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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

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High-bandwidth data transmission of new transceiver module through optical interconnection

High-bandwidth data transmission of new transceiver module t...

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2011 ieee International 3D Systems Integration conference, 3DIC 2011

作者： Ito, Yuka Terada, Shinsuke Arai, Shinya Choki, Koji Fukushima, Takafumi Koyangi, Mitsumasa Circuitry with Optical Interconnection Business Development Dept. Sumitomo Bakelite Co. Ltd. 20-7 Kiyohara Industrial Park Utsunomiya 321-3231 Japan Tohoku University 6-6-10 Aza-Aoba Aramaki Aoba-ku Sendai 980-8579 Japan

ISBN: (纸本)9781467321891

This paper presents optical interconnection for module-to-module length for high-performance computing system. A new multi-chip transceiver module consisting of optical components, IC chips, flexible printed circuits (FPCs), and a sheet of optical polynorbornene (PNB) waveguides was fabricated by simple packaging processes. Waveguide sheet with micromirrors and the FPCs mounting of O/E devices were completed independently. After that, the waveguide sheet was aligned to optical devices on FPCs passively. Optical loss for waveguide including propagation and micromirror couplings was 3.30 dB. We successfully demonstrate high-bandwidth 100-Gbps (12.5 Gbps/ch x 8 channels) data transmission with the module, on which two 4-channel vertical-cavity surface emitting laser (VCSEL) arrays, one VCSEL driver (VD), two 4-channel PD arrays, and one transimpedance amplifier/limiting amplifier (TIA/LA) were mounted. © 2011 ieee.

关键词： Waveguides

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Diagnosis design based on KWP2000 in body control module

Diagnosis design based on KWP2000 in body control module

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International conference on Measuring Technology and Mechatronics Automation

作者： Sun, Bin Hu, Yue-Li Wang, Kun Key Laboratory of Advanced Display and System Applications Ministry of Education Shanghai University Shanghai 700072 China College of Mechanical and Electronic Engineering and Automation Shanghai Key Laboratory of Power Station Automation Technology Shanghai 700072 China

ISBN: (纸本)9780769542966

This article describes the KWP2000 protocol interface design in the body control module and the related information acquisition mode in vehicle body control module, using the MC33972 chip to multi-sample analog signal. The fault diagnosis will be known through KWP2000 bus according the sampling data after MCU judge error. The technology described in this article can be widely used in the design of vehicle electrical equipment.

关键词： Fault detection

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Thermal Analysis of multi-chip module High Power LED Packaging

Thermal Analysis of Multi-chip Module High Power LED Packagi...

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12th International conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP)

作者： Pan Kailin Ren Guotao Li Peng Huang Peng Guilin Univ Elect Technol Sch Mech & Elect Engn Guilin 541004 Peoples R China

ISBN: (纸本)9781457717680

Thermal management of multi-chip module high power LED (MCM-LED) packaging is one key technology to the development of the reliable MCM-LED. In this paper, referring to MCM technology applied in IC packaging, and aiming at high power flip chip GaN-based LED packaging, the thermal analysis of MCM-LED is studied. Firstly, both a 2x2 flip chip LED array that is mounted on a bracket and heat dissipation packaging structure with the performance parameters of related materials are designed. Secondly, based on principle of heat transfer, the thermal resistance network of MCM-LED heat dissipation system is expressed, and the thermal resistance of cooling channel is theoretically calculated. The total thermal resistance and the junction temperature of LED chip of theoretical value are about 6.53 K/W and 77.2 degrees C respectively. Thirdly, based on numerical analysis method, a 3-D finite element model (FEM) is developed. The temperature distribution in the chips and packages are shown, and junction temperature and total thermal resistance of simulative value are 82.12 degrees C and 7.14 K/W respectively. Finally, by means of orthogonal design of experiments, the optimized prototype structure and its related parameters are concluded. Aiming at the related material and structure parameters of MCM-LED packaging, the diameter of bump is the most important factor to thermal performance, following by the bonding layer material, chip size, the thickness of bonding layer and chip spacing.

关键词： Thermal resistance Light emitting diodes Packaging Electronic packaging thermal management Thermal analysis Materials

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2×2 MIMO, multi-mode, wideband transceiver system for worldwide m-WiMAX (ieee 802.16e) / WLAN (ieee 802.11n) applications

2×2 MIMO, multi-mode, wideband transceiver system for world...

引用

International Solid-State Sensors, Actuators and Microsystems conference

作者： Chun, K. Kang, S. Jang, Y. Kim, Y.E. Lee, J. Song, I.S. Yi, J.H. Kim, B.H. Lee, B. Kim, H.C. ISRC Department of Electrical Engineering and Computer Science Seoul National University Seoul Korea Republic of Samsung Electronics Co. LTD. Kyunggi-do Korea Republic of Future Communications IC Inc. Kyunggi-Do Korea Republic of Yujeong Systems Co. Seoul Korea Republic of Department of Electronics Engineering Catholic University of Daegu Gyeongbuk Korea Republic of Department of Mechatronics Engineering Korea University of Technology and Education Chungnam Korea Republic of Department of Electrical Engineering University of Ulsan Ulsan Korea Republic of

ISBN: (纸本)9781457701573

A 2×2 MIMO(multi-input multi-output) for m-WiMAX (ieee 802.16e) / WLAN (ieee 802.11n), multi-mode / wideband transceiver system was developed. To design the transceiver system, the RF architecture was redesigned for the overall system, and a MIMO antenna, quad-band switchable front-end module (FEM), and reconfigurable RFIC were developed. Using embedded PCB technology, the transceiver system was integrated. The system is multi-mode / multi-band based on a RF chain and MIMO type using a tunable single RFIC and multiple FEM. In this paper, a developed chip set was examined. Then, a multi-mode / multi-band RF transceiver system was developed and tested using a 2.3 GHz air signal. © 2011 ieee.

关键词： Antennas

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Hardware module reuse and runtime assembly for dynamic management of reconfigurable resources

Hardware module reuse and runtime assembly for dynamic manag...

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2011 International conference on Field-Programmable Technology, FPT 2011

作者： Jara-Berrocal, Abelardo Gordon-Ross, Ann Department of Electrical and Computer Engineering University of Florida Gainesville FL 32611 United States

ISBN: (纸本)9781457717406

Partial reconfiguration (PR) enhances traditional FPGA-based systems-on-a-chip (SoCs) by providing benefits such as reduced area requirements and increased system flexibility. In multi-application PR SoCs, a dynamic resource manager (DRM) must efficiently orchestrate PR hardware resource management (access to and sharing of PR resources) in order to minimize the percentage of wasted/unused PR resources and reconfiguration time overhead. In this paper, we present DRM software that leverages two techniques, hardware module reuse and dynamic inter-module communication, to reduce wasted/unused PR hardware resources by 13% and reduce reconfiguration time by 33% as compared to a DRM without these techniques. © 2011 ieee.

关键词： Field programmable gate arrays (FPGA)

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Thin-core MCM Assembly Development for High-performance Server Microprocessor

Thin-core MCM Assembly Development for High-performance Serv...

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ieee 61st Electronic Components and Technology conference (ECTC)

作者： Too, Sean S. Khan, Mohammad Lim, Kevin Loo, Mike Lau, W. C. Nayan, Azlina Ng, S. F. Peh, B. L. Goh, Edwin Adv Micro Devices Inc 1 AMD PlPOB 3453MS103 Sunnyvale CA 94088 USA Adv Micro Devices Export Sdn Bhd George Town Malaysia Adv Micro Devices Singapore Pte Ltd Singapore Singapore

ISBN: (纸本)9781612844985

In response to ever-increasing demand for computing power, a high-end server microprocessor with two silicon die in a multi-chip module (MCM) package was planned. For the MCM microprocessor to work optimally, the two large silicon die (each with more than 10,000 C4 bumps) need to communicate efficiently with each other. This requires many copper routing traces in the organic substrate. To accommodate the high quantity of routing traces, fine-pitch PTH package construction is necessary. Thin-core substrate was selected to enable fine-pitch PTH in the substrate with the added benefit of electrical signal integrity. A large (42.5 mm x 60.0 mm) organic MCM package with thin-core (400 microns thick) construction was therefore selected. The large thin-core bare substrate has very high and non-uniform warpage, up to 400 microns at room temperature. Each MCM substrate warps in different directions. This has created major flip-chip assembly challenges. Among the challenges are non-contact and partial joint formation, especially at die edges or die corners. Comprehensive shadow moire and high-temperature warpage analysis were carried out to characterize the bare substrate warpage throughout the reflow temperature range. Shadow moire analysis shows the substrate warpage changes significantly with temperature. To overcome this problem, an innovative assembly process and fixture were developed to ensure substrate flatness. To meet the lead-free packaging roadmap, it was decided to launch this MCM server microprocessor with lead-free C4 solder. Lead-free C4 solder has a separate set of assembly challenges. Lead-free solder is harder and less ductile, so creeps less after C4 joint formation. This results in higher die and package warpage. High die warpage indicates higher stress in the die, which becomes more prone to die crack. Higher warpage also increases the difficulty of the subsequent process of attaching a lid with indium thermal interface material (TIM). A comprehensive st

关键词： Assembly In Joints Lead Routing Silicon SnPb Substrates copper routing traces electrical signal integrity fine-pitch PTH package construction fine-pitch technology flip-chip assembly flip-chip devices high-performance server microprocessor high-temperature warpage analysis indium indium thermal interface material innovative assembly processes lead alloys lead-free C4 solder lead-free packaging roadmap microassembling microprocessor chips multichip module package multichip modules network servers reflow temperature range shadow moireÌ analysis silicon die solders substrate warpage temperature 293 K to 298 K thin-core MCM assembly development thin-core substrate tin alloys

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Technology developments for a scalable heterodyne MMIC array at W-band

Technology developments for a scalable heterodyne MMIC array...

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41st European Microwave conference (EuMC)

作者： Sieth, Matthew Church, Sarah Lau, Judy M. Voll, Patricia Gaier, Todd Kangaslahti, Pekka Samoska, Lorene Soria, Mary Cleary, Kieran Gawande, Rohit Readhead, Anthony C. S. Reeves, Rodrigo Harris, Andrew Neilson, Jeffrey Tantawi, Sami Van Winkle, Dan Stanford Univ Dept Phys 382 Via Pueblo Mall Stanford CA 94305 USA Kavli Inst Particle Astrophys & Cosmol Stanford CA 94309 USA CALTECH Jet Prop Lab Pasadena CA 91109 USA CALTECH Dept Astron Pasadena CA 91125 USA Univ Maryland Dept Astron College Pk MD 20742 USA SLAC Natl Accelerator Lab Menlo Pk CA 94025 USA

ISBN: (纸本)9782874870224

We report on the development of W-band (75-110 GHz) heterodyne receiver technology for large-format astronomical arrays. The receiver system is designed to be both mass-producible, so that the designs could be scaled to thousands of receiver elements, and modular. Most of the receiver functionality is integrated into compact Monolithic Microwave Integrated Circuit (MMIC) amplifier-based multichip modules. The MMIC modules include a chain of InP MMIC low-noise amplifiers, coupled-line bandpass filters and sub-harmonic Schottky diode mixers. The receiver signals will be routed to and from the MMIC modules on a multilayer high frequency laminate, which includes splitters, amplifiers, and frequency doublers. A prototype MMIC module has exhibited a band-averaged noise temperature of 41 K from 82-100 GHz and a gain of 29 dB at 15 K, which is the stateof-the-art for heterodyne multi-chip modules.

关键词： Microwave radiometry multichip module MMICs Millimeter wave technology

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Ka-band I/Q modulator multi-chip module for high data rate communications

Ka-band I/Q modulator Multi-Chip Module for high data rate c...

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ieee conference on Aerospace

作者： Avinash Sharma Matthew P. Angert Jacob P. Treadway Sheng Cheng Perry Malouf John Lehtonen Applied Physics Laboratory (JHU/APL) Johns Hopkins University Laurel MD USA

This paper describes the development and test results of a flight qualified, hermetic I/Q modulator multi-chip module (MCM) with X-band input and Ka-band output for either Tracking and Data Relay Satellite System (TDRSS) or Deep Space Network (DSN) high data rate communications applications. The module is 0.9" wide by 1.7" long without the attachable coaxial connector. It draws

关键词： MMICs Frequency modulation Substrates Temperature measurement Cavity resonators Band pass filters

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An Implementation Study of the AODV Routing Protocol in Windows CE

An Implementation Study of the AODV Routing Protocol in Wind...

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2011 International conference on Intelligent Computing and Integrated Systems(ICISS 2011)

作者： Jie Liu School of Computer and Software Guilin University of Electronic Technology Guilin China Ting-lei Huang School of Computer and Software Guilin University of Electronic Technology Guilin China

This paper chose the WM-G-MR-09 chip, designed and implemented WiFi communication module, set up a real mobile network environment base on Windows CE operating system platforms and ieee 802.1lb wireless network *** AODV (Ad-Hoc on-demand Distance Vector) routing algorithm module by calling the API in an adding routing function module. The validation and testing for the algorithm module show that: The AODV routing protocols, not only work in one hop communication range with good performance, but also in the multi-hop communications. The implementation of routing protocols provides a common practical framework for other ondemand Ad-Hoc network routing protocols.

关键词： component formatting style styling insert

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Wireless signal arbitration system based on microcontroller

Wireless signal arbitration system based on microcontroller

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2011 ieee International conference on Computer Science and Automation Engineering(CSAE 2011)

作者： CAO Rui School of Computer and Communication Engineering Zhengzhou University of Light Industry Zhengzhou, China

Signal arbitration requests system to determine multi-signal's priority based on their input time. Controlled by microcontroller, the wireless signal arbitration system is composed of encoder and decoder chip, wireless transmitter and wireless receiver circuits. Compared with the traditional all-hardware circuits (priority encoder, decoder and the trigger) that constitute the control system, wireless technology makes this system stable and convenient. The thoughts of the whole system design are given. The structure and design of transmission unit are described. The usage and problems of the encoder and the radio frequency transmitter module that should be paid attention to when using are introduced. Receiving cell which is composed of decoder and the radio frequency receiver module is presented. The single chip processing unit is referred to and the program flow chart of the microcontroller, as well as the control procedure is given. Experiments show that the system is easy to be realized and is flexible to be expanded according to actual needs.

关键词： signal arbitration wireless technology microcontroller

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