The proceedings contain 166 papers and 1 PowerPoint presentation. The topics discussed include: numerical simulation and experimental verification of copper plating with different additives for through silicon VIAS;fi...
ISBN:
(纸本)9781467346450
The proceedings contain 166 papers and 1 PowerPoint presentation. The topics discussed include: numerical simulation and experimental verification of copper plating with different additives for through silicon VIAS;first approach to cost-efficient fine pitch NCA flip-chip assembly on thermoplastic polyurethane printed circuit boards;thinned dies in a stretchable package;development of a multi-terminal crimp package for smart textile integration;low cost environmentally friendly ultrasonic embossed electronic circuit board;a novel injection molded fluidic interposer for microfluidic applications;ultraviolet to near infrared response of optically triggered nonvolatile memories based on platinum nano-particles and high-k dielectrics on a SOI substrate;development of wearable medical system for dehydration detection;and low profile integrated passive devices with 3D high density capacitors ideal for embedded and die stacking solutions.
The proceedings contain 169 papers. The topics discussed include: minimizing form factor and parasitic inductances of power electronic modules: the p2 pack technology;roll-to-roll functional testing of printed conduct...
ISBN:
(纸本)9781538668139
The proceedings contain 169 papers. The topics discussed include: minimizing form factor and parasitic inductances of power electronic modules: the p2 pack technology;roll-to-roll functional testing of printed conductors and organic light emitting devices;power electronic assemblies on printed wiring boards mounted by silver sintering;multilayer plastic substrate for electronics;ultra-thin actives for embedded components: halfway between thin film technology and embedded surface mounted device;potential of BiSn solders for high-temperature electronics;chip/package/board co-simulation methodology for crosstalk between DC/DC converter and ADC input channels;temperature-dependent adhesion measurements of die attach materials to molding compounds and lead frame surfaces enabling robust package designs;and electrodeposition of gold electrode on silicon wafers for submillimeter-wave devices.
The proceedings contain 141 papers. The topics discussed include: advanced chip package interaction qualification for critical stacks in combination with cu pillar interconnect technology;reliability of plastic core s...
ISBN:
(纸本)9781509014026
The proceedings contain 141 papers. The topics discussed include: advanced chip package interaction qualification for critical stacks in combination with cu pillar interconnect technology;reliability of plastic core solder balls in relation to formation of intermetallic compounds;reliability of sputtered thin aluminum films under accelerated stress testing by vibration loading and modeling;non-destructive defect detection for MEMS devices using transient thermography;flexible magnetic field sensors with ultra-thin silicon interposer;high aspect ratio printing of sintering pastes using layered stencils;large area processes for 3D shaped electronics;and merging of packaging technologies for highly integrated embedded modules.
Optical satellites with infrared, visible light, multi-spectral and hyper-spectral cameras, are effective means to achieve multi-targets surveillance. In the scenarios of ultra-high data rate and high temporal sensiti...
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Based on SpringBoot and Echarts technology, this study conducted in-depth analysis and visual display of ecological environment data. Firstly, rich environmental data, including air quality and water quality monitorin...
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This paper investigates a novel belt-type water surface garbage collector, designed to enhance the intelligence and efficiency of garbage collection systems. To address the mechanical structure and control system of t...
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The RISC-V multi-core heterogeneous SOC has five harts that divided into three clusters, and integrates an eFPGA. Inter-cluster is asymmetric-multiprocessor and intra-cluster is symmetric-multiprocessor. The SoC not o...
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With the rapid development of digital technology and the continuous updating of various terminal devices, new retail is gradually becoming an important trend in the retail industry. New retail involves the integration...
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This paper considers the problem of weak moving target detection involving range migration (RM) in a multistatic satellite-based passive radar system with multiple illuminators of opportunity (i.e., multiple transpond...
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Building an operation and maintenance system for teaching buildings that integrates"three-dimensional visualization" and"digital informatization" is essential for realizing a smart campus. To addre...
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