In modern computer devices, system-on-Chip (SoC) technology is used to design hardware components. The most sensitive assets of a SoC design are the encryption key, configuration settings, and data stored on the devic...
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ISBN:
(纸本)9798350384406
In modern computer devices, system-on-Chip (SoC) technology is used to design hardware components. The most sensitive assets of a SoC design are the encryption key, configuration settings, and data stored on the device. As the semiconductor industry has become more globalized, there is an increased risk of unauthorized access to SoC assets in light of the outsourcing of the design process and the integration of third-party intellectual property (3PIP). There are significant security concerns when using 3PIP from different vendors since any threats may be inserted into the SoC design by an attacker. The designer must add IP countermeasures to the SoC to protect it from design flow vulnerabilities. To ensure the security and trustworthiness of IPs and SoC designs, they must be validated as security assets. Security issues in modern designs have become more challenging due to their complexity, and existing tools cannot resolve them. Security concerns may not be considered when designing tools optimized for area, power, and performance. To address security issues in the SoC design process, computer-aideddesign (CAD) tools and techniques are being developed to assess potential threats and detect security vulnerabilities. By addressing each vulnerability in the SoC design flow, these CAD tools automate security assessments as well as validate preferred metrics. In this paper, we explore the state-of-the-art of CAD tools usage in hardware security verification and validation. Here, we present the systematic utilization of CAD tools in the SoC design lifecycle, including their strengths and weaknesses. Finally, the paper concludes with an assessment of where we are with current research and directions for future research.
Aiming at the demand of intelligent decision-making assistant in task planning, enterprise management, business service, education and other fields, the application of Large Language Model (LLM) in the Decision-Making...
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This paper develops a video surveillance identification system for campus security needs. In this system, a video analysis and processing platform based on Spark is designed. Based on the new scheme technology and Ope...
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Currently, power systems are undergoing a digitalization shift to manage an increasingly heterogeneous and volatile network, incurred by the energy transition, which directly impacts control centres. However, trust in...
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In response to the increasingly complex mechanical and electrical automation control needs in modern industry, this paper studies a mechanical and electrical automation controlsystemdesign scheme based on PLC (Progr...
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As an early step in physical design, floorplanning plays a pivotal role in determining the performance upper bounds for downstream tasks and greatly impacts the PPA (power, performance, area) of the system. Efforts in...
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With the widespread integration of renewable energy sources (REs), the number of power system scenarios to be analyzed has increased significantly, and the system structure has become increasingly complex, which incre...
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Due to the cost and design complexity associated with advanced technology nodes, it is difficult for traditional monolithic system-on-Chip to follow the Moore's Law, which means the economic benefits have been wea...
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ISBN:
(纸本)9781450392174
Due to the cost and design complexity associated with advanced technology nodes, it is difficult for traditional monolithic system-on-Chip to follow the Moore's Law, which means the economic benefits have been weakened. Semiconductor industries are looking for advanced packages to improve the economic advantages. Since the multi-chiplet architecture supporting heterogeneous integration has the robust re-usability and effective cost reduction, chiplet integration has become the mainstream of advanced packages. Nowadays, the number of mounted chiplets in a package is continuously increasing with the requirement of high system performance. However, the large area caused by the increasing of chiplets leads to the serious reliability issues, including warpage and bump stress, which worsens the yield and cost. The multi-package architecture, which can distribute chiplets to multiple packages and use less area of each package, is a popular alternative to enhance the reliability and reduce the cost in advanced packages. However, the primary challenge of the multi-package architecture lies in the tradeoff between the inter-package costs, i.e., the interconnection among packages, and the intra-package costs, i.e., the reliability caused by warpage and bump stress. Therefore, a co-design methodology is indispensable to optimize multiple packages simultaneously to improve the quality of the whole system. To tackle this challenge, we adopt mathematical programming methods in the multi-package co-design problem regarding the nature of the synergistic optimization of multiple packages. To the best of our knowledge, this is the first work to solve the multi-package co-design problem.
This project intends to extract two representative characteristics derived from parallel excitation and multiple excitation pathways based on existing nuclear power generation systems. The main excitation circuit mode...
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Cyber-Physical systems (CPS) are one of the emerging technologies of the time. Current CPS are categorized as small, medium, and large-scale CPS. Small and medium-scale CPS's design, development, and operation sta...
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ISBN:
(纸本)9798350363029;9798350363012
Cyber-Physical systems (CPS) are one of the emerging technologies of the time. Current CPS are categorized as small, medium, and large-scale CPS. Small and medium-scale CPS's design, development, and operation standards are well-defined. However, the large-scale, also known as industrial-scale CPS, are complex, and their design, development, and operation remain challenging. This is due to the involvement of multiple complex technical and non-technical domains. This research discusses the complexity of future industrial-scale CPS in terms of cyber systems, physical systems, Collaborative Information Processing systems (CIPS), and computer-aided engineering (CAE) systems. We present a detailed overview of the complexities in cyber & physical systems, human and managerial systems, and CAEs and suggest possible solutions. We discuss these complexities via a case study on a CPS-based energy management system. The implications of our discussions include an improved pathway to reduce the complexity of future CPS.
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