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检索条件"任意字段=Design, Modeling, and Simulation in Microelectronics"
1685 条 记 录,以下是1-10 订阅
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design modeling, and simulation in microelectronics
Design modeling, and simulation in microelectronics
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design, modeling, and simulation in microelectronics
This Volume 4228 of the conference proceedings contains 45 papers. Topics discussed include computer aided design for microelectronics and microelectromechanical devices, advanced design method, high level synthesis a... 详细信息
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microelectronics Package design Using Experimentally-Validated modeling and simulation
Microelectronics Package Design Using Experimentally-Validat...
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4th International Symposium on Advanced Ceramics (ISAC-4)
作者: Young, Nathan Johnson, Jay Ewsuk, Kevin Sandia Natl Labs Albuquerque NM 87185 USA
Packaging high power radio frequency integrated circuits (RFICs) in low temperature cofired ceramic (LTCC) presents many challenges. Within the constraints of LTCC fabrication, the design must provide the usual electr... 详细信息
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SMACD / PRIME 2021 - International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design and 16th Conference on PhD Research in microelectronics and Electronics
SMACD / PRIME 2021 - International Conference on Synthesis, ...
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2021 International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th Conference on PhD Research in microelectronics and Electronics, PRIME 2021
The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on F...
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Transfer Learning Framework for 3-D Electromagnetic Applications
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 2025年
作者: Akinwande, Oluwaseyi Jia, Xiaofan Deroo, Andries Lu, Yang Lin, Hank Tseng, Bin-Chyi Swaminathan, Madhavan Georgia Inst Technol Sch Elect & Comp Engn Atlanta GA 30332 USA ASUS Taipei 112 Taiwan Penn State Univ Sch Elect Engn & Comp Sci State Coll PA 16802 USA
In the realm of machine-learning (ML)-based electronic design automation (EDA), several factors contribute to inefficiency, posing various challenges. Initially, the lack of flexibility in input structures hinders the... 详细信息
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Warpage prediction of fan-out wafer-level package based on coupled deep learning and finite element simulation
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microelectronics RELIABILITY 2025年 170卷
作者: Zhao, Xiaohui Zheng, Hao Zhao, Zhiyan Cheng, Mengxuan Li, Wenqian Wan, Guoshun Jia, Yuxi Shandong Univ Sch Mat Sci & Engn 17923Jingshi Rd Jinan 250061 Shandong Peoples R China Shandong Univ Sci & Technol Coll Comp Sci & Engn 579Qianwangang Rd Qingdao 266590 Shandong Peoples R China
In recent years, fan-out wafer-level package (FOWLP) has gained widespread attention in integrated circuit industry due to its significant potential in enhancing packaging performance, reducing costs and minimizing si... 详细信息
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modeling and simulation of an All-Digital Pll for Bluetooth Low Energy in Python  16
Modeling and Simulation of an All-Digital Pll for Bluetooth ...
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16th IEEE Latin American Symposium on Circuits and Systems, LASCAS 2025
作者: Weschenfelder, Anderson Felipe Da Silva Franca, Thiago Rieck, Lucas Gasparin Ferreira, Sandro Binsfeld Polytechnical School Unisinos University São Leopoldo Brazil
This paper presents the design and modeling of a Bluetooth Low Energy (BLE) All-Digital Phase-Locked Loop (ADPLL) for 28nm CMOS technology. A behavioral model was developed and implemented using event-driven simulatio... 详细信息
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modeling and simulation of plasma etching reactors for microelectronics
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THIN SOLID FILMS 2000年 第2期365卷 348-367页
作者: Economou, DJ Univ Houston Dept Chem Engn Plasma Proc Lab Houston TX 77204 USA
As microelectronic devices continue to shrink and process requirements become ever more stringent, plasma modeling and simulation becomes increasingly more attractive as a tool for design, control, and optimization of... 详细信息
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TCAD simulation of Radiation Effects on 180 nm Logic Inverters
TCAD Simulation of Radiation Effects on 180 nm Logic Inverte...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Eike Trumann Amen Allah Bahri Gia Bao Thieu Kirsten Weide-Zaage Dorian Von Wolff Andre Bausen Alexander Müller Guillermo Payá-Vayá Chair for Chip Design for Embedded Computing Technische Universität Braunschweig Braunschweig Germany RESRI Group Institute of Microelectronic Systems (IMS) Leibniz Universität Hannover Hannover Germany Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS) Munster Germany
This work presents a physically based simulation evaluation of the effects of single ionizing particles and displacement damage on logic inverter gates in a complementary metal-oxide semiconductor (CMOS) with 180 nm s... 详细信息
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modeling of FE Parasitic Inductance in BCD Power Switches
Modeling of FE Parasitic Inductance in BCD Power Switches
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Ștefan Ardeleanu Ioan Marius Purcar Cristian Boianceanu Electrotechnics and Measurements Department Technical University of Cluj-Napoca Cluj-Napoca Romania Design Enabling Services Infineon Technologies Romania Bucharest Romania
This paper proposes a calculation methodology for assessing the parasitic inductance within an IC package. As a case study, the BCD technology of one of the top IC suppliers was used. The results will be evaluated aga... 详细信息
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Mixed-Level modeling Methodology for Network-on-Chip Architecture Exploration
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Chinese Journal of Electronics 2025年 第3期23卷 468-473页
作者: Shouyi Yin Zhen Zhang Yang Hu Leibo Liu Shaojun Wei Institute of Microelectronics Tsinghua University Beijing China National Laboratory for Information Science and Technology Tsinghua University Beijing China
As Network on chip (NoC) architecture de-velops as an solution of interconnection in System on chip (SoC) designs, a detailed and flexible interconnection network model integrated in a full system evaluation frame-wor... 详细信息
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