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检索条件"任意字段=Design, Modeling, and Simulation in Microelectronics"
1684 条 记 录,以下是61-70 订阅
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modeling, simulation and Analysis of Thermal Resistance in Multi-finger AlGaN/GaN HEMTs on SiC Substrates
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Chinese Physics Letters 2012年 第8期29卷 279-283页
作者: WANG Jian-Hui WANG Xin-Hua PANG Lei CHEN Xiao-Juan LIU Xin-Yu Key Laboratory of Microelectronics Device&Integrated Technology Institute of MicroelectronicsChinese Academy of SciencesBeijing 100029
The effects of varying layout geometries and various thermal boundary resistances(TBRs)on the thermal resistance of multi-finger AlGaN/GaN HEMTs are thoroughly investigated using a combination of a two-dimensional ele... 详细信息
来源: 评论
modeling Tool for Capacitive RF MEMS Operating Bias Voltage Optimization
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IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 2019年 第4期19卷 602-608页
作者: Amiaud, Anne-Charlotte Leuliet, Aude Loiseaux, Brigitte Nagle, Julien Martins, Paolo Aubry, Raphael Hole, Stephane Thales Res & Technol GRTM F-91767 Palaiseau France Sorbonne Univ PSL Univ CNRS ESPCI Paris F-75005 Paris France
In this paper, dielectric charging process in dielectrics under bias voltage is investigated. Dielectric materials, used in numerous devices in microelectronics, can be subjected to significant electrical stress. Thes... 详细信息
来源: 评论
design Automation of Superconductive Digital Circuits: A review
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IEEE NANOTECHNOLOGY MAGAZINE 2021年 第6期15卷 54-67页
作者: Krylov, Gleb Kawa, Jamil Friedman, Eby G. Univ Rochester Dept Elect & Comp Engn New York NY 14627 USA Synopsys Inc Mountain View CA 94043 USA
Electronic design Automation (EDA) is essential for the design of large-scale microelectronic systems. In this article, EDA methodologies, techniques, and algorithms used to develop superconductive computing systems a... 详细信息
来源: 评论
Electro-thermal analysis and optimization of edge termination of power diode supported by 2D numerical modeling and simulation
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microelectronics RELIABILITY 2012年 第3期52卷 463-468页
作者: Pribytny, P. Donoval, D. Chvala, A. Marek, J. Molnar, M. Slovak Univ Technol Bratislava Dept Microelect Fac Elect Engn & Informat Technol Bratislava 81219 Slovakia
High reliability and performance of power semiconductor devices depend on an optimized design based on a good understanding of their electro-thermal behavior and of the influence of parasitic components on their opera... 详细信息
来源: 评论
SET-based nano-circuit simulation and design method using HSPICE
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microelectronics JOURNAL 2005年 第8期36卷 741-748页
作者: Zhang, FM Tang, R Kim, YB Northeastern Univ Dept Elect & Comp Engn Boston MA 02115 USA
This paper presents a simulation and design method for complementary SET-based nano-circuits from a practical circuit design point of view. HSPICE behavioral implementation of modified Lientschnig's SET model base... 详细信息
来源: 评论
design and analysis of RAM transparent March test for BIST implementation
Design and analysis of RAM transparent March test for BIST i...
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Conference on design, modeling, and simulation in microelectronics
作者: Demidenko, S Henderson, S Massey Univ Inst Informat Sci & Technol Palmerston North New Zealand
New transparent memory test algorithms for semiconductor memory are presented in the paper along with the modified memory testing simulation package MAP. The test algorithms allow detecting memory read errors - the er... 详细信息
来源: 评论
Vacuum electronics
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IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 2002年 第3期50卷 835-845页
作者: Parker, RK Abrams, RH Danly, BG Levush, B USN Res Lab Washington DC 20375 USA
This paper explores the recent history and diversity of this remarkable technology, with emphasis on recent advances in the more traditional device types (traveling-wave tube and klystron), as well as more recent inno... 详细信息
来源: 评论
Bit-parallel multidelay simulation
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IEEE TRANSACTIONS ON COMPUTER-AIDED design OF INTEGRATED CIRCUITS AND SYSTEMS 1996年 第12期15卷 1547-1554页
作者: Lee, YS Maurer, PM UNIV S FLORIDA DEPT COMP SCI & ENGNTAMPAFL 33620
The multidelay parallel (MDP) technique is a multidelay logic simulation algorithm that uses no timing wheel, or any other event-sorting mechanism, Instead, wide bit-fields containing net-values for several different ... 详细信息
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Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling
Multi-physics modeling in virtual prototyping of electronic ...
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International Conference on Thermal and Mechanical simulation and Experiments in microelectronics and Microsystems
作者: Fan, XJ Zhou, J Zhang, GQ Philips Res USA Briarcliff Manor NY 10510 USA Lamar Univ Dept Engn Mech Beaumont TX 77710 USA Eindhoven Univ Technol Eindhoven Netherlands
The realization of virtual prototyping of electronic packages depends on the capability and reliability of multiphysics modeling. This paper focuses on the methods and solutions of combined thermal and thermo-mechanic... 详细信息
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Thermal modeling of planar transformer for switching power converters
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microelectronics RELIABILITY 2010年 第9-11期50卷 1778-1782页
作者: Bernardoni, M. Delmonte, N. Cova, P. Menozzi, R. Univ Parma Dipartimento Ingn Informaz I-43100 Parma Italy
This paper presents thermal simulations for reliability-oriented design of planar transformers for medium-power, high-frequency DC-DC converters. The modeling approach is based on accurate 3D finite-element thermal si... 详细信息
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