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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是231-240 订阅

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A 1200 V, 60 A SiC MOSFET multi-chip phase-leg module for high-temperature, high-frequency applications

A 1200 V, 60 A SiC MOSFET multi-chip phase-leg module for hi...

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Annual ieee conference on Applied Power Electronics conference and Exposition (APEC)

作者： Zheng Chen Yiying Yao Dushan Boroyevich Khai Ngo Paolo Mattavelli Kaushik Rajashekara Center for Power Electronics Systems (CPES) Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA Department of Material Science and Engineering Virginia Polytechnic Institute and State University Blacksburg VA USA Department of Electrical Engineering University of Texas at Dallas Dallas TX USA

This paper presents the design and test results of a 1200 V, 60 A multi-chip phase-leg module based on SiC MOSFETs. The module will be used in a high-frequency (70 kHz) AC-DC converter, and in high-temperature (200°C) environment, for aircraft applications. Towards this target, the high-temperature characteristics of the SiC MOSFETs are firstly evaluated. The results show the superiority of SiC MOSFETs in both static and switching performances compared to Si devices. Different high-temperature packaging materials are then surveyed and carefully selected for the module to sustain the harsh environment. An improved substrate layout is also proposed based on the “switch pair” concept in order to reduce the parasitic ringing during switching transients. The concept is validated through the comparison with a regular layout design in both stray inductance analysis and time-domain simulation. Finally, the static and switching performances of the fabricated module are presented.

关键词： Switches Silicon carbide MOSFET Temperature Layout Silicon

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Thermal characterization and simulation study of 2.5D packages with multi-chip module on through silicon interposer

Thermal characterization and simulation study of 2.5D packag...

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Electronics Packaging Technology conference (EPTC)

作者： H. Y. Zhang X. W. Zhang B. L. Lau Sharon Lim Liang Ding M. B. Yu Y. J. Lee Institute of Microelectronics Singapore

Next generation of heterogeneous integration requires 2.5D package on interposer as enabling technology for less signal delay, faster speed, and more functionality. In this work, thermal characterization and simulation of a 2.5D package with multi chips on through silicon interposer (TSI) are reported. Two dummy chips with chip sizes of 7.6×10.9mm and 8mm×8mm, respectively, are arranged on the interposer through the flip chip bumping and joining process. To facilitate the thermal characterization, a thermal test chip of 5.08×5.08mm is embedded on the same interposer for thermal test and simulation validation. In either molded or bare die BGA package format, the thermal test vehicles are brought for thermal characterization, including Theta JA Theta JB measurement conforming with the JEDEC standards. It is found that the overmolded package has slightly lower thermal resistances than the bare die package. In addition, the Theta JC, namely, the thermal resistance from the junction to the top casing is also characterized through a high performance cold plate. Besides the thermal measurements, thermal simulation models under different boundary conditions are established, respectively, to compare with the thermal measurements. Good agreements are generally achieved between simulation and measurements. Further simulation is also conducted to study the effects of overmold thickness and power dissipation from the multi chips module on the interposer.

关键词： Electronic packaging thermal management Temperature measurement Thermal resistance Electrical resistance measurement Semiconductor device measurement Heating Silicon

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Design and implementation of Wi-Fi based imaging system on concerto platform

Design and implementation of Wi-Fi based imaging system on c...

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Annual International conference on Emerging Research Areas and International conference on Microelectronics, Communications and Renewable Energy (AICERA/ICMiCR)

作者： Ahammed S. Shebi Binu C Pillai R Rajesh Dept of Communication Engineering Amaljyothi College of Engineering Kanjirapally India Department of Communication Engineering Amal Jyothi College of Engineering Kanjirappally India SEG CDAC Trivandrum India

Wi-Fi is the name of a popular wireless networking technology that uses radio waves to provide wireless high speed Internet and network connections. In this paper, we introduce a real-time wireless image transmission system. In the present systems uses two separate processors for image acquisition and communication subsystems. Here we use a single Concerto chip instead of two processors. We transmit images with variable size. This system is based on Simple Link CC3000 Wi-Fi module and F28M35x (Concerto) MCU which controls the wireless transceiver. The Concerto is a multi-core system-on-chip microcontroller (MCU) with independent communication and real-time control subsystems. The data rate of the system is 11Mbps at least and 54Mbps at most. The Wi-Fi module uses infrastructure mode network of ieee802.11g. The common constrains that we are facing during the design and implementation of Wi-Fi networks are security issues, low data rates, distance problem, hidden node problems and error rate. These negative aspects can be simplified by using Simple Link CC3000 Wi-Fi module.

关键词： ieee 802.11 Standards Program processors Wireless sensor networks Cameras Communication system security Wireless networks

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5.5GHz system z microprocessor and multi-chip module

5.5GHz system z microprocessor and multi-chip module

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ieee International conference on Solid-State Circuits (ISSCC)

作者： James Warnock Yuen H Chan Hubert Harrer David Rude Ruchir Puri Sean Carey Gerard Salem Guenter Mayer Yiu-Hing Chan Mark Mayo Adam Jatkowski Gerald Strevig Leon Sigal Ayan Datta Anne Gattiker Aditya Bansal Douglas Malone Thomas Strach Huajun Wen Pak-Kin Mak Chung-Lung Shum Donald Plass Charles Webb IBM Systems and Technology Group Yorktown Heights NY USA IBM Systems and Technology Group Poughkeepsie NY USA IBM Systems and Technology Group Boeblingen Germany IBM Research Yorktown Heights NY USA IBM Systems and Technology Group Williston VT USA IBM Systems and Technology Group Austin TX USA IBM Systems and Technology Group Bangalore India IBM Research Austin TX USA

The new System z microprocessor chip (“CP chip”) features a high-frequency processor core running at 5.5GHz in a 32nm high-κ CMOS technology [1], using 15 levels of metal. This chip is a successor to the 45nm product [2], with significant improvements made to the core and nest (i.e. the logic external to the cores) in order to increase the performance and throughput of the design. Also, special considerations were necessary to ensure robust circuit operation in the high-κ technology used for implementation. As seen in the die photo, the chip contains 6 processor cores (compared to 4 cores in the 45nm version), and a large shared 48MB DRAM L3 cache. Each core includes a pair of data and instruction L2 SRAM caches of 1MB each. In addition, the chip contains a memory control unit (MCU), an I/O bus controller (GX), and two sets of interfaces to the L4 cache chips (also in 32nm technology). The CP chip occupies 598 mm 2 , contains about 2.75B transistors, and has 1071 signal IOs.

关键词： Program processors Logic gates Reliability Synchronization Stress CMOS integrated circuits Routing

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ISP module for Stereoscopic 3D on a multi-core VLIW architecture

ISP Module for Stereoscopic 3D on a multi-core VLIW architec...

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ieee/OSA/IAPR International conference on Informatics, Electronics and Vision (ICIEV)

作者： Velciov, Ivan Scott, John Univ Politehn Timisoara Romania Movidius Ltd Dublin Ireland

In this paper a novel approach for a stereoscopic 3D module will be presented. The 3D module incorporates two inter-changeable camera sensors and a multi core VLIW System on chip (SoC). The SoC is a multi-core DSP whi... 详细信息

ISBN: (纸本)9781467311526

关键词： Stereoscopic Stereo image processing VLIW architecture Three Dimensions

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Design and Packaging of Small 60 GHz Antenna Array for multi-chip Communication

Design and Packaging of Small 60 GHz Antenna Array for Multi...

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ieee International conference on Wireless Information Technology and Systems (ICWITS)

作者： Yeh, Ho-Hsin Melde, Kathleen L. Eisenstadt, William R. Univ Arizona Dept Elect & Comp Engn Tucson AZ 85721 USA Univ Florida Dept Elect & Comp Engn Gainesville FL 32611 USA

ISBN: (纸本)9781467309479;9781467309462

In this paper, the design of a directive two-antenna 60 GHz array for chip-to-chip communications is proposed. The small array is used to improve the wireless link budget. The antenna system is designed in a package (AiP) which could be placed on the top of a silicon substrate. The analysis of the radiated fields, the packagine integration the feeding circuits are discussed in this paper. With proper design considerations, this 60 GHz antenna system demonstrates improved horizontal transmission capability and wireless link efficiency.

关键词： communication in multi-chip module antenna in package (AiP) antenna feeding antenna radiation patterns

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Design of PIC microcontroller-based high-capacity multi-channel data acquisition module

Design of PIC microcontroller-based high-capacity multi-chan...

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2012 International conference on Measurement, Information and Control, MIC 2012

作者： Wang, Hongmin Jie, Zhu Nie, Xufei Li, Dandan Harbin University of Science and Technology Harbin China Harbin Institute of Computing Technology Harbin China

ISBN: (纸本)9781457716027

Using Microchip's PIC microcontroller and the flash memory chip, I designed a high -capacity multi-channel data acquisition module. In the design of the hardware circuit, Focus on the multi-channel data acquisition circuit for PIC16F877 MCU and SPI communication link between the microcontroller and FLASH chip. In software development, Developed A/D conversion process using the PIC16F877 MCU on-chip A/D converter module in C language, and the entire program of temperature acquisition using the DS18B20. The results show that: Developed a data acquisition module with low cost, simple structure and high reliability features. © 2012 ieee.

关键词： Data acquisition

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Development of a new die-attach process and related bonding tool for multi-chip LED module

Development of a new die-attach process and related bonding ...

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13th International conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)

作者： Hang, Chunjin Wang, Hong Fei, Jingming Wang, Chunqing Harbin Inst Technol State Key Lab Adv Welding & Joining Harbin 150001 Peoples R China

ISBN: (纸本)9781467316811;9781467316828

A new die-attach process was presented for the multi-chip LED module, and the related bonding tool for the LED module was also designed. With the new bonding process and the novel bonding tool, 21 LED chips have been attached onto a single substrate within one bonding process. The investigation of bonding chips' appearance and thickness of interface layer were carried out to evaluate the die-attach performance. The die-attach process has been optimized by studying the effects of bonding force on the die-attach performance. The results showed this method can provide a high die-attach precision as well as the chip attachment consistency.

关键词： light emitting diodes light sources microassembling

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multi-chip SiC DMOSFET Half-Bridge Power module for High Temperature Operation

Multi-Chip SiC DMOSFET Half-Bridge Power Module for High Tem...

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27th Annual ieee Applied Power Electronics conference and Exposition (APEC)

作者： Funaki, Tsuyoshi Sasagawa, Masashi Nakamura, Takashi Osaka Univ Div Elect Elect & Informat Eng Osaka Japan Rohm Co Ltd Res & Dev Headquaters Kyoto Japan

ISBN: (纸本)9781457712166

The authors developed 80A, 1200V half bridge SiC power module for high temperature operation with connecting multiple small current rating SiC MOSFETs in parallel on a ceramic substrate. This paper characterizes and evaluates the static characteristics and switching operation capability of the developed power module from room temperature (25C) to high temperature condition (200C). First, the static current-voltage characteristics for wide temperature range are tested, and then terminal capacitance-voltage characteristics are evaluated. The switching behavior of the SiC power module is experimented and the temperature dependencies are evaluated. The results clarified the high temperature operation capability of the developed SiC power module without degrading fast switching capability.

关键词： Silicon carbide

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Thermal Design of a LED multi-chip module for Automotive Headlights

Thermal Design of a LED Multi-chip Module for Automotive Hea...

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13th International conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)

作者： Qi Lin Wang Chunqing Tian Yanhong Harbin Inst Technol Natl Key Lab Adv Welding Prod Technol 92 West Dazhi St Harbin 150001 Heilongjiang Peoples R China

ISBN: (纸本)9781467316811;9781467316828

In this paper, a LED multi-chip module with a heat pipe was designed for automotive headlights, which took advantages of the relative air flow during vehicle travelling for forced convection to keep the junction temperature of LED chips below 60 degrees C. The Structure is compact enough to be suitable for placement in a small space for automotive lighting. The influence of paraments on the junction temperature of LED chips, such as the distance of LED arrangement and dimensions of both DBC substrates and sinks, has also been discussed by numerical simulation using ANSYS software. Then, the structure of the module was optimized. The junction temperature was measured using the forward voltage method, under the condition of both natural convection and forced convection. It was analyzed that the factors having an effect on thermal performance of the module. Furthermore, taking the condition of natural air convection during vehicle stopping into account, a temperature control system was designed for this module.

关键词： forced convection heat pipes light emitting diodes multichip modules thermal management (packaging)

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