检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

529 篇 会议
10 篇 期刊文献

馆藏范围

539 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

396 篇 工学
- 261 篇 电气工程
- 151 篇 电子科学与技术（可...
- 119 篇 计算机科学与技术...
- 59 篇 材料科学与工程（可...
- 52 篇 信息与通信工程
- 52 篇 软件工程
- 35 篇 机械工程
- 27 篇 仪器科学与技术
- 27 篇 化学工程与技术
- 26 篇 动力工程及工程热...
- 21 篇 控制科学与工程
- 17 篇 冶金工程
- 16 篇 石油与天然气工程
- 13 篇 光学工程
- 10 篇 航空宇航科学与技...
- 7 篇 建筑学
- 6 篇 土木工程
- 5 篇 力学（可授工学、理...
- 4 篇 轻工技术与工程
- 4 篇 核科学与技术
104 篇 理学
- 72 篇 物理学
- 25 篇 化学
- 19 篇 数学
- 4 篇 生物学
24 篇 管理学
- 23 篇 管理科学与工程(可...
- 7 篇 工商管理
8 篇 医学
- 5 篇 临床医学
- 5 篇 特种医学
5 篇 经济学
- 5 篇 应用经济学
3 篇 军事学

主题

61 篇 multichip module...
25 篇 silicon
25 篇 multi-chip modul...
24 篇 packaging
23 篇 microprocessor c...
22 篇 switches
20 篇 substrates
19 篇 electronics pack...
18 篇 silicon carbide
16 篇 assembly
13 篇 costs
13 篇 integrated circu...
12 篇 radio frequency
11 篇 multichip module
11 篇 logic gates
11 篇 inductance
10 篇 bonding
10 篇 finite element a...
10 篇 ceramics
9 篇 reliability

机构

4 篇 univ alabama dep...
4 篇 hypres inc elmsf...
3 篇 stanford univ st...
2 篇 shanghai aerospa...
2 篇 marvell burnaby
2 篇 marvell
2 篇 jst tsukuba ibar...
2 篇 sun microsystems...
2 篇 caltech jet prop...
2 篇 georgia inst tec...
2 篇 tyndall natl ins...
2 篇 guilin univ elec...
2 篇 univ alabama dep...
2 篇 micromodule syst...
2 篇 center for integ...
2 篇 fraunhofer izm
2 篇 micromodule syst...
2 篇 shenzhen smartch...
2 篇 academy of infor...
2 篇 keio university ...

作者

4 篇 yorozu shinichi
4 篇 miyazaki toshiyu...
4 篇 lemmon andrew n.
3 篇 paolo mattavelli
3 篇 luo le
3 篇 dai wayne wei-mi...
3 篇 lu hua
3 篇 boroyevich dusha...
3 篇 wang li
3 篇 brian hughes
3 篇 ning puqi
3 篇 castellazzi albe...
3 篇 pence w.e.
3 篇 bailey chris
3 篇 dushan boroyevic...
3 篇 lemmon andrew
3 篇 hughes brian
3 篇 mattavelli paolo
2 篇 zhang tao
2 篇 kameda yoshio

语言

529 篇 英文
7 篇 中文
3 篇 其他

检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 539 条记录，以下是211-220 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Design considerations for GaN HEMT multichip halfbridge module for high-frequency power converters

Design considerations for GaN HEMT multichip halfbridge modu...

引用

Annual ieee conference on Applied Power Electronics conference and Exposition (APEC)

作者： Fang Luo Zheng Chen Lingxiao Xue Paolo Mattavelli Dushan Boroyevich Brian Hughes Center for Power Electronics System Virginia Tech Blacksburg VA USA Energy Efficient Electronics Department HRL Laboratories LLC Malibu USA

This paper discusses the design of a multichip Gallium-Nitride (GaN) power module for high frequency power conversion. The module is designed with HRL 600 V Gallium-Nitride (GaN) enhancement mode HEMT device. To exploit the capability of fast switching with low loss from high voltage GaN devices, different layout structures have been analyzed to reduce power loop parasitic inductance and improve switching performance. The approach investigated in this paper is based on a multi-chip module where small current rated dies are placed in parallel to achieve higher current handling capability. Moreover, a transmission-line type gate structure has been proposed to minimize the gate loop inductance and reduce the gate voltage ringing. Finite-Element-Analysis (FEA) and switching circuit simulation show that the multi-layer power loop design can effectively reduce the gate loop inductance and voltage overshoot on the devices. This multi-layer design also improves current sharing of the multi-chip module during switching operation. The transmission-line gate design is also proved in both simulation and experiment to be effective for reducing the gate loop inductance as well as gate loop ringing.

关键词： Logic gates Layout Switches Inductance Gallium nitride Capacitors Packaging

来源：评论

学校读者我要写书评

暂无评论

Development of smart LED lighting system using multi-sensor module and bluetooth low energy technology

Development of smart LED lighting system using multi-sensor ...

引用

ieee Communications Society conference on Sensor and Ad Hoc Communications and Networks (SECON)

作者： Young Seek Cho Jaerock Kwon Seyeong Choi Dae-Hee Park Center for Advanced Electric Applications Wonkwang University Iksan Korea Kettering University Flint MI US Department of Information and Communication Engineering Wonkwang University Iksan Korea

A smart LED lighting system is designed and implemented using a multi-sensor module and Bluetooth Low Energy (LE) technology. In order to monitor the environmental information such as ambient light intensity, temperature, and/or activity of human or other objects, a multi-sensor module including an ambient light sensor, temperature sensor, and motion sensor is combined to a microcontroller. By collecting environmental information, the LED lighting system can be controlled automatically. Through the Bluetooth LE technology, a user can monitor the environmental information on a smartphone and/or control the LED lighting system manually. Two features, multi-sensor module and Bluetooth LE, let the LED lighting system be more intelligent, energy efficient, and convenient lighting system.

关键词： Light emitting diodes Lighting Bluetooth Temperature sensors Microcontrollers System-on-chip Monitoring

来源：评论

学校读者我要写书评

暂无评论

Battery balancing algorithm for serial multi-module UPS system

Battery balancing algorithm for serial multi-module UPS syst...

引用

ieee conference and Expo Transportation Electrification Asia-Pacific (ITEC Asia-Pacific)

作者： Soon-Ryung Lee Bong-Yeon Choi Min-Gi Kim Eun-Jung Ha Chung-Yuen Won College of Information and Communication Engineering Sungkyunkwan University Suwon Republic of Korea

In this paper, battery balancing algorithm for serial multi-module UPS system is proposed. The battery balancing algorithm is performed by the output power control of each UPS modules for eliminating SOC difference of batteries respectively. So, the coulomb counting method is used to estimate SOC of the batteries. The reference is compensated with SOC difference and according to magnitude order of SOC . Finally, the output voltage becomes sum of output voltage of UPS modules and the utilization of the battery is increased in serial UPS system. The validity of proposed battery balancing algorithm is verified by simulation results.

关键词： Batteries System-on-chip Uninterruptible power systems Power generation Inverters Simulation Discharges (electric)

来源：评论

学校读者我要写书评

暂无评论

Improving the accuracy of module based thermal modeling method for VLSI circuits design

Improving the accuracy of module based thermal modeling meth...

引用

ieee conference on Electron Devices and Solid-State Circuits

作者： Hai Wang Ming Zhang Chi Zhang He Tang Xiaowei Wang School of Microelectronics & Solid-State Electronics University of Electronic Science & Technology of China Chengdu China Microelectronics Department Xi'an Jiaotong University Xi'an China

ISBN: (纸本)9781479923366

Thermal-aware VLSI circuit design has become important for the advanced many-core and 3-D stacking architecture. Major bottlenecks in the design flow include the thermal modeling and analysis, which are both memory and time consuming. In this paper, we discuss the module based thermal modeling method, which divides the chip into modules and builds the thermal model by assembling the reduced module models. An accuracy enhancement framework is introduced in order to minimize the error at the module boundaries. Experiments on multi-core microprocessor show that the proposed technique leads to fast and accurate thermal analysis for VLSI circuits design.

关键词： Accuracy Merging Thermal analysis Ports (Computers) Integrated circuit modeling Very large scale integration Microprocessors

来源：评论

学校读者我要写书评

暂无评论

Normally-off GaN-on-Si multi-chip module boost converter with 96% efficiency and low gate and drain overshoot

Normally-off GaN-on-Si multi-chip module boost converter wit...

引用

Annual ieee conference on Applied Power Electronics conference and Exposition (APEC)

作者： Brian Hughes James Lazar Stephen Hulsey Marcel Musni Daniel Zehnder Austin Garrido Raghav Khanna Rongming Chu Sameh Khalil Karim Boutros Energy Efficient Electronics Department HRL Laboratories LLC Malibu USA

A high efficiency synchronous GaN half-bridge boost converter with fast switching and low overshoot is achieved by minimizing parasitic inductance and critical damping the gate drive. A normally-off GaN-on-Si 2.4kW synchronous halfbridge multi-chip module (MCM) is designed with a power-loop inductance of ~4nH using transmission-line techniques to minimize inductance. The gate circuit inductance is reduced to 1nH using bare MOSFET die for driving the GaN gates and a 0.5mil flexible substrate gate transmission-line. Configured as a boost converter with no added gate resistance, the synchronous half-bridge switches 400V in only 1.3ns. The high voltage slew rates of 325V/ns results in overshoot of 200V on the drain and 4V overshoot on the gate, both of which may damage the GaN switches. Critically damping the gate turn-on reduces overshoot to safe levels of 1V gate overshoot and ~20V drain overshoot. The gate damping increases drain fall time to 3ns, which only decreases efficiency by 0.2% at 1MHz. The resulting synchronous boost converter has an efficiency of 96%, switching 300V at 1MHz with 50% duty cycle and an output power of 2.4kW. The high efficiency of GaN switches and the 0.6C/W thermal resistance of the MCM enable a maximum junction temperature of 65°C.

关键词： Logic gates Gallium nitride Switches Resistance Inductance Substrates Silicon

来源：评论

学校读者我要写书评

暂无评论

multi-Functional Converter with Integrated Motor Control, Battery Charging and Active module Balancing for Electric Vehicular Application

Multi-Functional Converter with Integrated Motor Control, Ba...

引用

ieee conference on Vehicle Power and Propulsion (VPPC)

作者： Laszlo Mathe Erik Schaltz Remus Teodorescu Marcos Rejas Haddioui Dep. of Energy Technology Aalborg University Aalborg Denmark

In order to reduce the fuel consumption and the acoustical noise generated by refuse lorries, electrification of the waste compactor unit is a very promising solution. For the electrical energy storage Lithium-Sulfur (Li-S) battery technology has been selected with potential for reducing the cost, weight and volume in comparison with other Li-Ion based chemistries. The control of the energy flow has been done through a Modular multilevel Converter (MMC), which has demonstrated advantages over 2 level converters in terms of efficiency, fault tolerant operation, flexible operation modes. It has been used successfully in HVDC/FACTS and large drive applications. In this paper the use of MMC for a battery driven waste compactor unit addressed with integrated functionality including: motor driver, battery charge and active balancing is presented. The challenges addressed here are related to the design of control strategy and current ripple reduction through the battery for life time extension.

关键词： Batteries System-on-chip Motor drives Waste materials Capacitors Voltage control Educational institutions

来源：评论

学校读者我要写书评

暂无评论

Modeling, design and demonstration of multi-die embedded WLAN RF front-end module with ultra-miniaturized and high-performance passives

Modeling, design and demonstration of multi-die embedded WLA...

引用

Electronic Components and Technology conference (ECTC)

作者： Srikrishna Sitaraman Yuya Suzuki Christopher White Vijay Nair Telesphor Kamgaing Frank Juskey Sung Jin Kim P. Markondeya Raj Venky Sundaram Rao Tummala 3D Systems Packaging Research Center Georgia Institute of Technology Atlanta GA Intel Corporation Chandler AZ USA TriQuint Semiconductor FL USA Zeon Corporation Kanagawa Japan

This paper demonstrates, for the first time, a Wireless Local Area Network (WLAN) radio frequency (RF) front end module (FEM), incorporating the smallest, high-performance band-pass filter (BPF) on a 110μm-thin organic substrate with chip-last embedded actives and thin-film passives. The FEM consists of a power amplifier (PA) die, a switch die, and two low-noise amplifier (LNA) dies, integrated with a BPF and a low-pass filter (LPF). Full-wave electromagnetic (EM) simulations are employed to study the signal path loss, EM radiation and coupling. The BPF and LPF have 0.25dB and 0.5dB insertion loss respectively, with in-substrate dimensions of 1mm × 1mm × 0.05mm. The PA die shows a gain of around 10.8 dB at 2.4GHz. The path between the antenna and the amplifiers is also characterized to have a loss of 3dB. The electromagnetic coupling from the PA output to the LNA input and to the PA power supply is simulated using full wave EM solver HFSS and found to be higher than 60dB, indicating very good EM isolation. Each block of the FEM is individually characterized and combined using Agilent ADS to obtain the complete S-parameter performance. Both the transmitter and receiver chains have gain of 9dB.

关键词： Radio frequency Band-pass filters Substrates Wireless LAN Finite element analysis Switches Layout

来源：评论

学校读者我要写书评

暂无评论

A 1200 V, 60 A SiC MOSFET multi-chip Phase-Leg module for High-Temperature, High-Frequency Applications

A 1200 V, 60 A SiC MOSFET Multi-Chip Phase-Leg Module for Hi...

引用

28th Annual ieee Applied Power Electronics conference and Exposition (APEC)

作者： Chen, Zheng Yao, Yiying Boroyevich, Dushan Ngo, Khai Mattavelli, Paolo Rajashekara, Kaushik Virginia Polytech Inst & State Univ CPES Bradley Dept Elect & Comp Engn Blacksburg VA 24061 USA Virginia Polytech Inst & State Univ CPES Dept Mat Sci & Engn Blacksburg VA 24061 USA Univ Texas Dallas Dept Elect Engn Dallas TX 75080 USA Rolls Royce Corp Indianapolis IN USA

ISBN: (纸本)9781467343558;9781467343541

This paper presents the design and test results of a 1200 V, 60 A multi-chip phase-leg module based on SiC MOSFETs. The module will be used in a high-frequency (70 kHz) AC-DC converter, and in high-temperature (200 degrees C) environment, for aircraft applications. Towards this target, the high-temperature characteristics of the SiC MOSFETs are firstly evaluated. The results show the superiority of SiC MOSFETs in both static and switching performances compared to Si devices. Different high-temperature packaging materials are then surveyed and carefully selected for the module to sustain the harsh environment. An improved substrate layout is also proposed based on the "switch pair" concept in order to reduce the parasitic ringing during switching transients. The concept is validated through the comparison with a regular layout design in both stray inductance analysis and time-domain simulation. Finally, the static and switching performances of the fabricated module are presented.

关键词： Silicon carbide

来源：评论

学校读者我要写书评

暂无评论

Peculiarities of multichip Micro module Frameless Design with Ball Contacts on the Flexible Board

Peculiarities of Multichip Micro Module Frameless Design wit...

引用

ieee 33rd International Scientific conference on Electronics and Nanotechnology (ELNANO)

作者： Vertyanov, D. V. Tikhonov, K. S. Timoshenkov, S. P. Petrov, V. S. Blinov, G. A. Natl Res Univ Elect Technol Dept Microelect Moscow Zelenograd Russia

ISBN: (纸本)9781467346726;9781467346696

New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.

关键词： multichip module flexible board flip-chip golden ball pins three-dimensional assembly

来源：评论

学校读者我要写书评

暂无评论

Thermal Characterization and Simulation Study of 2.5D Packages with multi-chip module on Through Silicon Interposer

Thermal Characterization and Simulation Study of 2.5D Packag...

引用

Proceedings of the 2013 ieee 15th Electronics Packaging Technology conference (EPTC)

作者： Zhang, H. Y. Zhang, X. W. Lau, B. L. Lim, Sharon Ding, Liang Yu, M. B. Lee, Y. J. Inst Microelect Singapore 117685 Singapore

ISBN: (纸本)9781479928347;9781479928323

Next generation of heterogeneous integration requires 2.5D package on interposer as enabling technology for less signal delay, faster speed, and more functionality. In this work, thermal characterization and simulation of a 2.5D package with multi chips on through silicon interposer (TSI) are reported. Two dummy chips with chip sizes of 7.6x10.9mm and 8mmx8mm respectively, are arranged on the interposer through the nip chip bumping and joining process. To facilitate the thermal characterization, a thermal test chip of 5.08x5.08mm is embedded on the same interposer for thermal test and simulation validation. In either molded or bare die BGA package format, the thermal test vehicles are brought for thermal characterization, including Theta JA, Theta JB measurement conforming with the JEDEC standards. It is found that the overmolded package has slightly lower thermal resistances than the bare die package. In addition, the Theta JC, namely, the thermal resistance from the junction to the top casing is also characterized through a high performance cold plate. Besides the thermal measurements, thermal simulation models under different boundary conditions are established, respectively, to compare with the thermal measurements. Good agreements are generally achieved between simulation and measurements. Further simulation is also conducted to study the effects of overmold thickness and power dissipation from the multi chips module on the interposer.

关键词： Silicon

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共54页 << < 18 19 20 21 22 23 24 25 26 27 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：