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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是181-190 订阅

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Passive alignment of an optical fiber on a multi-layer ceramic module for radio-over-fiber applications

Passive alignment of an optical fiber on a multi-layer ceram...

引用

German Microwave conference (GeMiC)

作者： Mathew, Sumy Welker, Tilo Gutzeit, Nam Spira, Steffen Mueller, Jens Stephan, Ralf Hein, Matthias A. Tech Univ Ilmenau Inst Micro & Nanotechnol D-98694 Ilmenau Germany

ISBN: (纸本)9783981266870

The low-temperature co-fired ceramics technology is a successful and space-qualified technology enabling three-dimensional microwave design. Now we are pursuing an important step further towards multi-functional multi-purpose hybrid assembly technologies: combining ceramic technology with optical fiber technology. In such systems, fiber alignment is a crucial issue. Extra gadgets used for the fiber alignment make the system more complex and bulky. Considering the many features offered by the ceramic multi-layer technology for size reduction, it is advantageous to use this technology for the passive alignment of an optical fiber above the optical source. In this paper, the passive fiber alignment employing flip-chip mounting of a vertical cavity surface emitting laser in a ceramic substrate is presented. We have studied the performance of the resulting optical link with respect to figures typical for radio-over-fiber applications, namely the link gain, noise figure, and the spurious-free dynamic range and compared the results with a link where the VCSEL was wire bonded to the circuit.

关键词： LTCC analog optical link vertical cavity surface emitting laser (VCSEL) passive fiber alignment radio-over-fiber

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Broadband multifunction AESA Front-Ends: New Requirements and Emerging Technologies 13

Broadband Multifunction AESA Front-Ends: New Requirements an...

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13th European Radar conference (EuRAD)

作者： Gautier, W. Gruener, W. Rieger, R. Chartier, S. Airbus DS Elect & Border Secur Ulm Germany

ISBN: (纸本)9782874870453

multifunction RF systems which can operate with different RF functions like radar, communication and electronic warfare offer a variety of benefits beyond the well-known AESA (Active Electronically Steerable Antenna) features. To reach a sufficient technology maturity to start product development a series of challenges most stemming from the large required operation bandwidth have to be resolved. Dual-polarised low-loss apertures with array grids designed for a grating lobe and scan blindness free 60 conical Field of View (FoV) at the highest operational frequency have to be considered. The active components of the AESA and especially the T/R-M are required to be power efficient over the whole multifunction bandwidth and they shall be miniaturised to fit the array grid. RF functions like high speed datalink require linear high power amplification with low harmonics generation and interference suppression in receive is essential in order to maintain performance. Enablers for such broadband AESA are the GaN technology for T/R-M front-end components and SiGe BiCMOS technology for core chip and digital control of the T/R-M. The paper shows the state-of-the-art technology in Europe for multifunction RF Systems.

关键词： Broadband AESA GaN technology multi-functional RF system broadband polarisation agile aperture miniaturised transmit receive module vector modulator RF MEMS

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multi-Level Ultra Low-Power Mode Support Mechanisms For Wearable Device

Multi-Level Ultra Low-Power Mode Support Mechanisms For Wear...

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9th ieee Int Conf on Internet of Things / 12th ieee Int Conf on Green Comp and Communicat / 9th ieee Int Conf on Cyber, Phys, and Social Comp / ieee Int Conf on Smart Data

作者： Park, Hyoung Jun Woo, Duk-Kyun Kim, Seon-Tae Mah, Pyeong-Soo Univ Sci & Technol Dept Comp Software & Engn 217 Gajeong Ro Daejeon South Korea Elect & Telecommun Res Inst Realtime SW Res Team 138 Gajeong Ro Daejeon South Korea

ISBN: (纸本)9781509058808

For the convenience of users, thousands of wearable devices with new built-in applications are appearing every year in the field of healthcare, sports, and safety. However, the system of them should be operated by using limited capacity of power because of very small size of battery that can be loaded into a wearable device due to the device properties. For such a reason, chip Vendors are recently launching ICUs with ultra-low power capability on the market and also MCU that supports 7-step low power mode was appeared at present[1-3]. But now, it is very rare case to completely use Low Power Mode offered by MCU vendor on the operating system (OS) that is applied to wearable devices, and there is no case to support low power mode by the OS at the board level. Therefore, this paper suggests optimal supporting mechanism for ultra-low power multi-step mode at the OS level of wearable device. The mechanism proposed in this paper is largely divided into two parts. First, it is Low Power Mode Governor (LPMG) which is a module used to select an optimal low power mode after computation of retention time in idle mode. Second, we proposed Power-Off Mode, which disconnects power to the board when idle mode lasts for a long time. When integrating these two technologies and applying them to the Tickless nanoQplus[4], the OS for wearable devices developed at our lab, in the same Wearable Application Scenario 2 test, power consumption after passing a certain duration of time is reduced by 98.05% compared to idle mode, and 96.33% compared to sleep mode. These newly proposed two technologies will be able to offer an effective solution required to achieve low power consumption in wearable devices.

关键词： DPM MCU Low Power Mode Wearable RTOS

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High Density Micro-lens Array Connector for Optical multi-chip module

High Density Micro-lens Array Connector for Optical Multi-ch...

引用

ieee Electronic Components and Technology conference

作者： Koji Masuda Hsiang-Han Hsu Masao Tokunari Shigeru Nakagawa Optical Interconnect Technology IBM Research Kawasaki Tokyo Japan

For efficient light coupling from and into an optical multi-chip module (MCM), the micro-lens array connector (MLAC) is developed. MLAC, composed of a waveguide side lens array and a fiber side connector, integrates 24 collimation micro-lense pairs in its small volume, realizing high bandwidth density, low coupling loss, large alignment tolerance and simple assembling process. In this paper, the mechanical design and optical characteristics of MLAC are introduced. The design criteria and challenges in the assembling processes are also described.

关键词： Micro-lens array Optical multi-chip module Optical interconnection Optoelectronics packaging

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Warpage Tuning Study for multi-chip Last Fan Out Wafer Level Package

Warpage Tuning Study for Multi-chip Last Fan Out Wafer Level...

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ieee Electronic Components and Technology conference

作者： Hung-Yuan Li Allen Chen Sam Peng George Pan Stephen Chen Siliconware Precision Industries Co. Ltd. Daya Taichung Taiwan R.O.C. Siliconware Precision Ind. Co. Ltd. Taichung Taiwan

In recent years, the IoT popularity pushes the package development of 3C products into a more functional and thinner target. For high I/O density and low cost considered package, the promising Fan-out Wafer Level Packaging (FOWLP) provides a solution to match OSAT existing capability;besides, the chip last process in FOWLP can further enhance the total yield by selectable known-good dies (KGDs). However, under processing, the large portion of molding compound induces high warpage to challenge fabrication limitation. The additional leveling process is usually applied to lower the warpage that caused by the mismatch of coefficient of thermal expansion and Young's modulus from carriers, dies, and molding compound. This process results in the increase of package cost and even induce internal damages that affect device reliability. In order to avoid leveling process and improve warpage trend, in this paper, we simulated several models with different design of molding compound and dies, and then developed a multi-chip last FOWLP test vehicle by package dimension of 12×15 mm~2 with 8×9 and 4×9 mm~2 multiple dies, respectively. The test vehicle performed three redistribution layers (RDLs) including one fine pitch RDL of line width/line spacing 2μm/2μm, which is also the advantage of multi-chip last FOWLP, and also exhibited ball on trace structure for another low cost option. For the wafer warpage discussion, the results showed that tuning the thickness of molding compound can improve warpage trend, especially in the application of high modulus carrier, which improved wafer warpage within 1mm;for package warpage discussion, the thinner die can lower the warpage of package. Through well warpage controlling, the multi-chip last FOWLP package with ball on trace design was successfully presented in this paper, and also passed the package level reliability of TCB 1000 cycles, HTSL 1000 hrs, and uHAST 96 hrs, and drop test by board level reliability.

关键词： FOWLP multi-chips module Carrier Fine Pitch RDL Warpage Molding Compound Ball on Trace

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Intelligent Wheelchair Control System Based on BCI and the Image Display of EEG

Intelligent Wheelchair Control System Based on BCI and the I...

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2016 ieee Advanced Information Management,Communicates,Electronic and Automation Control conference(IMCEC 2016)

作者： Zhenxin Su Xin Xu Jiawei Ding Wenjuan Lu College of Telecommunications & Information Engineering NUPT College of Geographic & Biologic Information NUPT

ISBN: (纸本)9781509001668

The intelligent wheelchair control system is built by single chip microcontroller and brain computer interface *** on the application of EEG data is mainly purpose about this ***,TGAM chip as the core of production of EEG acquisition device-portable headset equipment,achieved EEG data acquisition;Secondly,connecting computer with EEG acquisition device by Bluetooth module,the acquisition of EEG raw data is transmitted to the computer,make use of the e Sense algorithms accomplish EEG data quantized;Thirdly,control command is obtained according to processing,control command is transmitted to MCU which control the wheelchair;Finally,MATLAB's GUI functions to achieve EEG image display,compared to the image display of single programming language,the paper proposed multilanguage mixed programming method,multi-language mixed programming method better display the three-dimensional image of the EEG.

关键词： Brain Computer Interface EEG e Sense algorithms SCM image display

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Prognosis of chip-loss failure in high-power IGBT module by self-testing

Prognosis of chip-loss failure in high-power IGBT module by ...

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Annual conference of Industrial Electronics Society

作者： Yeke Liu Xiang Dawei Yifan Fu Tongji University Shanghai China Tongji University Shanghai Shanghai CN

Reliability is of great importance for power converter systems, such as metro, high-speed train and offshore wind turbine. Bonding wire lift-off is a common failure in IGBT module due to the thermomechanical fatigue under cyclical temperature and power swings. Consequently, this will lead to the chip-loss failure gradually in a high power multi-chip IGBT module during long-term operation. To prevent a catastrophic failure from happening, a self-testing technique for IGBT module is proposed in this paper to detect the chip-loss failure at initial stage. During the test, a shoot-through current is imposed on the device under test (DUT) by gate control and its peak value is selected as the failure criterion for chip-loss failure prognosis. Since the IGBT switching behavior changes after failure, the shoot-through current will deviate from its initial value, which can be detected for failure prognosis. For safety, the self-testing is conducted intermittently on-site during system down time and the shoot-through current is limited less than the IGBT rated current at lowered DC voltage. To clarify the method, its test scheme, working principle and implementation are firstly discussed in the paper. Then, experimental work was carried out on a test rig with 3.3kV/800A IGBT modules (emulating a metro traction drive system) to verify the method. Preliminary test results demonstrate that the proposed self-testing method is a simple and effective technique for detecting the gradually developed IGBT chip-loss failure.

关键词： Insulated gate bipolar transistors Built-in self-test Voltage measurement Wires Prognostics and health management Switches Bonding

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All Solid-State multi-chip multi-Channel WDM Photonic module 65

All Solid-State Multi-Chip Multi-Channel WDM Photonic Module

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ieee 65th Electronic Components and Technology conference (ECTC)

作者： Shubin, I. Zheng, X. Thacker, H. Djordjevic, S. S. Lin, S. Amberg, P. Lexau, J. Raj, K. Cunningham, J. E. Krishnamoorthy, A. V. Oracle 9515 Towne Ctr Dr San Diego CA 92121 USA

ISBN: (纸本)9781479986101

In this work we report on a packaged prototype of a WDM photonic transceiver. It is a hybrid assembly based on a 130 nm SOI photonic circuitry integrated with a 40 nm CMOS VLSI driver. Our prototype supports eight tunable WDM channels operating at 10 Gb/s each capable of both transmitting and receiving data on the same chip. We discuss two options to close the link while using the optical fiber or another waveguide bridge chip. We provide hybridization details and supporting link measurement data to describe packaged photonic module and its power efficient functionality as its on-chip power per channel averaged 1.3pJ/bit, laser electrical power excluded.

关键词： Microprocessor chips

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Organic multi-chip module for High Performance Systems 65

Organic Multi-Chip Module for High Performance Systems

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ieee 65th Electronic Components and Technology conference (ECTC)

作者： Shan, Lei Kwark, Young Baks, Christian Gaynes, Michael Chainer, Timothy Kapfhammer, Mark Saiki, Hajime Kuhara, Atsushi Aguiar, Gil Ban, Noritaka Nukaya, Yoshiki IBM TJ Watson Res Ctr Yorktown Hts NY 10598 USA IBM Semicond Res Dev Ctr Hopewell Jct NY 12533 USA NTK Technol Nagoya Aichi Japan

ISBN: (纸本)9781479986095

In this work, IBM Research and NTK Technologies have explored the development of an organic multi-chip module (MCM) solution, with the goal of developing innovative technologies that address the requirements of high performance systems. A 90 x 90 mm organic MCM was designed, fabricated, and assembled with dual side mountable 24 x 28 mm thermal test chips mounted on chip-scale interposers to enable functional screening and rework process. The work demonstrated that a large scale organic MCM was compatible with LGA sockets with over 6000 contacts.

关键词： Microprocessor chips

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Flip chip Technology and Its Application in Microwave module 16

Flip Chip Technology and Its Application in Microwave Module

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16 int conf elect packaging technology

作者： Han Zongjie Zhang Xiao Li Xiaoxuan Yan Wei Nanjing Res Inst Elect Technol Nanjing Jiangsu Peoples R China

ISBN: (纸本)9781467379991

Stud bump bonding technology is suitable for various microwave modules, since it gives bumps on many different kinds of IC chips with the advantage of simple technique, low cost and needing no UBM. Stud bump flip chip technology and its application in microwave module was introduced in the paper, preparation of stub bump and flip chip process were studied in detail. The results indicate that US power, bonding force and bonding time are the key parameters which influence the stub bump bonding process and stub bump quality. The optimal process parameters are US time about 50ms, US power about 0.36W and bonding force about 55gf, which is obtained by experiments. A kind of microwave chip was fliped on multi-layer thin-film substrate using stud bump flip chip technology, which indicated that stud bump flip chip technology is suitable for hybrid integrated circuit MMIC bonding in small batch. Stud bump flip chip can meet the needs of study and production of microwave modules.

关键词： microwave module flip chip stud bump

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