咨询与建议

限定检索结果

文献类型

  • 1,326 篇 会议
  • 324 篇 期刊文献
  • 26 册 图书
  • 8 篇 学位论文

馆藏范围

  • 1,684 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 785 篇 工学
    • 416 篇 电子科学与技术(可...
    • 396 篇 电气工程
    • 257 篇 计算机科学与技术...
    • 238 篇 材料科学与工程(可...
    • 145 篇 软件工程
    • 70 篇 机械工程
    • 61 篇 控制科学与工程
    • 53 篇 信息与通信工程
    • 43 篇 化学工程与技术
    • 41 篇 仪器科学与技术
    • 36 篇 动力工程及工程热...
    • 26 篇 力学(可授工学、理...
    • 23 篇 光学工程
    • 17 篇 冶金工程
    • 14 篇 生物医学工程(可授...
    • 10 篇 建筑学
    • 9 篇 土木工程
    • 9 篇 生物工程
    • 8 篇 安全科学与工程
    • 6 篇 交通运输工程
  • 323 篇 理学
    • 224 篇 物理学
    • 107 篇 数学
    • 42 篇 化学
    • 24 篇 系统科学
    • 15 篇 统计学(可授理学、...
    • 11 篇 生物学
  • 63 篇 管理学
    • 57 篇 管理科学与工程(可...
    • 7 篇 工商管理
  • 10 篇 法学
    • 10 篇 社会学
  • 9 篇 医学
    • 8 篇 临床医学
  • 4 篇 教育学
  • 3 篇 经济学
  • 3 篇 艺术学
  • 2 篇 军事学

主题

  • 300 篇 computational mo...
  • 280 篇 microelectronics
  • 267 篇 circuit simulati...
  • 226 篇 integrated circu...
  • 141 篇 semiconductor de...
  • 114 篇 analytical model...
  • 108 篇 solid modeling
  • 107 篇 simulation
  • 84 篇 mathematical mod...
  • 64 篇 hardware design ...
  • 63 篇 spice
  • 61 篇 cmos technology
  • 59 篇 silicon
  • 58 篇 design automatio...
  • 54 篇 design optimizat...
  • 54 篇 predictive model...
  • 52 篇 computer simulat...
  • 49 篇 semiconductor pr...
  • 47 篇 voltage
  • 47 篇 logic gates

机构

  • 27 篇 institute of mic...
  • 18 篇 institute of mic...
  • 17 篇 institute of mic...
  • 9 篇 institute of mic...
  • 8 篇 institute of mic...
  • 8 篇 institute for mi...
  • 7 篇 天津大学
  • 7 篇 university of ch...
  • 7 篇 institute of mic...
  • 7 篇 西安电子科技大学
  • 7 篇 school of softwa...
  • 7 篇 school of microe...
  • 6 篇 department of mi...
  • 6 篇 school of microe...
  • 6 篇 school of microe...
  • 6 篇 institute of ele...
  • 6 篇 department of mi...
  • 5 篇 shanghai researc...
  • 5 篇 中国科学院大学
  • 5 篇 school of microe...

作者

  • 14 篇 s. selberherr
  • 12 篇 siegfried selber...
  • 10 篇 xiaowu zhang
  • 9 篇 a. napieralski
  • 8 篇 ru huang
  • 7 篇 t.j. sanders
  • 7 篇 xuan zeng
  • 6 篇 andrzej napieral...
  • 6 篇 xiaoyan liu
  • 6 篇 g.q. zhang
  • 6 篇 m.k. iyer
  • 6 篇 a. mathewson
  • 6 篇 n. ranganathan
  • 6 篇 dagmar peters-dr...
  • 6 篇 steffen paul
  • 6 篇 m. glesner
  • 6 篇 roca e.
  • 5 篇 khaoula mbarek
  • 5 篇 guoyong shi
  • 5 篇 sami ghedira

语言

  • 1,578 篇 英文
  • 89 篇 中文
  • 14 篇 其他
  • 2 篇 德文
  • 1 篇 罗马尼亚文
检索条件"任意字段=Design, Modeling, and Simulation in Microelectronics"
1684 条 记 录,以下是51-60 订阅
排序:
modeling of FE Parasitic Inductance in BCD Power Switches
Modeling of FE Parasitic Inductance in BCD Power Switches
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Ștefan Ardeleanu Ioan Marius Purcar Cristian Boianceanu Electrotechnics and Measurements Department Technical University of Cluj-Napoca Cluj-Napoca Romania Design Enabling Services Infineon Technologies Romania Bucharest Romania
This paper proposes a calculation methodology for assessing the parasitic inductance within an IC package. As a case study, the BCD technology of one of the top IC suppliers was used. The results will be evaluated aga... 详细信息
来源: 评论
modeling of Eye Diagram for Jitter Estimation in Presence of Ground Bounce
Modeling of Eye Diagram for Jitter Estimation in Presence of...
收藏 引用
Electrical design of Advanced Packaging and Systems Symposium, EDAPS
作者: Anuj Kumar Jai Narayan Tripathi Indian Institute of Technology Jodhpur
The developed method in this paper presents an analytical approach for combined modeling of rising and falling transition edges to estimate jitter using an eye diagram in the presence of ground bounce noise (GBN) in a... 详细信息
来源: 评论
AI-assisted design for Reliability: Review and Perspectives
AI-assisted Design for Reliability: Review and Perspectives
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Cadmus Yuan S. D. M de Jong Willem D. van Driel Department of Mechanical and Computer-aided Engineering Feng Chia University Taichung Taiwan No. 100 Wenhwa Rd. Seatwen Taichung Taiwan R.O.C Department of Microelectronics Delft University of Technology Delft Netherlands Mekelweg 4 2628 CD Delft Netherlands
The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this ...
来源: 评论
Mixed-Level modeling Methodology for Network-on-Chip Architecture Exploration
收藏 引用
Chinese Journal of Electronics 2025年 第3期23卷 468-473页
作者: Shouyi Yin Zhen Zhang Yang Hu Leibo Liu Shaojun Wei Institute of Microelectronics Tsinghua University Beijing China National Laboratory for Information Science and Technology Tsinghua University Beijing China
As Network on chip (NoC) architecture de-velops as an solution of interconnection in System on chip (SoC) designs, a detailed and flexible interconnection network model integrated in a full system evaluation frame-wor... 详细信息
来源: 评论
TCAD modeling, Validation, and Performance Prediction of Fe Tail Effects in AlGaN/GaN HEMTs Based on Experimental Data  21
TCAD Modeling, Validation, and Performance Prediction of Fe ...
收藏 引用
21st China International Forum on Solid State Lighting and 10th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2024
作者: Su, Xuan Yang, Ling Gao, Wenze Lu, Hao School of Microelectronics Xidian University Xi’an710071 China
In this work, we first fitted the three different Fe tailing effects (slopes) with the corresponding two-dimensional electron gas (2DEG) concentration and mobility based on experimental data, obtaining the correspondi... 详细信息
来源: 评论
A MEMS CAPACITIVE MICROPHONE WITH RIBBED BACK-PLATE FOR ENHANCING HIGH-PRESSURE RELIABILITY PERFORMANCE  29
A MEMS CAPACITIVE MICROPHONE WITH RIBBED BACK-PLATE FOR ENHA...
收藏 引用
29th International Congress on Sound and Vibration, ICSV 2023
作者: Peng, Tzu-Huan Hsu, Huei-Ju Huang, Jin H. Huang, Chien-Hsing Feng Chia University Taichung Taiwan Qsensing Microelectronics Co. Ltd.
The present study designs and implements a microelectromechanical system (MEMS) capacitive microphone with a ribbed backplate for improving the reliability performance in the high pressure burst test (HPBT). During th... 详细信息
来源: 评论
Machine learning in the analog circuit simulation loop  16
Machine learning in the analog circuit simulation loop
收藏 引用
2021 International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th Conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Tzenov, Petar Sokar, Ahmed Infineon Technologies AG Neubiberg Germany
This paper presents the software coupling of an analog circuit simulator (ACS) to a machine learning (ML) execution engine, in order to enable usage of ML models in circuit simulation context. This is achieved by inte... 详细信息
来源: 评论
Reduced-Order Modelling for Efficient Chip-Package-Board design
Reduced-Order Modelling for Efficient Chip-Package-Board Des...
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Chengdong Yuan Sönke Maeter Simon Kuttler Olaf Wittler Tamara Bechtold Jade University of Applied Sciences Wilhelmshaven Germany Cadfem GmbH Munich Germany Fraunhofer IZM Berlin Germany
In the development cycle of microelectronic components and systems, comprehensive reliability assessments of the products in the virtual environment save the costs of manufacturing prototypes. In this simulation proce... 详细信息
来源: 评论
A Verilog-A/MS Compact Model for the Temperature Dependency of the Open-Circuit Voltage for Integrated Diodes
A Verilog-A/MS Compact Model for the Temperature Dependency ...
收藏 引用
International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD)
作者: Pablo Fernández-Peramo Juan A. Leñero-Bardallo Sergio Palomeque-Mangut Ángel Rodríguez-Vázquez Institute of Microelectronics of Seville (IMSE-CNM) CSIC-Universidad de Sevilla Spain
The open-circuit voltage is a crucial parameter that determines the harvesting capabilities of diodes operating in the photovoltaic regime. It is highly dependent on temperature and illumination which may limit the di... 详细信息
来源: 评论
Machine Learning-Assisted Single-Event Transient Model of 12nm FinFETs for Circuit-Level simulation  15
Machine Learning-Assisted Single-Event Transient Model of 12...
收藏 引用
15th IEEE International Conference on ASIC, ASICON 2023
作者: Lin, Jianwen Cai, Linlin Chen, Yutao Zhang, Haoyu Chen, Wangyong Sun Yat-sen University School of Microelectronics Science and Technology Guangzhou510275 China Sun Yat-sen University Guangdong Provincial Key Laboratory of Optoelectronic Information Processing Chips and Systems Guangzhou510275 China
As the geometries of transistors continue to scale down, single-event transient (SET) are becoming a major source of soft errors in circuit design. This paper proposes a machine learning method for modeling SET in cir... 详细信息
来源: 评论