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检索条件"任意字段=IEEE/ACM International Conference on Computer Aide Digest"
885 条 记 录,以下是501-510 订阅
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Frequency domain analysis of switching noise on power supply network
Frequency domain analysis of switching noise on power supply...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Zhao, Shiyou Roy, Kaushik Koh, Cheng-Kok Purdue Univ West Lafayette United States
In this paper, we propose an approach for the analysis of power supply noise in the frequency domain for power/ground (P/G) networks of tree topologies. We model the P/G network as a linear time invariant (LTI) pseudo... 详细信息
来源: 评论
Power exploration for embedded VLIW architectures
Power exploration for embedded VLIW architectures
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Sami, Mariagiovanna Sciuto, Donatella Silvano, Cristina Zaccaria, Vittorio Politecnico di Milano Milano Italy
In this paper, we propose a system-level power exploration methodology for embedded VLIW architectures based on an instruction-level analysis. The instruction-level energy model targets a general pipeline scalar proce... 详细信息
来源: 评论
ACTIF: a high-level power estimation tool for analog continuous-time filters
ACTIF: a high-level power estimation tool for analog continu...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Lauwers, Erik Gielen, Georges Katholieke Universiteit Leuven
A tool is presented that gives a high-level estimation of the power consumed by an analog continuous-time OTA-C filter when given only high-level input parameters such as dynamic range and signal swing. When used in c... 详细信息
来源: 评论
Miller factor for gate-level coupling delay calculation
Miller factor for gate-level coupling delay calculation
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Chen, Pinhong Kirkpatrick, Desmond A. Keutzer, Kurt U.C. Berkeley Berkeley United States
In coupling delay computation, a Miller factor of more than 2X may be necessary to account for active coupling capacitance when modeling the delay of deep submicron circuitry in the presence of active coupling capacit... 详细信息
来源: 评论
Don't cares and multi-valued logic network minimization
Don't cares and multi-valued logic network minimization
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Jiang, Yunjian Brayton, Robert K. Univ of California Berkeley United States
We address optimizing multi-valued (MV) logic functions in a multi-level combinational logic network. Each node in the network, called an MV-node, has multi-valued inputs and single multi-valued output. The notion of ... 详细信息
来源: 评论
Multilevel optimization for large-scale circuit placement
Multilevel optimization for large-scale circuit placement
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Chang, Tony F. Cong, Jason Kong, Tianming Shinnerl, Joseph R. UCLA Los Angeles United States
We have designed and implemented a new class of fast and highly scalable placement algorithms that directly handle complex constraints and achieve total wirelengths comparable to the state of the art. Our approach exp... 详细信息
来源: 评论
Bus energy minimization by Transition Pattern Coding (TPC) in deep sub-micron technologies
Bus energy minimization by Transition Pattern Coding (TPC) i...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Sotiriadis, Paul P. Chandrakasan, Anantha Massachusetts Inst of Technology Cambridge United States
The energy dissipation associated with driving long wires accounts for a significant fraction of the overall system energy. This is particularly the case with the increasing importance of the inter-wire parasitic capa... 详细信息
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On mismatches between incremental optimizers and instance perturbations in physical design tools
On mismatches between incremental optimizers and instance pe...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Kahng, Andrew B. Mantik, Stefanus UCLA Los Angeles United States
The incremental, 'construct by correction' design methodology has become widespread in constraint-dominated DSM design. We study the problem of ECO for physical design domains in the general context of increme... 详细信息
来源: 评论
Challenges and opportunities in broadband and wireless communication designs
Challenges and opportunities in broadband and wireless commu...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Rabaey, Jan M. Potkonjak, Miodrag Koushanfar, Farinaz Li, Suet-Fei Tuan, Tim Univ of California Berkeley United States
Communication designs form the fastest growing segment of the semiconductor market. Both network processors and wireless chipsets have been attracting a great deal of research attention, financial resources and design... 详细信息
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Bus optimization for low-power data path synthesis based on network flow method
Bus optimization for low-power data path synthesis based on ...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Hong, Sungpack Kim, Taewhan KAIST Taejon Korea Republic of
Sub-micron feature sizes have resulted in a considerable portion of power to be dissipated on the buses, causing an increased attention on savings for power at the behavioral level and RT level of design. This paper a... 详细信息
来源: 评论