The proceedings contain 220 papers. The topics discussed include: 3D substrate innovation for complex high pin count flip-chip applications;thin wafer processing and chip stacking for 3D integration;wafer-to-wafer hyb...
ISBN:
(纸本)9781424485536
The proceedings contain 220 papers. The topics discussed include: 3D substrate innovation for complex high pin count flip-chip applications;thin wafer processing and chip stacking for 3D integration;wafer-to-wafer hybrid bonding technology for 3D IC;stacked anodized metal substrate for high thermal dissipation performance;reliability improvements for advanced wafer level packaging;wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages;low profile CSP (LP-CSP) technology for ultra-thin IC packaging applications;micro bench for optical pulse picking from 4 GHz pulse trains generated by mode locking of DBR lasers;injection molded lens array for high power led modules;injection molded lens array for high power led modules;and injection molded lens array for high power led modules.
The proceedings contain 155 papers. The topics discussed include: determination of mechanical properties for copper in plated through holes by combination of tensile test and nanoindentation;manufacturing and characte...
ISBN:
(纸本)9798350390360
The proceedings contain 155 papers. The topics discussed include: determination of mechanical properties for copper in plated through holes by combination of tensile test and nanoindentation;manufacturing and characterization of thin-film tantalum pentoxide integrated capacitors;broadband antenna for high performance 5G mmWave modules;thermal diffusivity investigation of a heat pipe;additive fan-out panel-level processing of MOSFET devices;using polymer paste as dielectric material for PCB based module-to-module sintering;simulations of thermocouple measurements during reactive bonding processes on LTCC substrates;over 100-GHz bridge chip interconnection between photonic and electrical ICs with a heat-insulating stress-relief membrane structure;and advancing chiplet architecture through heterogeneous integration on laser-processed glass substrates.
The proceedings contain 111 papers. The topics discussed include: characterization of wetting behavior of commercial flux systems by impedance measurement technique;real-life functional tests of conductive joints of S...
ISBN:
(纸本)9781665489478
The proceedings contain 111 papers. The topics discussed include: characterization of wetting behavior of commercial flux systems by impedance measurement technique;real-life functional tests of conductive joints of SMD components on e-textiles;ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly;digital twin as a tool for evaluating and optimizing flow behavior in encapsulating processes;a novel dielectric slot stripline structure for millimeter wave flexible printed circuit;behavior of printed resistors compatible with thick film copper technology;thermal conductivity characterization of an in-house formulated thermal insulating xerogel - epoxy composite adhesive for electronics applications;and optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications.
The proceedings contain 122 papers. The topics discussed include: electroplating of Pd/Sn Multilayers for reactive bonding in packaging and assembly applications;real embedding process of SiC devices in a monolithic c...
ISBN:
(纸本)9781728162928
The proceedings contain 122 papers. The topics discussed include: electroplating of Pd/Sn Multilayers for reactive bonding in packaging and assembly applications;real embedding process of SiC devices in a monolithic ceramic package using LTCC technology;study on the effect of the warpage of electronic assemblies on their reliability;die-to-wafer 3D interconnections operating at sub-Kelvin temperatures for quantum computation;investigation of etching SiC vias for high power elctronics and harsh environment MEMS;manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes;tooling and procedures for hybrid integration of lasers by flip-chip technology;and evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB.
The proceedings contain 157 papers. The topics discussed include: three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP;a comparative reliability study of copper-plated glass vias, drilled wit...
ISBN:
(纸本)9781479940264
The proceedings contain 157 papers. The topics discussed include: three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP;a comparative reliability study of copper-plated glass vias, drilled with CO2 and Arf excimer lasers;TSV-annealing: a thermo-mechanical assessment;high speed through glass via manufacturing technology for interposer;multilayer dispensing of remote phosphor for led wafer level packaging with pre-formed silicone lens;development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs;laminate based led module with embedded MOSFET chips;development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices;novel glass welding technique for hermetic encapsulation;porous silicon electrodes for high performance integrated supercapacitors;glass isolated TSVs for MEMs;and thermal performance study of direct attached high-power LEDs using an innovative submount technique.
The proceedings contain 111 papers. The topics discussed include: noise characteristics of cold emission cathodes;phthalocyanine layers for humidity detection;polymer electronics towards systemintegration;characteriz...
ISBN:
(纸本)9781424478507
The proceedings contain 111 papers. The topics discussed include: noise characteristics of cold emission cathodes;phthalocyanine layers for humidity detection;polymer electronics towards systemintegration;characterization of the organic field-effect transistor based on solution processed P3HT;thermomechanical analysis of a bulk of electrically conductive adhesive;influence of neodymium dopant on TiO2 structure;metallographic preparation of the SnAgCu solders for optical microscopy and EBSD investigations;control unit for smart concrete used as resistive heating;humidity influence on antistatic properties of optical coatings;enhanced hole transport in multilayer organic based devices;stabilization of organic materials for sensors;the interface between different types of thick film layers;influence of metallographic preparation on electron backscatter diffraction characterization of copper wire bonds;and piezoelectric thick films on LTCC substrates.
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