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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Y.C. Chen K.N. Chiang Dept. of Power Mechanical Engineering Advanced Microsystem Packaging and Nano-Mechanics Research Lab National Tsing Hua University Hsinchu Taiwan R.O.C

The area utilization rate for fan-out panel level packaging (PLP) is higher than rounded Wafer Level Packaging (WLP). This is due to the fact that both the chip and the carrier in PLP are square-shaped. The mass production characteristics of PLP provide low manufacturing costs, and PLP becomes a potential technology. However, due to the large footprint of PLP, the warpage problem PLP can be more severe than those in WLP. Technically, excessive warpage can lead to alignment challenges, potentially causing a drop in production yield. This makes the investigation of PLP’s warpage issue critically important. Two major reasons cause the warpage problem, the mismatch in the Coefficient of Thermal Expansion (CTE) between materials and the shrinkage of the epoxy molding compound during its curing *** investigate the warpage problem, this study employs a design on simulation approach, utilizing the finite element method (FEM) for simulations, in which a viscoelastic model is used to simulate the molding layer to present the real situation of EMC. Process modeling technology is applied to approach actual PLP production conditions. Furthermore, this study also applies an AI algorithm to our methodology. That is, AI-assisted design on simulation. The process is to train the AI model by establishing FEM warpage results obtained under different feature sizes. And when future PLP data becomes available, it can further shorten the time required to estimate the warpage mode after the delamination process.

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Event-driven modeling and simulation of 5G NR-band RF transceiver in SystemVerilog 16

Event-driven modeling and simulation of 5G NR-band RF transc...

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2021 International Conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th Conference on PhD Research in microelectronics and Electronics, PRIME 2021

作者： Park, Chan Young Kim, Jaeha Elelctrical and Computer Engineering Department Seoul National University Seoul Korea Republic of

ISBN: (纸本)9783800755899

While baseband-equivalent real-number models (RNMs) are the current state-of-the-art for modeling RF transceivers in SystemVerilog, but their simulation speeds and accuracies are not adequate for predicting performance degradation due to DC offsets or high-order harmonic effects. This paper presents the models for a multi-standard, direct-conversion RF transceiver using XMODEL, for evaluating its system-level performance as well as verifying its digital controllers. The simulation results indicate that the presented models, including the digital configuration/calibration logic for the 5G sub-6GHz-band and mmWave-band transceiver, can deliver 30–1800× higher speeds than the baseband-equivalent RNMs while estimating the quadrature amplitude modulation signal constellation and error vector magnitude in the presence of non-idealities such as non-linearities, DC offsets, and I/Q imbalances. © VDE VERLAG GMBH.

关键词： Timing circuits

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Multi-Scale Electrothermal Co-simulation of GaN HEMTs at the Device and Packaging Levels

Multi-Scale Electrothermal Co-Simulation of GaN HEMTs at the...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Yi Zhang Ziyue Zhang Yuchao Wu Zhiying Chen Dong Lu Ke Xue Renjie Wang Smart Manufacturing Thrust HKUST(GZ) Guangzhou China Microelectronics Thrust HKUST(GZ) Guangzhou China College of Future Technology HKUST(GZ) Guangzhou China

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Gallium Nitride High Electron Mobility Transistors (GaN HEMTs) are critical for high-power and high-frequency applications but face challenges from self-heating and inadequate thermal management, which degrade performance and reliability. Existing tools like Technology Computer Aided design (TCAD) and finite element analysis (FEA) lack integrated electrothermal coupling capabilities. This study proposes a multi-scale electrothermal co-simulation framework to bridge device-level electrical behavior and packaging-level thermal dynamics. The methodology integrates 2D TCAD simulations for localized Joule heating in the two-dimensional electron gas (2DEG) region with 3D FEA modeling to evaluate heat dissipation across packaging structures. An iterative loop couples the electrical power density from TCAD into FEA as averaged heat sources, updating boundary conditions until thermal convergence is achieved. Key innovations include a deep neural network (DNN) to resolve highly localized heat distributions from TCAD data and an equivalent thermal conductivity model for computational efficiency. The multi-scale approach successfully captured electrothermal interactions, enabling optimized packaging designs and material adjustments to balance heat generation and power efficiency. This work demonstrates the necessity of a coupled simulation for accurate performance prediction and thermal management in GaN HEMTs, offering a pathway to enhance reliability in high-power applications.

关键词： Heating systems Performance evaluation Temperature distribution Solid modeling HEMTs Packaging Electronic packaging thermal management Thermal management MODFETs Gallium nitride

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Adaptive simulation with HDL control module for frequency converting circuits 16

Adaptive simulation with HDL control module for frequency co...

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作者： Tibenszky, Zoltán Kreißig, Martin Carta, Corrado Ellinger, Frank Circuit Design and Network Theory Technische Universität Dresden Dresden01069 Germany

ISBN: (纸本)9783800755899

An adaptive simulator-independent method is presented, which reduces the simulation and post-processing time of transient simulations through the use of an intelligent sweep control implemented as a behavioural model. It is capable to effectively reduce the points to be simulated for determining the operation regions, or to find the local extrema of a continuous value performance parameter. It controls the variable sweeps based on real time simulation results, and delivers the circuit’s performance parameters to be determined in a text file. This eliminates the often time consuming additional post-processing steps. The effectiveness of the proposed method is demonstrated for the case of a frequency divider verification, where it has led to a 10 times reduction in the simulation time, and eliminated any additional post-processing steps. © VDE VERLAG GMBH.

关键词： Timing circuits

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A compact model for scalable MTJ simulation 16

A compact model for scalable MTJ simulation

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作者： García-Redondo, Fernando Prabhat, Pranay Bhargava, Mudit Dray, Cyrille Arm Ltd. Cambridge United Kingdom Arm Inc. Austin United States Arm Ltd. La Paros France

ISBN: (纸本)9783800755899

This paper presents a physics-based modeling framework for the analysis and transient simulation of circuits containing Spin-Transfer Torque (STT) Magnetic Tunnel Junction (MTJ) devices. The framework provides the tools to analyze the stochastic behavior of MTJs and to generate Verilog-A compact models for their simulation in large VLSI designs, addressing the need for an industry-ready model accounting for real-world reliability and scalability requirements. Device dynamics are described by the Landau-Lifshitz-Gilbert-Slonczewsky (s-LLGS) stochastic magnetization considering Voltage-Controlled Magnetic Anisotropy (VCMA) and the non-negligible statistical effects caused by thermal noise. Model behavior is validated against the OOMMF magnetic simulator and its performance is characterized on a 1-Mb 28 nm MagnetoresistiveRAM (MRAM) memory product. © VDE VERLAG GMBH.

关键词： Magnetic anisotropy

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Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solder Balls

Nonlinear Superelement for the Reliability Assessment of Vis...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Mike Feuchter Hanna Baumgartl Martin Hanke Sven Rzepka CADFEM Germany GmbH Germany CADFEM Germany GmbH Berlin Germany Fraunhofer ENAS Chemnitz Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

The paper proposes a novel approach to the modeling of the thermo-mechanical behavior of ball grid array (BGA) packages on printed circuit boards in the metal housing of electronic control units, which is needed for optimizing the design for reliability. The new approach reduces the computational effort significantly without compromising the result accuracy. The method is based on a modular system of reduced-order models (ROMs). Specifically, the energy-conserving sampling and weighting method (ECSW) for capturing complex material behavior is discussed as a key enabler. After introducing the method for a single solder ball, it is extended to the representation of all solder balls of the BGA by the same ROM in order to enable its application for practical cases. The results obtained with this 'Combined ROM' are compared with those of regular FEA in terms of accuracy and computational effort.

关键词： Micromechanical devices Accuracy Thermomechanical processes Printed circuits Metals Reliability engineering Reduced order systems microelectronics Integrated circuit reliability Read only memory

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A Strabismus Surgery Parameter design Model with WGAN-GP Data Enhancement Method 2

A Strabismus Surgery Parameter Design Model with WGAN-GP Dat...

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2021 2nd International Conference on modeling, Big Data Analytics and simulation, MBDAS 2021

作者： Tang, Renhao Wang, Wensi Meng, Qingyu Liang, Shuting Miao, Zequn Guo, Lili Wang, Lejin School of Microelectronics Faculty of Information Technology Beijing University of Technology Beijing China Department of Ophthalmology Peking University People's Hospital Beijing China

The purpose of this paper is a machine learning model that could predict the strabismus surgery parameter through the data of patients as accurately as possible. A strabismus surgery parameter design model's input is a Medical records and return is a surgical value. The Machine learning algorithms is difficult to get a desired result in this process because of the small amount and uneven distribution strabismus surgery data. This paper enhanced the data set through a WGAN-GP model to improve the performance of the LightGBM algorithm. The performance of model is increased from 69.32% to 84.52%. © Published under licence by IOP Publishing Ltd.

关键词： Machine learning

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design of U-band Frequency Doubler Based on Schottky Diode MA4E1317

Design of U-band Frequency Doubler Based on Schottky Diode M...

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2024 Photonics and Electromagnetics Research Symposium, PIERS 2024

作者： Fang, X. Zhang, B. Qin, Y.H. Wen, Y.B. Chongqing University of Posts and Telecommunications Chongqing China Chongqing Institute of Microelectronics Industry Technology UESTC Chongqing China University of Electronic Science and Technology of China Chengdu China China National Accreditation Service for Conformity Assessment China

ISBN: (纸本)9798350375909

In microwave millimeter wave system, solid-state multipliers are an effective way to realize signal sources. Researchers have also demanded higher performance from frequency multipliers. This paper presents a U-band diplexer based on Schottky varactor diode MA4E1317. Due to the limited excitation power sustained by a single nonlinear device, in order to increase the input power capacity of the multiplier, a double Schottky junction frequency doubling circuit form is used. In this paper, an unbalanced multiplier structure is chosen, two diodes are placed in parallel in the same direction on the microstrip line. RF input and output signals are transmitted in TEM mode, this results in a low impedance at the diode input and facilitates impedance matching. In this paper, the overall model of the diode is partitioned and designed for accurate modeling. The diode packaging material part is taken as the linear region, and the Schottky junction core is taken as the nonlinear region. The main parameters of MA4E1317 diode are calculated by three-point method, and modeled using HFSS and ADS respectively. Frequency doubler uses a 2.92mm coaxial input signal and a WR-19 standard rectangular waveguide output signal. By building a full-scale three-dimensional electromagnetic model of the MA4E1317 diode, and building nonlinear equivalent circuits, the input and output circuits of the frequency multiplier are optimally designed using the field-circuit co-simulation method. The simulation results show that the output power is 11dBm-13.39dBm octave efficiency is 7.8%-10.9% at an input power of 23dBm in the 37.5GHz-55GHz band. © 2024 IEEE.

关键词： Frequency doublers

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W-band Broadband Frequency Multiplier 11

W-band Broadband Frequency Multiplier

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11th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2023 - Proceedings

作者： Fang, Xi Zhang, Bo Niu, Zhongqian Wen, Yuanbo Wang, Lei Chongqing University of Posts and Telecommunications School of Optoelectronic Engineering Chongqing400065 China Chongqing Institute of Microelectronics Industry Technology Uestc Chongqing401332 China University of Electronic Science and Technology of China School of Electronic Science and Engineering Chengdu610054 China

ISBN: (纸本)9798350326277

The W-band frequency range has garnered considerable attention among researchers, necessitating the development of efficient frequency doubling techniques. This paper introduces a novel W-band broadband frequency doubler employing a Schottky diode-based approach. A varactor diode, specifically the M4AE1310 model, serves as the crucial nonlinear element in the frequency doubler design. To streamline the model structure, the biased DC ground structure is eliminated. The frequency doubler comprises a waveguide-microstrip probe, a ground-matched direct, a CMRC (compact microstrip resonant cell) low-pass filter, and an input-output matching section. The modeling simulation is conducted using a combined ADS and HFSS. The simulation results demonstrate exceptional frequency doubling efficiency, yielding an output power of approximately 10 dBm when driven with a power of 20 dBm within the W-band frequency range. © 2023 IEEE.

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H∞optimal control design of static var compensator coupling hybrid active power filter based on harmonic state-space modeling

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CPSS Transactions on Power Electronics and Applications 2021年第3期6卷 227-234页

作者： Gong, Cheng Sou, Wai-Kit Lam, Chi-Seng State Key Laboratory of Analog and Mixed-Signal VLSI University of Macau Macao 999078 China also with the Institute of Microelectronics University of Macau Macao 999078 China and also with the Department of Electrical and Computer Engineering Faculty of Science and Technology University of Macau Macao 999078 China

Compared with the conventional active power filter (APF), the static var compensator coupling hybrid active power filter (SVC-HAPF) has distinct characteristics of low DC-link operating voltage, which can lower the system and operational costs. It also has a wider operational range than the conventional hybrid active power filter (HAPF). In this paper, a harmonic state-space (HSS) modeling is firstly proposed to address the nonlinearity issue of the SVC-HAPF. The HSS based SVC-HAPF model is linear time-invariant (LTI), which enables the optimal control techniques. Then, the linear matrix inequality (LMI) based H∞ optimal control design is proposed, which finds the optimal controller parameters via convex optimization algorithm. The proposed controller for the SVC-HAPF achieves high steady-state accuracy, fast transient response, and fixed switching frequency simultaneously. Finally, simulation and experimental results are also provided to verify the effectiveness and performance of the optimal controller for the SVC-HAPF in comparison with the recent developed state-of-the-art multi-quasi-proportional-resonant (MQPR) controller, which shows superior control performances. © 2017 CPSS.

关键词： State space methods

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