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检索条件"任意字段=IEEE/ACM International Conference on Computer Aide Digest"
889 条 记 录,以下是511-520 订阅
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Bus energy minimization by Transition Pattern Coding (TPC) in deep sub-micron technologies
Bus energy minimization by Transition Pattern Coding (TPC) i...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Sotiriadis, Paul P. Chandrakasan, Anantha Massachusetts Inst of Technology Cambridge United States
The energy dissipation associated with driving long wires accounts for a significant fraction of the overall system energy. This is particularly the case with the increasing importance of the inter-wire parasitic capa... 详细信息
来源: 评论
On mismatches between incremental optimizers and instance perturbations in physical design tools
On mismatches between incremental optimizers and instance pe...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Kahng, Andrew B. Mantik, Stefanus UCLA Los Angeles United States
The incremental, 'construct by correction' design methodology has become widespread in constraint-dominated DSM design. We study the problem of ECO for physical design domains in the general context of increme... 详细信息
来源: 评论
Challenges and opportunities in broadband and wireless communication designs
Challenges and opportunities in broadband and wireless commu...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Rabaey, Jan M. Potkonjak, Miodrag Koushanfar, Farinaz Li, Suet-Fei Tuan, Tim Univ of California Berkeley United States
Communication designs form the fastest growing segment of the semiconductor market. Both network processors and wireless chipsets have been attracting a great deal of research attention, financial resources and design... 详细信息
来源: 评论
Bus optimization for low-power data path synthesis based on network flow method
Bus optimization for low-power data path synthesis based on ...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Hong, Sungpack Kim, Taewhan KAIST Taejon Korea Republic of
Sub-micron feature sizes have resulted in a considerable portion of power to be dissipated on the buses, causing an increased attention on savings for power at the behavioral level and RT level of design. This paper a... 详细信息
来源: 评论
Exploring performance tradeoffs for clustered VLIW ASIPs
Exploring performance tradeoffs for clustered VLIW ASIPs
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Jacome, Margarida F. de Veciana, Gustavo Lapinskii, Viktor Univ of Texas Austin United States
VLIW ASIPs provide an attractive solution for increasingly pervasive real-time multimedia and signal processing embedded applications. In this paper we propose an algorithm to support trade-off exploration during the ... 详细信息
来源: 评论
Path selection and pattern generation for dynamic timing analysis considering power supply noise effects
Path selection and pattern generation for dynamic timing ana...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Liou, Jing-Jia Krstic, Angela Jiang, Yi-Min Cheng, Kwang-Ting Univ of California Santa Barbara United States
Noise effects such as power supply and crosstalk can significantly affect the performance of deep submicron designs. These delay effects are highly input pattern dependent. Existing path selection and timing analysis ... 详细信息
来源: 评论
Effects of global interconnect optimizations on performance estimation of deep submicron design
Effects of global interconnect optimizations on performance ...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Cao, Yu Hu, Chenming Huang, Xuejue Kahng, Andrew B. Muddu, Sudhakar Stroobandt, Dirk Sylvester, Dennis UC Berkeley Berkeley United States
In this paper, we quantify the impact of global interconnect optimization techniques that address such design objectives as delay, peak noise, delay uncertainty due to noise, power, and cost. In doing so, we develop a... 详细信息
来源: 评论
Latency-guided on-chip bus network design
Latency-guided on-chip bus network design
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Drinic, Milenko Kirovski, Darko Meguerdichian, Seapahn Potkonjak, Miodrag Univ of California Los Angeles United States
Deep submicron technology scaling has two major ramifications on the design process. First, reduced feature size significantly increases wire delay, thus resulting in critical paths being dominated by global interconn... 详细信息
来源: 评论
Physical planning with retiming
Physical planning with retiming
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Cong, Jason Lim, Sung Kyu UCLA Los Angeles United States
In this paper, we propose a unified approach to partitioning, floorplanning, and retiming for effective and efficient performance optimization. The integration enables the partitioner to exploit more realistic geometr... 详细信息
来源: 评论
Generalized FDTD-ADI: an unconditionally stable full-wave Maxwell's equations solver for VLSI interconnect modeling
Generalized FDTD-ADI: an unconditionally stable full-wave Ma...
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ieee/acm international conference on computer aided Design (ICCAD)
作者: Chen, Charlie C.-P. Lee, Tae-Woo Murugesan, Narayanan Hagness, Susan C. Univ of Wisconsin-Madison Madison United States
The finite-difference time-domain (FDTD) method of solving the full-wave Maxwell's equations has been recently extended to provide accurate and numerically stable operation for time steps exceeding the Courant lim... 详细信息
来源: 评论