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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是321-330 订阅

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Thermal-mechanical modelling of power electronic module packaging

Thermal-mechanical modelling of power electronic module pack...

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8th International conference on Thermal, Mechanical and multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

作者： Lu, Hua Tilford, Tim Xue, Xiangdong Bailey, Chris Univ Greenwich Sch Comp Math Sci 30 Pk Row Greenwich SE10 9LS England

ISBN: (纸本)9781424411054

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method.

关键词： Power electronics

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6th International ieee conference on Polymers and Adhesives in Microelecronics and Photonics, Polytronic 2007, Proceedings

6th International IEEE Conference on Polymers and Adhesives ...

引用

Polytronic 2007 - 6th International ieee conference on Polymers and Adhesives in Microelectronics and Photonics

ISBN: (纸本)1424411866

The proceedings contain 64 papers. The topics discussed include: printed organic transistors for low-cost tagging and sensing applications;printed organic transistors for large-area electronics;printed touch sensor for interactive packaging and display;recent progress in organic light-emitting devices;commercialization of MEMS and Nano manufacturing;multi chip module (MCM) design for packaging of a MEMS pressure sensor;conductive adhesives: alternative to high temperature solders and the future;silicon wafer bonding by modified surface activated bonding methods;effect of SAB process on GaN surfaces for low temperature bonding;metallization of Cu on parylene-C film micro-patterned by hot-embossing;and a novel method for the fabrication of 3D-wiring within a nanoporous membrane for high-density circuit substrates.

关键词： Temperature

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multi chip module (MCM) design for packaging of a MEMS pressure sensor

Multi chip module (MCM) design for packaging of a MEMS press...

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Polytronic 2007 - 6th International ieee conference on Polymers and Adhesives in Microelectronics and Photonics

作者： Mohan, Ashwin Malshe, Ajay P. Sriram, B. Natarajan, K. Mohan, S. Department of Mechanical Engineering University of Arkansas Bharat Electronics Limited Bangalore India Indian Institute of Science Bangalore India

ISBN: (纸本)1424411866

This research describes design and development of an MCM MEMS pressure sensor package. The low profile (0-50 psia) packaged module contained the silicon MEMS pressure sensor die designed based upon piezoresistive principle and had footprint of 2.3 mm x 2.3 mm with a thickness of 0.5 mm. The sensor was integrated with an application specification integrated circuit (ASIC) chip (MAX 1452 from MAXIM) in an MCM configuration designed on a 75 μm polymer substrate (Upilex). The flex substrate was first passivated with 4 μm layer of BCB followed by Ti-Cu-Ti sputtering and selective electroplating of Ni and Au to define the required conductor pattern. The electrical connections from the sensor and ASIC chips to the flex circuitry were performed by thermosonic wire bonding. The wire bonds were secured in place by a glob top encapsulant. Ribbon cables having conductor size of 36 AWG served as input-output (I/O) connections from the package to the outside environment. The I/O cables were solder attached on to the flex circuitry and eventually encapsulated with an electrically non-conducting epoxy, thereby ensuring a strong mechanical joint. The cable attached flex circuitry loaded with sensor and ASIC dies were attached to a custom machined metal base using a suitable epoxy. Finally, the whole package was adhesively capped using a meshed lid. The final package had an outside diameter of 8 mm and a total height of 1 mm. This package can be implemented in a range of applications from aerospace to biomedical environments. Reliability tests (thermal shock and temperature cycling) were performed on the packaged devices. The stressed sensor package revealed excellent robustness with no signs of physical damage. As part of initial qualification on the packaged module to test its electrical functionality characteristics, units packaged with only the 'sensor' device were subjected to controlled pressure conditions. The output result showed perfect linear response of voltage in accordan

关键词： Substrates

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RadHard 16Mbit SRAM Packaged in a Cantilever Die multi-chip module

RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip ...

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ieee conference on Aerospace

作者： Craig Hafer Jonathan Mabra Duane Slocum Sean Thorne Aeroflex Colorado Springs Inc. Colorado Springs CO USA

Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.

关键词： Random access memory Packaging Bonding Springs Stacking Wire Assembly Plasma applications Power supplies Aluminum

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A VME module for a fast readout of the monolithics analog front-end chips

A VME module for a fast readout of the monolithics analog fr...

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ieee Symposium on Nuclear Science (NSS/MIC)

作者： C. Boiano A. Guglielmetti M. Romoli INFN sez. Milano ITALY Milano University and INFN sez. Milano ITALY INFN sez. Napoli Italy

A single-slot VME card has been developed to digitalize the multiplexed analogue signals coining out from the analog front-end chips (VA32HDR14.2) used in the EXOTIC experiment. The module has 8 differential channels each one sample by 50 MHz 12-bit ADCs. Other features of the ADC card are the use of a sliding-scale technique to improve the differential linearity, the pedestal individually subtracted for each chip channel, a zero suppression with individual threshold, a multi event storage capability (up to 256) , a programmable number of chips connected in chain, 8 trigger levels to manage different operations and a Test-Mode functionality to manage and control the VA32HDR14.2 chip.

关键词： Finite impulse response filter Detectors Testing Strips Circuits multiplexing Logic Signal generators Frequency Buffer storage

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Experimental Results of a 7-channel Spectroscopy Detector module with Mega-Count Rate Capability

Experimental Results of a 7-channel Spectroscopy Detector Mo...

引用

2007 ieee Nuclear Science Symposium conference, vol.4

作者： C. Reckleben K. Hansen I. Diehl H. Klar E. Welter Deutsches Electronen Synchrotron DESY Hamburg Germany

A compact detector module based on Si-drift detectors with integrated junction-field effect transistors has been developed. It has been set up for X-ray absorption spectroscopy and X-ray standing-wave technique, and is usable in vacuum environment. The modules' hexagonal shape with a wrench size of 16 mm allows small distances to the samples and a compact multi-module arrangement. The monolithic 7-cell sensor has an active area of ～50 mm{sup}2 and a thickness of 450 μm. It provides a spectral resolution of some hundred eV in the soft X-ray regime at room temperature. A fully differential 7-channel BiCMOS readout chip has been developed to process the detector signals at a power dissipation of 15 mW per channel. First spectral measurements with energies up to 43 keV have been performed with the prototype module. A rate-dependent energy-peak shift remains below 3% at integral photon-count rates of more than 6 Mcts/s. The deviation from the linear regression is within ±2% in the energy range between 6 and 20 keV. The on-chip gain variations are below 3.4%.

关键词： Spectroscopy Detectors Electromagnetic wave absorption Vacuum technology Shape Signal resolution Temperature sensors BiCMOS integrated circuits Signal processing Signal detection

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multi chip module (MCM) Design for Packaging of a MEMS Pressure Sensor

Multi Chip Module (MCM) Design for Packaging of a MEMS Press...

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ieee conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC)

作者： Ashwin Mohan Ajay P. Malshe B. Sriram K. Natarajan S. Mohan Department of Mechanical Engineering University of Arkansas USA Department of Mechanical Engineering University of Arkansas Bharat Electronics Limited Bangalore India Indian Institute of Science Bangalore India

This research describes design and development of an MCM MEMS pressure sensor package. The low profile (0-50 psia) packaged module contained the silicon MEMS pressure sensor die designed based upon piezoresistive principle and had footprint of 2.3 mm times 2.3 mm with a thickness of 0.5 mm. The sensor was integrated with an application specification integrated circuit (ASIC) chip (MAX 1452 ™ from MAXIM ® ) in an MCM configuration designed on a 75 μm polymer substrate (Upilex ™ ). The flex substrate was first passivated with 4 μm layer of BCB followed by Ti-Cu-Ti sputtering and selective electroplating of Ni and Au to define the required conductor pattern. The electrical connections from the sensor and ASIC chips to the flex circuitry were performed by thermosonic wire bonding. The wire bonds were secured in place by a glob top encapsulant. Ribbon cables having conductor size of 36 AWG served as input-output (I/O) connections from the package to the outside environment. The I/O cables were solder attached on to the flex circuitry and eventually encapsulated with an electrically non-conducting epoxy, thereby ensuring a strong mechanical joint. The cable attached flex circuitry loaded with sensor and ASIC dies were attached to a custom machined metal base using a suitable epoxy. Finally, the whole package was adhesively capped using a meshed lid. The final package had an outside diameter of 8 mm and a total height of 1 mm. This package can be implemented in a range of applications from aerospace to biomedical environments. Reliability tests (thermal shock and temperature cycling) were performed on the packaged devices. The stressed sensor package revealed excellent robustness with no signs of physical damage. As part of initial qualification on the packaged module to test its electrical functionality characteristics, units packaged with only the 'sensor' device were subjected to controlled pressure conditions. The output result showed perfect linear response of voltag

关键词： Micromechanical devices Application specific integrated circuits Sensor phenomena and characterization Packaging machines Flexible printed circuits Cables Integrated circuit packaging Conductors Wire Aerospace testing

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Design for efficiency improvement and future prediction in multi chip module for DC-DC converter

Design for efficiency improvement and future prediction in m...

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37th ieee Power Electronics Specialist conference (PESC 2006)

作者： Kawaguchi, Yusuke Nakagawa, Akio Kawano, Tomohiro Takei, Hiroshi Ono, Syotaro Toshiba Co Ltd Semicond Co Discrete Semicond Div Saiwai Ku 1 Komukai Toshiba Cho Kawasaki Kanagawa 2128583 Japan

ISBN: (纸本)9780780397163

We present the importance of all the parasitic inductance of the main current path. In order to reduce this parasitic inductance, we adopted new multi chip module (MCM). The MCM has successfully improved the conversion efficiency because of its minimum parasitic inductances. We also introduced new figure of merit (FOM), RonQstr, corresponding to reduction of parasitic LCR. The value of new FOM of conventional trench MOSFET is favorable and efficiency is expected to be reduced by parasitic LCR.

关键词： MOSFET Inductance Logic gates DC-DC power converters Power demand Resistance Switches

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Four-degree hub switch module using multi-chip planar lightwave circuit integration technology for transparent ROADM ring interconnection

Four-degree hub switch module using multi-chip planar lightw...

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conference on Optical Fiber Communications/National Fiber Optic Engineers conference

作者： Goh, T. Ishii, M. Mizuno, T. Kamei, S. Ogawa, I. Hirota, H. Tamura, Y. Kobayashi, M. Yanagisawa, M. Sohma, S. Kaneko, A. NTTCorp NTT Photon Labs Kanagawa 2430198 Japan

ISBN: (纸本)9781557528032

We have developed a PLC-based 32-wavelength 4-degree hub switch module, which consists of a broadcast coupler with a demultiplexer for local-drop, and a WSS with wavelength specific ports for local-add. The module size is 220x135x14 mm. The insertion loss of the express path in the WSS is 10.8 dB. (C)2006 Optical Society of America.

关键词： Optical switches

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Study on interconnect test generation of MCM based on particle swarm optimization algorithm

Study on interconnect test generation of MCM based on partic...

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7th International conference on Electronics Packaging Technology

作者： Lei, Chen Guilin Univ Elect Technol Dept Comp Sci Guilin 541004 Guangxi Peoples R China

ISBN: (纸本)9781424406197

With rapid development of very large scale integration (VLSI), multi-chip module (MCM) and multi-layer Printed Circuit Boards (MPCB), interconnect test technology has become a bottleneck in the application of these circuits. This paper presents a novel optimized approach based on particle swarm optimization (PSO) algorithm for MCM interconnect test generation. By combing the characteristics of interconnect test and constructing particle expression of test generation, the velocity updating equation and position updating equation of discrete PSO is designed for MCM in this paper. The optimized search is guided by the swarm intelligent generated from cooperation and competition among particles of swarm. The experimental results for benchmark circuits show that the proposed algorithm can achieve compact test set, high fault coverage and short CPU time when compared to other interconnect test generation algorithms.

关键词： MCM (multi-chip module) interconnect test Particle swarm optimization test generation

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