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检索条件"任意字段=ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology"
442 条 记 录,以下是21-30 订阅
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A method of thermal analysis for CMOS integrated circuit
A method of thermal analysis for CMOS integrated circuit
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icsict-2006: 2006 8th international conference on solid-state and integrated circuit technology
作者: Sun, Jingying Feng, Shiwei Meng, Hao Zhang, Yuezong Liu, Jing Liu, Cheng School of Electronic Information and Control Engineering Beijing University of Technology Beijing 100022 China
the paper presents a method for thermal analysis of integrated circuit, which combines a spice tool (Hspice) with a finite element analysis tool (ANSYS). Since the connection between the two simulators is not so smoot... 详细信息
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Design Of A Low-Swing On-Chip Interconnect circuit
Design Of A Low-Swing On-Chip Interconnect Circuit
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2006 8th international conference on solid-state and integrated circuit technology
作者: Cong gao-jian Qi jia-yue Institute of Microelectronics Tsinghua University
Most of low-swing signaling circuits need a reference voltage,an extra timing control or special low-vt *** studied the SSDLC circuit,which need none of the three,working in a condition of 1.8V source voltage and 0.18... 详细信息
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Measurements and analysis of process variability in 90nm CMOS
Measurements and analysis of process variability in 90nm CMO...
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icsict-2006: 2006 8th international conference on solid-state and integrated circuit technology
作者: Nikolić, Borivoje Pang, Liang-Teck Electrical Engineering and Computer Sciences University of California Berkeley CA 94720-1770 United States
Process variability in deeply scaled CMOS has both random and systematic components, with a varying degree of spatial correlation. A test chip has been built to study the effects of circuit layout on variability of de... 详细信息
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A practical curvature-corrected technique for bipolar bandgap reference
A practical curvature-corrected technique for bipolar bandga...
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icsict-2006: 2006 8th international conference on solid-state and integrated circuit technology
作者: Bai, Xiao-He Lu, Tie-Jun Cai, Wei Beijing Microelectronics Technology Institute Beijing 100076 China
A practical piecewise-linear curvature-corrected bipolar bandgap reference that is suitable for switching power supplies is presented. the simulation results of the proposed reference have verified that the temperatur... 详细信息
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Choices for future interconnect materials and processing
Choices for future interconnect materials and processing
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icsict-2006: 2006 8th international conference on solid-state and integrated circuit technology
作者: Lu, Toh-Ming Eyck, Gregory Ten Center for Integrated Electronics Rensselaer Polytechnic Institute Troy NY 12180 United States
For the next couple of generations, physical vapor deposition (PVD) for interconnect metal barriers and seeds appears to be extendable. At the same time a variety of atomic layer deposition (ALD) techniques will becom... 详细信息
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A Scalable Design of RSA Crypto-coprocessor
A Scalable Design of RSA Crypto-coprocessor
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2006 8th international conference on solid-state and integrated circuit technology
作者: Yehua Gu Xiaoyang Zeng Jun Han Yongxin Ma Jia Zhao State Key Lab of ASIC & System Fudan University
A scalable design of RSA Crypto-coprocessor is presented in this paper,which supports variable keys up to 4096- *** analyzing and improving the modified multiple-word Montgomery multiplication algorithm,its pipeline a... 详细信息
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the Study of the Gas Microsensors Based on Polymer-Carbon Black Composites
The Study of the Gas Microsensors Based on Polymer-Carbon Bl...
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2006 8th international conference on solid-state and integrated circuit technology
作者: Haifen Xie Jiangsheng Wu Peng Huang XinmingJi Yiping Hunag Department of Physics East China University of Science and Technology ASIC and System State Key Lab Department of MicroelectronicsFudan University
In this paper,we study a novel chemical gas sensor arrays based on polymer-carbon black *** two different polymers which are poly(4-vinyl phenol), poly(ethylene oxide) are employed as the sensor materials which are im... 详细信息
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Design of a Low-Power 8x8-Bit Parallel Multiplier Using MOS Current Mode Logic circuit
Design of a Low-Power 8x8-Bit Parallel Multiplier Using MOS ...
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2006 8th international conference on solid-state and integrated circuit technology
作者: Youn Sang Lee Jeong Beom Kim Department of Electronics Engineering Kangwon National University
this paper proposes an 8 x 8 bit parallel multiplier using MOS current mode logic(MCML) for low power *** 8×8 bit multiplier is designed with the proposed MCML full adders and the conventional full *** proposed m... 详细信息
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A Testing Approach for Xilinx FPGA's CLB
A Testing Approach for Xilinx FPGA's CLB
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2006 8th international conference on solid-state and integrated circuit technology
作者: Tang Ming Zhang Guo-ping Zhang Huan-guo School of Computer Wuhan University 709th Research Institution
there have been some researches of testing CLBs in SRAM-based FPGA in recently *** no research in existing papers has focused on testing and locating multiple stuck-at faults in *** propose a testing approach for this... 详细信息
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TCAD for next generation technology and product development
TCAD for next generation technology and product development
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icsict-2006: 2006 8th international conference on solid-state and integrated circuit technology
作者: Kong, Jeong-Taek Lee, Won-Sok Lee, Keun-Ho Park, Young-Kwan CAE Team Semiconductor R and D Center Samsung Electronics Co. Ltd. San #16 Banwol Taean Hwasung-City Kyunggi-Do 445-701 Korea Republic of
As the lithography-driven scaling has been replaced by physically-based scaling, TCAD has become a principal tool for virtual characterization of technology development. this paper describes roles, benefits, capabilit... 详细信息
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