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A Scalable Digital Pulse Process module for the MRPC Detector of Muon Tomography

A Scalable Digital Pulse Process Module for the MRPC Detecto...

引用

ieee Nuclear Science Symposium and Medical Imaging conference

作者： Xiaoguang Yue Ming Zeng Zhi Deng Zhi Zeng Xuewu Wang Jianping Cheng Key Laboratory of Particle & Radiation Imaging Ministry of Education Department of Engineering Physics Tsinghua University Beijing China Department of Engineering Physics Tsinghua University Beijing China

Muon tomography with cosmic ray muons is a novel technology for high-Z material detection, which requires large-scale, high-efficiency, high spatial resolution detectors to track the muons. From previous studies, we conclude that the multi-gap resistive plate chamber (MRPC) will be an excellent and inexpensive choice for this application, which also offers the possibility of introducing energy information of muons by TOF measurement to image reconstruction of muon tomography owning to the inherent high time resolution of MRPC. To get enough spatial resolution, the dedicated electronics is required to be able to handle thousands of readout channels. To keep the flexibility of charge and time measurement for detector research purpose, a fast preamp with waveform sampling combined with the Digital Pulse Process (DPP) technology was chosen as the readout solution. At present, an 8-ch current sensitive preamp ASIC has been designed and implemented for the SDPP module, and the switched capacitor array (SCA) chip DRS4 designed by the PSI was chosen as the sampler of the SDPP.

关键词： MRPC SCA DPP

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Design of multi-Point Wireless Temperature Measuring System

Design of Multi-Point Wireless Temperature Measuring System

引用

4th International conference on Modelling,Identification and Control(ICMIC 2012)

作者： ShaNi, Lili Nie and Junfeng Su received their Bachelor degree in 2011 and 2012, respectively, at Department of Information & Technology, Center China Normal University, P R China. Now they are studying toward M.Sc. in Department of Information and Technology, Center China Normal University, Wuhan, China. Shaocheng Qu is a full professor in Control Systems and communication system at Department of Information and Technology , Center China Normal University (CCNU)

This paper provides a method of measuring multi-point temperature wirelessly based on the MSP430F149 and DS18B20. The system adopts the MSP430F149 microcontroller as the core control components, controlling the wireless digital transmission chip NRF24L01 to transfer temperature data collected by several DS18B20 chips in Enhanced Shock Burst mode. In addition, the system uses design of ultra-low power, and could be active for a long time needing only 3V battery. It shows that the system can work well in low power consumption. For hardware, there are four parts, the wireless communication module nRF24L01, temperature data acquisition circuit, the display module and serial communication module. Using the modular design, the software is composed of upper computer and lower computer. The test result shows that the system is stable, convenient in control. It can measure temperature in real time, and transfer wireless data reliably in low-power.

关键词： MSP430F149 DS18B20 NRF24L01 wireless communication multipoint measurement.

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Analysis of Temperature Field of Embedded multi-chip module

Analysis of Temperature Field of Embedded Multi-Chip Module

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12th International conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)

作者： Huang Chunyue Wang Bin Li Tianming Wei Hegeng Guilin Univ Elect Technol Sch Electromech Engn Guilin 541004 Peoples R China Guilin Coll Aerosp Technol Dept Automobile & Power Engn Guilin 541004 Peoples R China

ISBN: (纸本)9781457717680

For the Embedded multi-chip module, the placement of the chip directly affects the internal temperature distribution, thereby affecting the reliability. In this paper, taking Embedded multi-chip module as the research object, using ANSYS software to establish embedded type MCM model, performing finite element analysis of Embedded multi-chip module temperature field under the condition of different substrates, different air convection coefficient and the use of heat sink, obtaining temperature distribution of Embedded-type MCM. The results show that different substrates and different air convection coefficient will affect the chip temperature distribution;using heat sink can significantly reduce the chip temperature.

关键词： Finite element methods Heat sinks Layout Substrates Temperature distribution Thermal analysis Thermal conductivity

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Ka-band I/Q modulator multi-chip module for high data rate communications

Ka-band I/Q modulator multi-chip module for high data rate c...

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2011 ieee Aerospace conference, AERO 2011

作者： Sharma, Avinash Angert, Matthew P. Treadway, Jacob P. Cheng, Sheng Malouf, Perry Lehtonen, John 11100 Johns Hopkins Road Laurel MD 20723 United States

ISBN: (纸本)9781424473502

This paper describes the development and test results of a flight qualified, hermetic I/Q modulator multi-chip module (MCM) with X-band input and Ka-band output for either Tracking and Data Relay Satellite System (TDRSS) or Deep Space Network (DSN) high data rate communications applications. The module is 0.9'' wide by 1.7'' long without the attachable coaxial connector. It draws

关键词： Monolithic microwave integrated circuits

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Process Development of multi-layer Stacked chip module

Process Development of Multi-layer Stacked Chip Module

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12th International conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)

作者： Ma, Shenglin Sun, Xin Zhu, Yunhui Kang, Wenping Cui, Qinghu Miao, Min Chen, Jin Jin, Yufeng Peking Univ Natl Key Lab Micro Nano Fabricat Technol Beijing 100871 Peoples R China Peking Univ Shenzhen Grad Sch Shenzhen 518055 Peoples R China Beijing Informat Sci & Technol Univ Inst Informat Microsyst Beijing 100085 Peoples R China

ISBN: (纸本)9781457717680

In this paper, at first electroplating of copper and tin is optimized to fabricate micro-bump. chip-to-chip bonding process is developed. Then, a temporary bonding process is developed and verified by experiment. And finally, a process for manufacturing multiple layer stacked chip module is designed and prototype of a 4 layer stacked chip module is fabricated successfully.

关键词： Bonding Copper Packaging Silicon Stacking Through-silicon vias Tin

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Design of multi-channel signal acquisition module for separate storage

Design of multi-channel signal acquisition module for separa...

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2011 International conference on Electronic and Mechanical Engineering and Information Technology, EMEIT 2011

作者： Zhang, Huixin Hu, Xiaobin Liu, Suhua Yang, Haiguang National Key Laboratory for Electronic Measurement Technology North University of China Taiyuan 030051 China Key Laboratory of Instrumentation Science and Dynamic Measurement Ministry of Education North University of China Taiyuan 030051 China

ISBN: (纸本)9781612840857

To achieve multi-channel acquisition of the signals with different sampling rates, the authors of this paper design a multi-channel signal acquisition module with field programmable gate array (FPGA) as the core. This module adopts FPGA chip as core controller of the system, for the purpose of controlling A/D converter, multi-channel analog switch gating, signal acquisition and compiled frame and storage of data. This design is flexible, easy to control, of high reliability, and has been validated by tests. © 2011 ieee.

关键词： Digital storage

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Thermal analysis of multi-chip module high power LED packaging

Thermal analysis of multi-chip module high power LED packagi...

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2011 12th International conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011

作者： Kailin, Pan Guotao, Ren Peng, Li Peng, Huang School of Mechanical and Electrical Engineering Guilin University of Electronic Technology No.1 Jinii Road Guilin 541004 China

ISBN: (纸本)9781457717680

Thermal management of multi-chip module high power LED (MCM-LED) packaging is one key technology to the development of the reliable MCM-LED. In this paper, referring to MCM technology applied in IC packaging, and aiming at high power flip chip GaN-based LED packaging, the thermal analysis of MCM-LED is studied. Firstly, both a 22 flip chip LED array that is mounted on a bracket and heat dissipation packaging structure with the performance parameters of related materials are designed. Secondly, based on principle of heat transfer, the thermal resistance network of MCM-LED heat dissipation system is expressed, and the thermal resistance of cooling channel is theoretically calculated. The total thermal resistance and the junction temperature of LED chip of theoretical value are about 6.53 K/W and 77.2°C respectively. Thirdly, based on numerical analysis method, a 3-D finite element model (FEM) is developed. The temperature distribution in the chips and packages are shown, and junction temperature and total thermal resistance of simulative value are 82.12°Cand 7.14 K/W respectively. Finally, by means of orthogonal design of experiments, the optimized prototype structure and its related parameters are concluded. Aiming at the related material and structure parameters of MCM-LED packaging, the diameter of bump is the most important factor to thermal performance, following by the bonding layer material, chip size, the thickness of bonding layer and chip spacing. © 2011 ieee.

关键词： Heat resistance

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X-band T/R module based on GaN MMICs power amplifier

X-band T/R module based on GaN MMICs power amplifier

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2011 3rd International Asia-Pacific conference on Synthetic Aperture Radar, APSAR 2011

作者： Zhu, Jun Zhou, Zhipeng Shi, Henian Guo, Qing Yao, Xiaojiang Forth Department of Nanjing Research Institute of Electronics Technology Nanjing Research Institute of Electronics Technology Nanjing China

ISBN: (纸本)9788993246179

In this paper a novel X-band T/R module based on a GaN-HEMT MMICs high power amplifier chain, comprising a driver amplifier (DA) and a high power amplifier (HPA) will be presented. A multifunction chip is integrated in the T/R module to reduce the size and weight. The DC control electronics is designed based on multi-layer low temperature co-fired ceramic (LTCC) technology. Output power level of 43dBm (20W) for the T/R module is measured. © 2011 KIEES.

关键词： III-V semiconductors

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A CMOS ASIC Design for SiPM Arrays

A CMOS ASIC Design for SiPM Arrays

引用

ieee Nuclear Science Symposium/Medical Imaging conference (NSS/MIC)/18th International Workshop on Room-Temperature Semiconductor X-Ray and Gamma-Ray Detectors

作者： Dey, Samrat Banks, Lushon Chen, Shaw-Pin Xu, Wenbin Lewellen, Thomas K. Miyaoka, Robert S. Rudell, Jacques C. Univ Washington Dept Elect Engn Seattle WA 98195 USA Univ Washington Dept Radiol Seattle WA 98105 USA

ISBN: (纸本)9781467301206

Our lab has previously reported on novel board-level readout electronics for an 8x8 silicon photomultiplier (SiPM) array featuring row/column summation technique to reduce the hardware requirements for signal processing. We are taking the next step by implementing a monolithic CMOS chip which is based on the row-column architecture. In addition, this paper explores the option of using diagonal summation as well as calibration to compensate for temperature and process variations. Further description of a timing pickoff signal which aligns all of the positioning (spatial channels) pulses in the array is described. The ASIC design is targeted to be scalable with the detector size and flexible to accommodate detectors from different vendors. This paper focuses on circuit implementation issues associated with the design of the ASIC to interface our Phase II MiCES FPGA board with a SiPM array. Moreover, a discussion is provided for strategies to eventually integrate all the analog and mixed-signal electronics with the SiPM, on either a single-silicon substrate or multi-chip module (MCM).

关键词： Application specific integrated circuits Arrays Assembly CMOS ASIC design CMOS integrated circuits CMOS integrated circuits Cathodes Decoding Hardware MCM PET Phase II MiCES FPGA SiPM array application specific integrated circuits application specific integrated circuits calibration calibration circuit implementation diagonal summation digital signal processing chips field programmable gate arrays field programmable gate arrays mixed-signal electronics monolithic CMOS chip monolithic integrated circuits multichip module photomultipliers positioning pulses positron emission tomography positron emission tomography readout electronics readout electronics row-column architecture row-column summation technique signal processing silicon photomultiplier array silicon radiation detectors single-silicon substrate temperature variation timing pickoff signal

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A High Linearity, Low Noise Amplifier module Integrated With Fail-Safe Bypass Switch for Tower Mounted Amplifier Application

A High Linearity, Low Noise Amplifier Module Integrated With...

引用

6th European Microwave Integrated Circuit conference (EuMIC)

作者： Lee, Hang-Kiong Fuad, Haji-Mokhtar Avago Technol Inc Wireless Semicond Div Bayan Lepas Free Ind Zone George Town 11900 Malaysia

ISBN: (纸本)9782874870231

The paper describes the design and realization of a high linearity, low noise amplifier (LNA) module integrated with fail-safe bypass switch for tower mounted amplifier application. In the LNA mode, the device achieves a very low noise figure of 0.75B while maintaining high return losses of 20dB simultaneously. Biased at low current 5V@ 100mA, the module is capable of delivering input P1dB of 3dBm, input third order interception point (IIP3) of 20dBm, and gain of 15.5dB across an entire design bandwidth of 1.85GHz to 1.98GHz. In the bypass mode, the device offers a very low insertion loss of 0.8dB while achieving at least 55dB isolation between alternate paths to eliminate the possibility of oscillation issue. The MMIC LNA is fabricated in a chip size of 650 x 700um(2) using a proprietary 0.25um E-mode pHEMT technology and is housed in a 7 x 10mm(2) multi-chip-on-board (MCOB) package.

关键词： Low noise amplifier pHEMT MMIC towwer mounted amplifie bypass switch

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