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55th Electronic Components and Technology conference, ECTC

作者： Kim, Jinbum Noquil, Jonathan A. Tan, Teik Keng Wu, Chung-Lin Choi, Seung-Yong Package Knowledge Center Fairchild Semiconductor Corporation 82-3 Dodang-dong Buchoen-si Gyunggi-do 420-711 Korea Republic of Fairchild Semiconductor Philippines Fairchild Semiconductor Malaysia Fairchild Semiconductor San Jose

Miniaturization reduces package size, cost and board space. System on chip (SoC) integrates a system on a common silicon substrate, however there are some shortcomings with this approach such as high manufacturing cost. Handling of different levels of voltage and current on a common silicon substrate with controller IC operating in the range of several volts and milliamps, while power MosFETs at over hundreds of volts and more dozens of amps can also pose as an issue. Nevertheless, module packages having controller IC and power MosFET co-packaged are new. Fairchild semiconductor's advancement in packaging has eliminated these drawbacks with the introduction of multi-flip chip on lead frame over-molded IC package [1]. This new package has a novel packaging concept that uses multi-flip chip technology on the power devices combined with controller IC employing wire bonding technique on one copper lead frame based substrate. The gate and source in power MosFETs are bumped and attached to the copper lead frame by flip chip bonding technology and are routed out of package by solder balls while the drain exposed at the bottom of the package is soldered directly to the board. This is a BGA package with exposed die back for drain. The paper describes the construction of multi-flip chip on lead frame over molded package in Fairchild semiconductor, its cost effective package designs and manufacturing challenges. © 2005 ieee.

关键词： Flip chip devices

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The design of miniature 3D RF module

The design of miniature 3D RF module

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55th Electronic Components and Technology conference

作者： Lähteenmäki, J Miettinen, J Heino, P Tampere Univ Technol Inst Elect FIN-33101 Tampere Finland

ISBN: (纸本)0780389069

High-density packaging has become an important driver for new portable electronics. Miniature discrete components, flip-chip bonding of ICs and thin multi-layer substrates are essentials for a small product. Further size reduction can be achieved with the integration of various passives, and modem covers with metal plated wiring can act as a substrate for the device. A 3D System-in-Package (SiP) combines different chips and techniques into a single package without compromising individual semiconductor technologies. The driving force is the ability to construct complex, yet portable devices cost effectively and with high yield. A miniature 3D Sip short-range RF module operating in the unlicensed 2.4 GHz band was designed and manufactured. This paper introduces the module and discusses the steps required in designing, testing, and assembling of such complicated systems. Electrical design must meet the criteria set by system functionality, thermal behavior, testing environment, and manufacturing facilities. This work continues the research of the stacked 3D packaging technique developed in the Institute of Electronics at Tampere University of Technology. It utilizes thin high-density interconnect (HDI) printed wire board (PWB) interposers and flip-chip bonding of thinned chips. Interposers are stacked and bonded using solder plated polymer spheres.

关键词： Logic design

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Integrated millimeter/submillimeter superconducting digital spectrometer

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ieee TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY 2005年第2期15卷 419-422页

作者： Vernik, IV Kirichenko, DE Sarwana, S Brock, DK Hypres Inc Elmsford NY 10523 USA

Compact mm/submm integrated spectrometers are required for radio-astronomical research, remote monitoring of the Earth atmosphere and environmental monitoring for hazardous materials of chemical and biological origin. Assembled on a multi-chip module the all superconducting integrated spectrometer offers integration of thin film analog components such as a mixer, superconducting local oscillator and an intermediate frequency SQUID amplifier together with superconducting digital circuitry. A Rapid Single Flux Quantum (RSFQ) 128-bit autocorrelator formed by 16-bit autocorrelator and a 112-bit programmable shift register that adjusts the data delay in increments of 16, is used for digitizing of the down converted signals and real-time digital processing. Experimental results showing both operation of components and the way to their successful integration are presented.

关键词： compact and sensitive spectrometer multichip module remote monitoring superconductor digital electronics

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Integrated millimeter/submillimeter superconducting digital spectrometer

Integrated millimeter/submillimeter superconducting digital ...

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2004 Applied Superconductivity conference

作者： Vernik, IV Kirichenko, DE Sarwana, S Brock, DK Hypres Inc Elmsford NY 10523 USA

关键词： compact and sensitive spectrometer multichip module remote monitoring superconductor digital electronics

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Wafer-level integration technology of surface mount devices using automatic parts alignment technology with vibration

Wafer-level integration technology of surface mount devices ...

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13th International conference on Solid-State Sensors, Actuators and Microsystems

作者： Sudou, M Takao, H Sawada, K Ishida, M Seiko Instruments Inc. Japan Toyohashi University of Technology Japan

ISBN: (纸本)0780389948

This paper presents a new wafer-level integration technology of discrete surface mount devices (SMDs) on silicon-wafers. It is automatic parts alignment on silicon-wafer by means of gravity force and vibration. After silicon IC process, deep holes were formed by Deep Reactive Ion Etching (DRIE) process to arrange SMDs. Then a non-conductivity adhesive was spin coated and removed it on the silicon-wafer surface leaving the adhesive at the bottom of the holes. We fixed the silicon-wafer diagonally to a vibration generator and distribute SMDs on it. By vibrating the silicon-wafer, SMDs go down to the lower side occupying the holes automatically. As a result, two different sizes of SMDs were successfully mounted into every hole on silicon wafer. This technology is promising to integrate various discrete devices on integrated devices with batch process-like productivity.

关键词： surface mount devices deep reactive ion etching multi chip module MEMS

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A multi-chip directly mounted 512 MEMS mirror array module with hermetically sealed package for large optical cross-connects

A multi-chip directly mounted 512 MEMS mirror array module w...

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ieee/LEOS International conference on Optical MEMS

作者： Xiaoyu Mi H. Soneda H. Okuda O. Tsuboi Norinao Kouma Y. Mizuno S. Ueda I. Sawaki Fujitsu Ltd. Akashi Japan Fujitsu Laboratories Ltd. Akashi Japan

A 512 MEMS mirror array module with a hermetically sealed package for large optical cross-connects is constructed by using newly developed multi-chip direct mounting (MCDM) technology and is demonstrated to enable a plusmn5 degree rotation of the two-axis stationary operation under a drive voltage of 160 V, while having a high resonance frequency of 2 kHz

关键词： Optical arrays Micromechanical devices Mirrors Hermetic seals Packaging Wiring Optical crosstalk Actuators Gold Resonance

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Saw singulation characterization on high profile multi chip module packages with thick leadframe

Saw singulation characterization on high profile multi chip ...

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6th Electronics Packaging Technology conference, EPTC 2004

作者： Anuar, Nazrul Taib, Amalina Ulu Kelang FTZ 73 Lorong Enggang 54200 Kuala Lumpur Malaysia

ISBN: (纸本)0780388216

Increasing demand for multi chip module (MCM) Power devices in a Quad Flat Non-leaded (QFN) package outline drives the development of the LFCSPs-P (Lead Frame chip Scale Package-saw-Power). multi chip module offers host benefit including performance improvements such as shorter interconnect lengths between dies, lower power supply inductance and lower off-chip driver. Besides, it can reduce the manufacturing cost and increase the utility of programmable systems [1]. Compared to the leaded package with similar body sizes and lead counts, QFN offers far superior thermal performance and provides excellent electrical characteristics [2]. Package designers used nominal thickness of standard Cu-Alloy leadframe and standard package height meant for power packages with soft solder die attach and heavy Al wire bonding to enhance heat dissipation capability other than the heat sinks. Map type design is used to enhance productivity by maximizing the device density. Singulation is achieved by sawing through the molded leadframe channels with diamond type blades that separated the arrays rows and columns [2]. However, the combination of ductile and brittle material in the same sawing process creates real challenges in term of sawing quality, blade life and throughput. Experiments were carried out and its results show that integration of the blade type, parameters, methodology and other external features give the maximum result for the said challenges © 2004 ieee.

关键词： Electronics packaging

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A MCM-based microsystem for biological fluids analysis by optical absorption

A MCM-based microsystem for biological fluids analysis by op...

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ieee Sensors 2004 conference

作者： Minas, G Ribeiro, JC de Graaf, G Wolffenbuttel, RF Correia, JH Univ Minho Dept Ind Elect Guimaraes Portugal

ISBN: (纸本)0780386922

This paper presents a MCM (multi-chip-module) microsystem for biological fluids analysis. It is composed of three parts: (1) a CMOS silicon optical detection microsystem which includes a photodetector and a light-to-frequency converter for readout;(2) a dielectric thin-film based optical filter on top of the photodetector fabricated using IC-compatible post-processing;(3) a glass die on top containing the microchannels fabricated using SU-8 techniques. The application is in the low-cost measurement of concentration of biomolecules in biological fluids, by the optical absorption in a part of the visible spectrum defined by the specific molecule. Signals proportional to the intensity of the light transmitted through the biological fluid are available at the output in the form of bit streams, which allows simple computer interfacing. The quantitative measurement of total protein in urine is successfully demonstrated. The photodiode responsivity is 224 mA/W with a FWHM (Full-Width-Half-Maximum) of 10 nm at lambda = 600 nm. The optical system sensitivity is 1 kHz/Wm(-2) at lambda = 670 nm.

关键词： MCM (multi-chip-module) SU-8 techniques biomolecules analysis optical absorption

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Building pixel detector modules in multi chip module deposited technology

Building pixel detector modules in multi chip module deposit...

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2004 Nuclear Science Symposium, Medical Imaging conference, Symposium on Nuclear Power Systems and the 14th International Workshop on Room Temperature Semiconductor X- and Gamma- Ray Detectors

作者： Becks, K.-H. Flick, T. Grab, C. Gerlach, P. Mättig, P. University of Wuppertal Department of Physics

The MCM-D technique has been used to build hybrid pixel detector modules and single chip assemblies with optimized sensor geometry. Results of test measurements in both a laboratory and a test beam environment are giv... 详细信息

关键词： Detectors

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Beyond 80-Gbit/s-throughput monolithically integrated eight-channel WDM modulator module for multi-channel optical transmitter

Beyond 80-Gbit/s-throughput monolithically integrated eight-...

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Optical Fiber Communucation conference (OFC), Postconference Digest

作者： Suzaki, Y. Yasaka, H. Mawatari, H. Yoshino, K. Kawaguchi, Y. Oku, S. Iga, R. Okamoto, H. NTT Photonics Laboratories NTT Corporation 3-1 Morinosato-Wakamiya Atsugi-shi Kanagava Pref. 243-0198 Japan

A 10 Gbit/s × 8 ch WDM modulator module with 50-GHz channel spacing is demonstrated. The module contains only one monolithically integrated WDM modulator chip that is only 15 mm × 7 mm in size.

ISBN: (纸本)1557527725

A 10 Gbit/s × 8 ch WDM modulator module with 50-GHz channel spacing is demonstrated. The module contains only one monolithically integrated WDM modulator chip that is only 15 mm × 7 mm in size.

关键词： Wavelength division multiplexing

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