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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是371-380 订阅

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Thermal Analysis of a multi-chip SI/SIC-Power module for Realization of a Bridge Leg of a 10kW Vienna Rectifier

Thermal Analysis of a Multi-Chip SI/SIC-Power Module for Rea...

引用

The 25th International Telecommunications Energy conference

作者： Drofenik, Uwe Kolar, Johann W. Power Electronic Systems Laboratory ETH Zurich ETH-Zentrum/ETL H12 CH-8092 Zurich Switzerland

For realizing a three-phase 400VAC/800VDC 10kW unity power factor PWM (VIENNA) rectifier system a novel Si/SiC multi-chip power semiconductor modules (IXYS VUM26B) facilitating switching frequencies up to 500kHz is employed. Direct water cooling of the modules base plates does significantly reduce the size of the cooling system. As the heat flow is directly from the power module into the water the cooling system can be realized using non-metal heat sink what does reduce common-mode EMI emissions. In this paper it is shown how the time behavior of the power module semiconductor junction temperatures over a mains period can be calculated with high accuracy by combining simple thermal equivalent circuits and stationary thermal simulations of the cooling system. Furthermore, the determination of the switching losses by circuit simulation based on experimental data is discussed and the power transistor and power diode junction temperatures are investigated for different operating points of the rectifier system.

关键词： Semiconductor device models

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Embedded IC packaging technology for ultra-thin and highly compact RF module.

Embedded IC packaging technology for ultra-thin and highly c...

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53rd Electronic Components and Technology conference

作者： Pinel, S Lee, CH Yoon, SW Nuttinck, S Lim, K Laskar, J Georgia Inst Technol Sch Elect & Comp Engn Yamacraw Design Ctr Atlanta GA 30332 USA

ISBN: (纸本)0780379915

In this paper, we present a novel ultra-compact embedded IC integration approach for System-On-Package (SOP) based solutions for RF and wireless communication applications. This concept is applied to the integration of a Ku band VCO module. The module fabrication is described and the impact of the packaging on the chip-set performances is discussed. The final thickness of the module is the thinnest reported till date and is about only 150 mum. The embedded VCO exhibits an oscillation frequency of 15.4 GHz, a phase noise of -99.2 dBc/Hz at a 1 MHz offset and maximum output power of 10.67 dBm. multi-layer interconnects built with modified MCM-D technology using advanced photosensitive epoxy Intervia(TM)8000 is described. We also present a detailed characterization and modeling of RF inductors. They exhibit a quality factor as high as 800@ 10GHz.

关键词： Electronics packaging

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Proceedings - ieee International SOC conference, SOCC 2003

Proceedings - IEEE International SOC Conference, SOCC 2003

引用

ieee International SOC conference, SOCC 2003

ISBN: (纸本)0780381823

The proceedings contain 106 papers. The topics discussed include: independent clocks for peripheral modules in system-on-chip design;design of an energy-aware system-in-package for playing MP3 in wearable computing devices;an autonomous multiple module clock synchronization methodology for SoC;hardware nested looping of parameterized and embedded DSP core;automatic mismatches calibration in Hartley image-reject receiver;a fully integrated multi-output CMOS frequency synthesizer for channelized receivers;design and implementation of a scalable multimedia processor;module generator of data recovery for serial link receiver;a leakage-tolerant high fan-in dynamic circuit design style;a low-complexity, high-speed Reed-Solomon decoder;and cost-effective delay-insensitive data transfer mechanism using current-mode multiple valued logic.

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Compact receiver module for X-band radar applications

Compact receiver module for X-band radar applications

引用

European conference on Microwave

作者： N. Billstrom Ericsson Microwave Systems AB Molndal Sweden

This paper presents, the design, realization and measured results of a highly integrated multi-chip-module (MCM) developed for X-band radar applications. The MCM is built up in a LTCC substrate. Embedded within the substrate is a bandpass stripline filter. The main functionality is realized by two multi-function MMIC. The MCM is an integral part of a future multi-channel AESA radar system.

关键词： Radar applications MMICs Optical attenuators Optical amplifiers Optical filters Optical receivers Noise figure Integrated circuit yield Degradation Circuit testing

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RF module using MCM-L and BGA technology for 5 GHz WLAN application

RF module using MCM-L and BGA technology for 5 GHz WLAN appl...

引用

European conference on Microwave

作者： S. Hiura M. Ishida T. Kitahara T. Yamamoto Corporate Manufacturing Engineering Centei Toshiba Corporation Yokohama Japan

This paper presents the design concept and experimental results about small size radio frequency (RF) module for 5 GHz wireless local area network (WLAN). Functions of the RF module include from base band input/output to antenna switch. The size is 20 mm/spl times/15 mm/spl times/3 mm and that is minimum size in modules with same functions as far as the authors get to know. For the purpose of small size and low cost, generally known technologies are used. They are multi chip module on laminated-base dielectric substrate (MCM-L) technology, interconnection of each layer using build-up technology, flip chip technology and ball grid array (BGA) technology. Parts and ICs are on both sides of the RF module's substrate and are vertically connected in the substrate. In order to ensure electrical performance at 5 GHz frequency band in the high-density package, transmission line characteristics in the substrate and BGA characteristic are simulated by 3 dimensional (3D) electromagnetic (EM) software. The fabricated RF module is evaluated using the test set up for 5 GHz WLAN application and the result is shown.

关键词： Radio frequency Wireless LAN Dielectric substrates Switches Costs Flip chip Electronics packaging Software packages Transmission lines Software performance

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multichannel optical coupling with an aspherical lens and its application to an all-optical monolithic wavelength converter module

Multichannel optical coupling with an aspherical lens and it...

引用

52nd Electronic Components and Technology conference (ECTC)

作者： Ohki, A Shibata, Y Kikuchi, N Ito, T Okamoto, H Suzuki, Y Ishihara, N NTT Photon Labs Atsugi Kanagawa Japan

ISBN: (纸本)0780374304

We propose a novel multi-channel optical coupling technique called MOCA for the packaging of opto-electronic functional devices whose optical I/O ports are array optical waveguides. MOCA (multichannel optical coupling with an aspherical lens) uses only an aspherical lens to couple an optical waveguide array to an optical fibre array. Inspite of its simplicity configuration, MOCA provides efficint optical coupling for each optical I/O port and high performance for a module reliability. To confirm the performance of MOCA, we applied it to the packaging of an all-optical wavelength converter chip or SIPAS (Sagnac interferometer integrated with parallel amprifiers structure), which will be a key device in near future WDM networks. The fabricated module shows that the coupling loss of each I/O port is less than 3.5 dB and acts as an all optical wavelength converter for 10-Gb/s-RZ optical signal.

关键词： Optical communication

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A voice processing and control module for cable telephony applications

A voice processing and control module for cable telephony ap...

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24th Annual Custom Integrated Circuits conference (CICC 2002)

作者： Nabicht, JT Pitz, JK Siniscalchi, PP Betty, CL Maggiotto, S Richardson, DC DeSoto, S Sridharan, S Vemulapalli, S Downs, K Gata, DG Dweik, AK Guidry, D Muskoff, KD Beckham, B Westphal, GH Texas Instruments Inc Dallas TX 75265 USA

ISBN: (纸本)0780372506

An IF-baseband multi-chip module, fabricated in 3.3V 0.35 mum mixed-signal and 1.8V 0.18 mum digital CMOS, provides OQPSK demodulation with carrier recovery, memory and control, voice-companding CODECs, and SLIC interfaces (SIs) for a CATV telephony distribution system. The die area of the mixed-signal IC is 84.9mm(2) and 15.2mm(2) for the digital IC. The power dissipation is 660mW.

关键词： Telephone systems

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A voice processing and control module for cable telephony applications

A voice processing and control module for cable telephony ap...

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Custom Integrated Circuits conference (CICC)

作者： J.T. Nabicht J.K. Pitz P.P. Siniscalchi C.L. Betty S. Maggiotto D.C. Richardson S. DeSoto S. Sridharan S. Vemulapalli K. Downs D.G. Gata A.K. Dweik D. Guidry K.D. Muskoff B. Beckham G.H. Westphal Texas Instruments Inc. Dallas TX USA

An IF-baseband multi-chip module, fabricated in 3.3V 0.35/spl mu/m mixed-signal and 1.8V 0.18 /spl mu/m digital CMOS provides OQPSK demodulation with carrier recovery, memory and control, voice-companding codecs, and SLIC interfaces (SIs) for a CATV telephony distribution system. The die area of the mixed-signal IC is 84.9mm/sup 2/ and 15.2mm/sup 2/ for the digital IC. The power dissipation is 660mW.

关键词： Process control Communication cables Telephony Application specific integrated circuits Demodulation Baseband Codecs Voltage-controlled oscillators Power cables Filters

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A new test method for embedded passives in high density package substrates

A new test method for embedded passives in high density pack...

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51st Electronic Components and Technology conference (ECTC)

作者： Kim, BC Choi, HH Arizona State Univ Dept Elect Engn Ctr Solid State Elect Res Tempe AZ 85287 USA

ISBN: (纸本)0780370384

This paper presents a new test technique for embedded passives in multi-chip module (MCM) substrates. The technique uses an active circuit to test passive circuits in MCM substrates. The defect can be found with very high sensitivity due to the natural amplification of the op amp circuit used as a test apparatus. The technique is low-cost and can be applied to many different classes of passive filters that are embedded in MCM substrates.

关键词： multi-chip module substrate testing integrated passives analog filters

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A compact multi-chip-module implementation of a multi-precision neural network classifier

A compact multi-chip-module implementation of a multi-precis...

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ieee International Symposium on Circuits and Systems (ISCAS 2001)

作者： Bermak, A. Martinez, D. Sch. of Engineering and Mathematics Edith Cowan University Perth WA 6027 Australia

ISBN: (纸本)0780366859

This paper describes a novel multi-chip module (MCM) digital implementation of a reconfigurable multi-precision neural network classifier. The design is based on a scalable systolic architecture with a user defined topology and arithmetic precision of the neural network. Indeed, the MCM integrates 64/32/16 neurons with a corresponding accuracy of 4/8/16-bits. A prototype has been designed and successfully tested in CMOS 0.7μm technology.

关键词： Neural networks

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