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检索条件"任意字段=Design, Modeling, and Simulation in Microelectronics"
1684 条 记 录,以下是1-10 订阅
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SMACD / PRIME 2021 - International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design and 16th Conference on PhD Research in microelectronics and Electronics
SMACD / PRIME 2021 - International Conference on Synthesis, ...
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2021 International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th Conference on PhD Research in microelectronics and Electronics, PRIME 2021
The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on F...
来源: 评论
2023 24th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2023
2023 24th International Conference on Thermal, Mechanical an...
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24th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2023
The proceedings contain 105 papers. The topics discussed include: thermomechanical and electrical material characterization for a DLP printing process simulation of electrically conductive parts;studying asymmetric wa...
来源: 评论
Special Section Guest Editorial: Plasma modeling and Feature Profile simulation
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JOURNAL OF MICRO-NANOPATTERNING MATERIALS AND METROLOGY-JM3 2023年 第4期22卷
作者: Labelle, Catherine B. Kushner, Mark J. Intel Corp Rio Rancho NM 87124 USA Univ Michigan Ann Arbor MI USA
. Guest Editors Catherine B. Labelle and Mark J. Kushner introduce the Special Section on Plasma modeling and Feature Profile simulation.
来源: 评论
Transfer Learning Framework for 3-D Electromagnetic Applications
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 2025年
作者: Akinwande, Oluwaseyi Jia, Xiaofan Deroo, Andries Lu, Yang Lin, Hank Tseng, Bin-Chyi Swaminathan, Madhavan Georgia Inst Technol Sch Elect & Comp Engn Atlanta GA 30332 USA ASUS Taipei 112 Taiwan Penn State Univ Sch Elect Engn & Comp Sci State Coll PA 16802 USA
In the realm of machine-learning (ML)-based electronic design automation (EDA), several factors contribute to inefficiency, posing various challenges. Initially, the lack of flexibility in input structures hinders the... 详细信息
来源: 评论
PFed-Litho: Lithography modeling with a Personalized Federated Learning Based Framework
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IEEE Transactions on Computer-Aided design of Integrated Circuits and Systems 2024年 第6期44卷 2264-2276页
作者: Zhang, Qing Zhang, Yuhang Chen, Rui Lu, Wei Huang, Huajie Li, Zhiqiang Li, Yongfu Shanghai Jiao Tong University Department of Micro-Nano Electronics MoE Key Lab of Artificial Intelligence Shanghai200240 China East China Normal University School of Integrated Circuit Science and Engineering Shanghai200240 China Chinese Academy of Sciences Key Laboratory of Microelectronics Devices and Integrated Technology Institute of Microelectronics Beijing100029 China University of Chinese Academy of Sciences Beijing101408 China
modeling lithography using machine learning is extremely data-intensive. Due to intellectual property privacy concerns and potential malicious attacks, design houses and foundries are unwilling to share their designs ... 详细信息
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modeling, Optimization, and simulation of Nanomaterials-Based Organic Thin Film Transistor for Future Use in pH Sensing
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RECENT PATENTS ON NANOTECHNOLOGY 2024年 第1期18卷 45-53页
作者: Moorthy, Vijai Meyyappan Mohan, Viranjay Srivastava Univ KwaZulu Natal Howard Coll Dept Elect Engn ZA-4041 Durban South Africa
Introduction: Applications of Organic Thin Film Transistor (OTFT) range from flexible screens to disposable sensors, making them a prominent research issue in recent decades. A very accurate and exact pH sensing deter... 详细信息
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A Brief Review of design and simulation Methodology in Silicon Photonics
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Tsinghua Science and Technology 2022年 第3期27卷 526-533页
作者: Chonglei Sun Liuge Du Jia Zhao School of Information Science and Engineering Shandong UniversityQingdao 266237China
Powerful electronic design automation tools have enabled the rapid development of electronic Integrated Circuits(ICs). Similar to electronic ICs, silicon photonics technology has sufficiently matured, and large-scale ... 详细信息
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modeling of HCI effect in nFinFET for circuit reliability simulation
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microelectronics RELIABILITY 2024年 163卷
作者: Zhang, Jun-an Liu, Bo Chen, Hao Li, Chao Li, Dan Li, Tiehu Lu, Yunhua Zhang, Qingwei Chongqing Univ Technol Coll Artificial Intelligence Chongqing Peoples R China
This paper proposes an equivalent circuit model for simulating the Hot Carrier Injection (HCI) effect. This model is developed based on the N-FinFET in the 12 nm Process design Kit (PDK) and incorporates arithmetic un... 详细信息
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AI-assisted design for Reliability: Review and Perspectives  25
AI-assisted Design for Reliability: Review and Perspectives
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25th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024
作者: Yuan, Cadmus De Jong, S.D.M. Van Driel, Willem D. Department of Mechanical and Computer-aided Engineering Feng Chia University Taichung Taiwan No. 100 Wenhwa Rd. Seatwen Taichung40724 Taiwan Department of Microelectronics Delft University of Technology Delft Netherlands Mekelweg 4 CD Delft2628 Netherlands
The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this ... 详细信息
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Thermal Reliability simulation Analysis of Planar Microsystem  9
Thermal Reliability Simulation Analysis of Planar Microsyste...
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9th International Conference on Integrated Circuits and Microsystems, ICICM 2024
作者: Sun, Shikai Chen, Lei Lu, Zhenlin Zhao, Xuan Liu, Lili Ren, Yongzheng School of Integrated Circuits Peking University Beijing Microelectronics Technology Institute Beijing China Beijing Microelectronics Technology Institute Beijing China
As a typical representative technological route of chip technology, microsystems have gradually become one of the main solutions for the small-volume, speciality applications. Heat is the main limitation of the micros... 详细信息
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