检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

530 篇 会议
10 篇 期刊文献

馆藏范围

540 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

397 篇 工学
- 261 篇 电气工程
- 152 篇 电子科学与技术（可...
- 120 篇 计算机科学与技术...
- 59 篇 材料科学与工程（可...
- 53 篇 信息与通信工程
- 52 篇 软件工程
- 35 篇 机械工程
- 27 篇 仪器科学与技术
- 27 篇 化学工程与技术
- 26 篇 动力工程及工程热...
- 21 篇 控制科学与工程
- 17 篇 冶金工程
- 16 篇 石油与天然气工程
- 13 篇 光学工程
- 10 篇 航空宇航科学与技...
- 7 篇 建筑学
- 6 篇 土木工程
- 5 篇 力学（可授工学、理...
- 4 篇 轻工技术与工程
- 4 篇 核科学与技术
104 篇 理学
- 72 篇 物理学
- 25 篇 化学
- 19 篇 数学
- 4 篇 生物学
24 篇 管理学
- 23 篇 管理科学与工程(可...
- 7 篇 工商管理
8 篇 医学
- 5 篇 临床医学
- 5 篇 特种医学
5 篇 经济学
- 5 篇 应用经济学
3 篇 军事学

主题

61 篇 multichip module...
25 篇 silicon
25 篇 multi-chip modul...
24 篇 packaging
23 篇 microprocessor c...
22 篇 switches
20 篇 substrates
19 篇 electronics pack...
18 篇 silicon carbide
16 篇 assembly
13 篇 costs
13 篇 integrated circu...
12 篇 radio frequency
11 篇 multichip module
11 篇 logic gates
11 篇 inductance
10 篇 bonding
10 篇 finite element a...
10 篇 ceramics
9 篇 reliability

机构

4 篇 univ alabama dep...
4 篇 hypres inc elmsf...
3 篇 stanford univ st...
2 篇 shanghai aerospa...
2 篇 marvell burnaby
2 篇 marvell
2 篇 jst tsukuba ibar...
2 篇 sun microsystems...
2 篇 caltech jet prop...
2 篇 georgia inst tec...
2 篇 tyndall natl ins...
2 篇 guilin univ elec...
2 篇 univ alabama dep...
2 篇 micromodule syst...
2 篇 center for integ...
2 篇 fraunhofer izm
2 篇 micromodule syst...
2 篇 shenzhen smartch...
2 篇 academy of infor...
2 篇 keio university ...

作者

4 篇 yorozu shinichi
4 篇 miyazaki toshiyu...
4 篇 lemmon andrew n.
3 篇 paolo mattavelli
3 篇 luo le
3 篇 dai wayne wei-mi...
3 篇 lu hua
3 篇 boroyevich dusha...
3 篇 wang li
3 篇 brian hughes
3 篇 ning puqi
3 篇 castellazzi albe...
3 篇 pence w.e.
3 篇 bailey chris
3 篇 dushan boroyevic...
3 篇 lemmon andrew
3 篇 hughes brian
3 篇 mattavelli paolo
2 篇 zhang tao
2 篇 kameda yoshio

语言

529 篇 英文
7 篇 中文
4 篇 其他

检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是141-150 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Characterization of Liquid Cooled Cold Plates for a multi chip module (MCM) and their Impact on Data Center Chiller Operation

Characterization of Liquid Cooled Cold Plates for a Multi Ch...

引用

ieee International conference on Industrial Informatics (INDIN)

作者： Bharath Ramakrishnan Mohammad Tradat Yaser Hadad Kanad Ghose Bahgat Sammakia Department of Mechanical Engineering Binghamton University Binghamton USA Department of Computer Science Binghamton University Binghamton USA

Miniaturization of microelectronic components comes at a price of high heat flux density. By adopting liquid cooling, the rising demand of high heat flux devices can be met while the reliability of the microelectronic devices can also be improved to a greater extent. Liquid cooled cold plates are largely replacing air based heat sinks for electronics in data center applications, thanks to its large heat carrying capacity. A bench level study was carried out to characterize the thermohydraulic performance of microchannel cold plates which uses warm De-Ionized (DI) water for cooling multi chip modules (MCM). A laboratory built mock package housing mock chips and a heat spreader was employed while assessing the thermal performance of three different cold plate designs at varying coolant flow rate and temperature. The case temperature measured at the heat spreader for varying flow rates and input power were essential in identifying the convective resistance corresponding to the cold plates. The flow performance was evaluated by the measuring the pressure drop across cold plate module at varying flow rates. Cold plate with the enhanced microchannel design yielded better results compared to a traditional parallel microchannel design. The experimental results were validated using a numerical model which is further optimized for improved geometric designs. Finally, an estimation of chiller operating cost was obtained for a 100% air cooled facility and compared their performance to that of a 60% warm water cooled facility.

关键词：

来源：评论

学校读者我要写书评

暂无评论

multi-chip module Based GaAs MMICs Packaging for L-Band High Gain Application

Multi-chip Module Based GaAs MMICs Packaging for L-Band High...

引用

ieee MTT-S International Microwave and RF conference

作者： Ravi Gugulothu Sangam V. Bhalke Anant A. Naik K. Lalkishore Ramakrishna Dasari Gallium Arsenide Enabling Technology Center Hyderabad Telangana India University College of Engineering (Autonomous) Osmania University Hyderabad Telangana India

ISBN: (数字)9781728140407

ISBN: (纸本)9781728140414

This paper details a multi-chip module (MCM) suitable for GaAs monolithic microwave integrated circuit common control high gain block MCM package design, 3D EM simulation of the package, package fabrication and end module level execution, which includes assembly and testing under various environmental test conditions as per the space standards. This MCM package designed using three internally separated cavities for individual cavity isolation, 4-RF Ports, 10mil thin film microstrip line and optimized wire bonding interconnects, and the same package is EM simulated using a CST microwave studio. This package modelled and fabricated using kovar material. This MCM package proposed to house a chain of four amplifiers with a common gain of 69dB, 2 SPDT switches with insertion loss of 3.6dB, a digital attenuator with initial attenuation of 2.5dB with TTL driver and 2 thermopads of 3dB individual attenuation. This package resonating frequency is 7.484GHz. The packaged MCM measurements are carried out over a frequency of 1.1GHz-1.4GHz and resulted with S 21 of 60dB, S 11 &S 22 of better than 15dB and P1dB out of 15dBm.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Application of AOI light source modes in multi-chip modules inspection 19

Application of AOI light source modes in multi-chip modules ...

引用

19th International conference on Electronic Packaging Technology (ICEPT)

作者： Wu, Yilong Wen, Junling Zhang, Pingsheng China Elect Technol Grp Corp Res Inst 29 Microwave Circuit Integrat Ctr Chengdu Sichuan Peoples R China

ISBN: (纸本)9781538663868

Automated optical inspection (AOI) is a way of checking the assembly quality of printed circuit boards using machine vision techniques and becomes an indispensable part of the PCBA assembly process in recent years. Due to its consistent and repeatable nature, AOI is an effective process control tool. However, when AOI was applied on substrate, die or bond wire inspection in multi-chip modules, pseudo-defect or false call occurred commonly. In this paper, the influences of light source modes on probability of detection were studied and several using advices were proposed. The results showed that when using proper light source, best contrast of the detected image could be got and thus the missing defect rate of MCM could be reduced.

关键词： automated optical inspection light source mode multi-chip module

来源：评论

学校读者我要写书评

暂无评论

A Novel Integration of Stereolithography and Inkjet Printing for multichip modules with High Frequency Packaging Applications 68

A Novel Integration of Stereolithography and Inkjet Printing...

引用

68th ieee Electronic Components and Technology conference (ECTC)

作者： Bahr, Ryan Tehrani, Bijan Tentzeris, Manos M. Byers, Kyle Georgia Inst Technol Elect & Comp Engn Atlanta GA 30332 USA Honeywell FM&T DOEs Kansas City Natl Secur Campus Kansas City MO USA

ISBN: (纸本)9781538649985

Within this paper methods of additive manufacturing for 3D circuitry is discussed. With increasing interest in the additive manufacturing of 3D circuits, varying topologies must be explored and tested to create frameworks for how to fabricate topologies with the wide design space that is introduced with additive manufacturing and 3D printing. After discussing current methods of additive manufacturing of electronics and the current limitations of different methodologies, several topologies are discussed for the inclusion of surface mount technology components with 3D printing using inkjet printing and stereolithography, including the use of inkjet printed adhesives for placement of components. Finally, a planar inverted-F antenna is integrated into the substrate, to create a complete system for a ZigBee multi-chip module utilizing additive manufacturing techniques.

关键词： 3D printing additive manufacturing stereolithography inkjet printing multichip module (MCM) planar inverted-F antenna (PIFA) surface mount technology Zigbee SU-8

来源：评论

学校读者我要写书评

暂无评论

A 120Gbps VCSEL-Based Parallel Optical module Design 7

A 120Gbps VCSEL-Based Parallel Optical Module Design

引用

7th ieee Asia-Pacific conference on Antennas and Propagation, APCAP 2018

作者： Miao, Peng Tian, Ling Weizhu, Xiao Li, Fei Li, Wei School of Information Science and Engineering Southeast University Nanjing Jiangsu China

ISBN: (纸本)9781538656488

This paper gives the details of an optical module for 12-channel VCSEL (Vertical-Cavity Surface-Emitting Laser) based design for VSR (Very Short Reach) application. The 12channel VCSEL driver chip is designed and implemented in a standard 0.18-μm CMOS process. The output stage utilizes C3A (Capacitively Coupled Current Amplifier) structure to speed up the fall time of the laser output waveform. The test results show that the eye diagram of any channel operates at 10 Gbps. Finally, the optical module is packaged with MPO multi-mode connector. © 2018 ieee.

关键词： Surface emitting lasers

来源：评论

学校读者我要写书评

暂无评论

Bi-Transfer: A Data Packet Allocation module with Chaining Transmission Mode

Bi-Transfer: A Data Packet Allocation Module with Chaining T...

引用

International conference on Computer and Communications (ICCC)

作者： Zerun Li Sen Yang Yu Wang Lirui Chen Yang Guo Zuocheng Xing College of Computer NUDT Changsha China

ISBN: (数字)9781728147437

ISBN: (纸本)9781728147444

With the increasing performance requirements of network data interaction on chip, the traditional Direct Memory Access (DMA) often performs with low efficiency of multi-module collaboration due to the competition of bus control, thereby reducing the throughput rate of the bus. Aiming at the working characteristics of inter-core communication and data interaction between multiple modules, this paper designs a packet transmission module Bi-Transfer that supports bidirectional data flow between multiple modules It also realizes chaining transmission of input and output data in parallel with various configuration modes and flexible data scheduling modes. This module can complete the functions of data movement, inter-core communication, task management, etc., and use descriptors to link load data packets to uniformly conFigure the data interaction mode of the on-chip network. In the experimental stage, function planning and code design are carried out first, then the timing simulation and data recording are described. Finally, the performance characteristics of this new data interaction module are discussed. According to statistical observations, increasing the number of channels in the design module can significantly increase the bandwidth of the bus. Under the given clock frequency, bus width and data transmission requirements, the bus operating bandwidth in the four-channel working mode can reach up to 4690 MB/s at most, which is nearly 400 MB/s beyond the ordinary DMA bus bandwidth. In the case of fewer channels, this module can fulfill the data scheduling requirements of most applications and provide the data moving function of ordinary DMA.

关键词： Scheduling algorithms Task analysis Bandwidth Data transfer multicore processing Delays Scheduling

来源：评论

学校读者我要写书评

暂无评论

A Numerical Procedure for the Optimization of IGBT module Packaging 19

A Numerical Procedure for the Optimization of IGBT Module Pa...

引用

19th International conference on Electronic Packaging Technology (ICEPT)

作者： Lu, Hua Rajaguru, Pushparajah Bailey, Chris Univ Greenwich Dept Math Sci London England

ISBN: (纸本)9781538663868

A numerical solution procedure for optimizing the thermal-mechanical reliability of an IGBT module has been described in this paper. The procedure is robust and it can handle both discrete and continuous decision variables in the design of IGBT packaging. An example has been given to demonstrate its application. The objective functions in this example are the accumulated plastic work density in solder joints of a simplified IGBT module that is subject to cyclic temperature cycling and the maximum junction temperature when the model is subject to a constant thermal loading. The thickness of the chip mount-down solder, thickness of the substrate solder joint, and the location of the chip are used as continuous decision variables. The material selection for the baseplate is treated as a discrete variable. The objective function values are calculated using Finite Element Analysis method.

关键词： IGBT multi-objective Optimization Finite Element

来源：评论

学校读者我要写书评

暂无评论

Research and Development of Customized Wireless Device Based on the multimode chip for Energy Internet Applications 18

Research and Development of Customized Wireless Device Based...

引用

18th ieee International conference on Communication Technology (ieee ICCT)

作者： Zhu, Daohua Xu, Haiqing Guo, Yajuan Wei, Lei Cui, Hengzhi Miao, Weiwei Chen, Xiangdong Jiang, Chengling State Grid Jiangsu Elect Power Co LTD Wireless Commun Technol Lab Elect Power Res Inst Nanjing Jiangsu Peoples R China State Grid Jiangsu Elect Power Co LTD Dept Commun Nanjing Jiangsu Peoples R China

ISBN: (纸本)9781538676356

The customized wireless devices play a key role in information exchanging for various electrical facilities. However, the development of the devices is hindered by diversity of interfaces (RS-232/ 485, Ethernet, USB, etc.), high cost, outdoor environment, etc. In this work, we proposed a 'system on module' solution to address above issues. We optimize and spare the storage space of baseband chip for embedded control system to replace the independent chips, which dramatically reduces the size, cost and power consumption of devices. Meanwhile, our SOM wireless devices can support multi-interfaces and thus realize 'plug and play'. Moreover, our developed wireless devices allow multimode wireless communications including operator's wireless networks LTE FDD/ TDD, UMTS, GSM and self-built LTE-G 1800MHz network. Last but not least, we can embedded positioning chip and the client of management system in the wireless devices for the sake of operation and maintenance.

关键词： system on module LTE-G 1800MHz customized wireless devices multimode wireless communications

来源：评论

学校读者我要写书评

暂无评论

Fully Inkjet-Printed Ramp Interconnects for Wireless Ka-Band MMIC Devices and multi-chip module Packaging 48

Fully Inkjet-Printed Ramp Interconnects for Wireless Ka-Band...

引用

48th European Microwave conference (EuMC)

作者： Tehrani, Bijan K. Tentzeris, Manos M. Georgia Inst Technol Sch Elect & Comp Engn Atlanta GA 30332 USA

ISBN: (纸本)9782874870514

This work outlines for the first time the development and demonstration of fully inkjet-printed mm-wave 3D ramp interconnects for Ka-band active wireless devices and MCM packaging solutions. Details of the inkjet printing processes are outlined to realize printed RF and DC interconnects for active MMIC dies. Printed ramp interconnects are demonstrated first with an attenuator die to evaluate the multi-material fabrication process, yielding an interconnect insertion loss of approximately 0.45 dB/mm at 24.5 GHz. The process is then applied to a Ka-band LNA MMIC where ramp interconnects for the RF and DC are inkjet-printed, yielding a maximum aggregate gain of 24.2 dB and interconnect insertion loss of approximately 0.57 dB/mm. The fabrication processes and evaluative demonstrations presented in this work highlight the effectiveness of utilizing fully-additive inkjet printing technology for the realization of highly application-specific wireless MCM systems in a low-cost and efficient fashion up to the mm-wave frequency range.

关键词： millimeter-wave packaging MMIC inkjet printing interconnects Ka-band

来源：评论

学校读者我要写书评

暂无评论

Linear Front End module for 4G/5G LTE Advanced Applications 48

Linear Front End Module for 4G/5G LTE Advanced Applications

引用

48th European Microwave conference (EuMC)

作者： Balteanu, Florinel Skyworks Solut Inc Irvine CA 92617 USA

ISBN: (纸本)9782874870514

With explosive band proliferation as well the use of carrier aggregation (CA), multiple input multiple output (MIMO) techniques and 5G, research in the area of improving the cost, performance and the size of RF transmit solutions is very active with many developments over the past few years. The proliferation of worldwide smartphones has been in part possible due to increase computational power of CMOS technology in lower feature nodes as 7nm/14nm. This has also made it possible to enhance RF CMOS through digital signal processing (DSP) and digital calibration. Despite this progress there is a shift in terms of what parts of the RF system are portioned in advanced CMOS nodes and what blocks are left and integrated together with other analogue and RF blocks in a front-end module (FEM). This paper proposes a solution for this partitioning for lower cost and size and with high linearity performance and low noise which is mandatory for new 4G/5G multimode multiband (MMBA) FEM module. A 2.3GHz - 2.7GHz broadband CMOS FDD/TDD LTE Band 7, 38, 40 and 41 power amplifier (PA) fully integrated with a fast envelope tracker (ET) on a single 0.18 mu m CMOS die is presented, as well a method to integrate with a 4G/5G FEM. The CMOS PA and the tracker achieve a 37% overall efficiency for 26.5dBm and -39dBc ACLR1. This paper also presents how this module integrates into a full 4G/5G FEM for mobile applications.

关键词： CMOS GaAs field effect transistor (FET) silicon on insulator (SOI) through wafer via (TSV) long term evolution (LTE) LTE advanced power amplifier envelope tracking (ET) multimode multiband front end module RF front end (RFFE) frequency duplex division (FDD) time division duplex (TDD) digital signal processing (DSP) MIMO transmit (Tx) carrier aggregation (CA) high power user equipment (HPUE) multi-chip-module (MCM) 4G 5G

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共54页 << < 11 12 13 14 15 16 17 18 19 20 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：