arrays we are currently developing with the CEA-LETI-SLIR.

关键词： QWIP infrared detectors focal plane arrays iii-V MWIR LWIR

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Photonic Crystals: Advances in design, Fabrication, and Characterization 1

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2004年

作者： Kurt Busch Dipl.‐Phys., Dr. rer. nat. Stefan Lölkes Ph.D. Ralf B. Wehrspohn Ph.D. Helmut Föll Ph.D., postdoctorial

ISBN: (数字)9783527602599

ISBN: (纸本)9783527404322

The majority of the contributions in this topically edited book stems from the priority program SPP 1113 "Photonische Kristalle"run by the Deutsche Forschungsgemeinschaft (DFG), resulting in a survey of the current state of photonic crystal research in Germany. The first part of the book describes methods for the theoretical analysis of their optical properties as well as the results. The main part is dedicated to the fabrication, characterization and modeling of two- and three-dimensional photonic crystals, while the final section presents a wide spectrum of applications: gas sensors, micro-lasers, and photonic crystal fibers. Illustrated in full color, this book is not only of interest to advanced students and researchers in physics, electrical engineering, and material science, but also to company R&D departments involved in photonic crystal-related technological developments.

关键词： Photons. Crystal optics.

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Introduction to Miroelectromechanical Systems engineering, Second Edition

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2004年

作者： Nadim Maluf Kirt Williams

ISBN: (数字)9781580535915

Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company"s management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.

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Proceedings of SPIE: current developments in Lens design and optical engineering iii

Proceedings of SPIE: Current Developments in Lens Design and...

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current developments in Lens design and optical engineering iii

This Volume 4767 of the conference proceedings contains 19 papers. Topics discussed include optical system, optical sensors, optical materials, optical design and optical devices.

关键词： optical engineering

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Silicon germanium strained layers and heterostructures

Silicon germanium strained layers and heterostructures

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20th Nordic Semiconductor Meeting, NSM20

作者： Willander, M. Nur, O. Jain, S.C. Laboratory of Physical Electronics and Photonics Physics and Engineering Physics Chalmers University of Technology Gothenburg University 412 96 Gothenburg Sweden IMEC Kapeldreef 75 3001 Leuven Belgium

The integration of strained-Si1-xGex into Si technology has enhanced the performance and extended the functionality of Si based circuits. The improvement of device performance is observed in both AC as well as DC characteristics of these devices. The category of such devices includes field effect as well as bipolar families. Speed performance in some based circuits has reached limits previously dominated by iii-V heterostructures based devices. In addition, for some optoelectronics applications including photodetectors it is now possible to easily integrate strained-Si 1-xGex based optical devices into standard Silicon technology. The impact of integrating strained and relaxed Si 1-xGex alloys into Si technology is important. It has lead to stimulate Si research as well as offers easy options for performances that requires very complicated and costly process if pure Si has to be used. In this paper we start by discussing the strain and stability of Si1-xGe x alloys. The origin and the process responsible for transient enhanced diffusion (TED) in highly doped Si containing layers will be mentioned. Due to the importance of TED for thin highly doped Boron strained-Si 1-xGex layers and its degrading consequences, possible suppression design methods will be presented. Quantum well pchannel MOSFETs (QW-PMOSFETs) based on thin buried QW are solution to the low speed and weak current derivability. Different aspects of designing these devices for a better performance are briefly reviewed. Other FETs based on tensile strained Si on relaxed Si1-xGex for n-channel and modulation doped field effect transistors (MODFETs) showed excellent performance. Record AC performance well above 200GHz for fmax is already observed and this record is expected to increase in the coming years. Heterojunction bipolar transistors (HPTs) with thin strained-Si1-xGex highly doped base have lead to optimize the performance of the bipolar technology for many applications easily. The strategies of desi

关键词： Heterojunctions

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Proceedings of SPIE: current developments in Lens design and optical engineering IV

Proceedings of SPIE: Current Developments in Lens Design and...

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current developments in Lens design and optical engineering IV

The proceedings contains 15 papers from the Proceedings of SPIE: current developments in Lens design and optical engineering IV. Topics discussed include: Zernike polynomials and aberration balancing;optical design for imaging spectroscopy;integral optical system design of injection molded optics;structured design method for automotive lamp reflectors;optical systems for free-space laser communications;and current status and future direction of sensors in Earth observing satellites.

关键词： optical systems

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