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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是401-410 订阅

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A mixed signal multi-chip module with high speed serial output links for the ATLAS Level-1 trigger

A mixed signal multi-chip module with high speed serial outp...

引用

ieee Symposium on Nuclear Science (NSS/MIC)

作者： U. Pfeiffer Kirchhoff-Institute for Physics University of Heidelberg Germany

We have built and tested a mixed signal multi-chip module (MCM) to be used in the Level-1 Pre-Processor system for the Calorimeter Trigger of the ATLAS experiment at CERN. The MCM performs high speed digital signal processing on four analogue input signals. Results are transmitted serially at a serial data rate of 800 MBd. Nine chips of different technologies are mounted on a four layer Cu substrate. ADC converters and serialiser chips are the major consumers of electrical power on the MCM, which amounts to 9 W for all dies. Special cut-out areas are used to dissipate heat directly to the copper substrate. In this paper we report on design criteria, chosen MCM technology for substrate and die mounting, experiences with the MCM operation and measurement results.

关键词： Signal processing Poles and towers Delay Physics Copper Signal processing algorithms Calorimetry Mesons Packaging System testing

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A low-cost MCM implementation for 100-Hz TV up-conversion 7

A low-cost MCM implementation for 100-Hz TV up-conversion

引用

1998 International conference on multichip modules and High Density Packaging (MCM 98)

作者： Langenkamp, U Menke, M Plan, M Runkel, P Schu, M Stumpf, B Heimgartner, R Schatzler, B Gottinger, R Siemens Inc Prod Dev Image Video Munich Germany

ISBN: (纸本)0780348508

A system-on-chip covering all 100-Hz TV digital signal-processing functions has been implemented as a MCM in a P-MQFP-64 package. The design, architecture, rest concept and special arrangement of two chips assembled together are presented The yield improvement of the larger memory chip achieved by redundancy optimization has led to a profitable product with higher yield and lower costs than previous multi-package solutions. This development was based on state-of-the-art technology, using materials that were as standard as possible and included DFT (design for testability) right from the outset, i.e. sufficient flexibility to test every block of a multi-chip module [1]. The time-to-market requirements were effectively satisfied by implementing the system as a MCM. The rough estimate made here shows that when it comes to implementing future high-performance on-chip systems with advanced logic and memory integration, the obvious choice will be an emergent embedded DRAM technology.

关键词： MCM multi-chip-module 100-Hz TV System chip-to-chip connection system-on-chip inter-block redundancy embedded DRAM

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All silicon multichip module with a fully integrated cooling system 7

All silicon multichip module with a fully integrated cooling...

引用

1998 International conference on multichip modules and High Density Packaging (MCM 98)

作者： Pilchowski, J Holke, A Henderson, HT Harms, TM Kazmierczak, M Gerner, FM Univ Cincinnati Ctr Microelect Sensors & MEMS Dept Elect & Comp Engn & Comp Sc Cincinnati OH 45221 USA

ISBN: (纸本)0780348508

This paper proposes a novel silicon-on-silicon multichip module with an integrated thermal management system. Our module offers a new packaging approach, which allows a great densification of the number of electronic circuits on a common substrate that is almost equivalent to wafer scale integration, yet uses discrete chips. Wet anisotropic etching is used for the separation of silicon integrated circuits as well as for the fabrication of the chip receiving cavities in the MCM substrate. The etching exposes {111} planes in both chip and receiving surface, assuring a virtual perfect mating of the assemblage. The system is complemented with an integrated cooling channel which allows the removal of heat fluxes up to 300 Wcm(-2).

关键词： multichip module MCM thermal management cooling chip separation anisotropic etching

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Advanced MCM-Ls for consumer electronics 2

Advanced MCM-Ls for consumer electronics

引用

2nd 1998 International Electronic Manufacturing Technology / International Microelectronics conference

作者： Amami, K Yuhaku, S Shiraishi, T Bessho, Y Eda, K Ishida, T Matsushita Elect Ind Co Ltd Osaka 5718501 Japan

ISBN: (纸本)0780350901

We have developed an advanced MCM (multi-chip module) using SBB(TM) (stud-bump bonding)flip-chip bonding technique onto an ALIVH(TM) (any lays inner via hole structure) substrate. The SBB technique is an advanced flip-chip bonding technique: for high density MCM, which can mount bare LSI chips directly onto substrates. The structure of the bonding portion is composed of Au bumps having two-stepped construction and conductive adhesives. The conductive adhesive is very flexible in boner: thus relaxing thermal and mechanical stresses. The ALIVH substrate has been done basic development Components Co, Ltd It is a high density and high performance multi-layered printed wiring board with any lays inner via hole structure via hole processing technology using a CO2 laser and interconnection technology that employs conductive paste. We had good results for several reliability tests in the test vehicles of the advanced MCM-Ls. Especially, in the thermal shock test, the increase of connecting resistance in the advanced MCM-Ls was smaller than that of MCM-Ls which used ordinary organic substrates in stead of the ALIVH substrate. We had manufactured CCD camera module using the MCM-Ls. three LSI chips had best mounted on the six-layered ALIVH substrate obtained MCM-Ls realized down-sizing (60% down) and light-weighting (30% light) comparing with the conventional module. And the electrical characteristics of newly manufactured CCD camera module were equal to the conventional module.

关键词： MCM (multi-chip-module) SBB technique conductive adhesive ALIVH substrate CCD camera module

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Proceedings of the 1997 ieee multi-chip module conference

Proceedings of the 1997 IEEE Multi-Chip Module Conference

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Proceedings of the 1997 ieee multi-chip module conference

The proceedings contains 27 papers. Topics discussed include flip chip packaging, multichip module technology, computer aided design of printed circuits, interconnect analysis and simulation, multichip module testing ... 详细信息

关键词： multichip modules

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High performance photo-sensitive insulating materials for MCM-L 7

High performance photo-sensitive insulating materials for MC...

引用

1998 International conference on multichip modules and High Density Packaging (MCM 98)

作者： Akahoshi, H Kawamoto, M Suwa, T Miyazaki, M Fukai, H Hitachi Ltd Hitachi Res Lab Hitachi Ibaraki 31912 Japan

ISBN: (纸本)0780348508

The sequential build-up process, with photo-sensitive dielectric, is a most significant candidate for achieving high density multi-layer wiring substrates for low cost multi-chip modules. High performance dielectric material is essential for obtaining high reliability on the wiring substrate. Two types of photo-imageable dielectric have been developed;an aqueous alkaline developable type and a semi-aqueous developable type. The results of the performance evaluation of the dielectric materials and sequential build-up wiring substrates are described here. Both dielectric types deliver high resolution in fabricating photo-formed micro-via holes. The maximum aspect ratio of the micro-via has reached 1.0 for both materials. The aqueous developable type photo-dielectric showed excellent electrical and mechanical properties for surface mount wiring boards with a panel electroplate subtractive process. The semi-aqueous type high performance photo-dielectric, designed for MCM-L, showed outstanding mechanical properties especially in a high temperature region. Excellent insulating properties and adhesion were proven even after PCT conditions. Sufficient adhesion for full-build electroless copper metalization was also achieved. These features offer a great advantage in achieving higher interconnect reliability in direct chip attachment on low cost mullet-chip modules using sequential build-up substrates.

关键词： sequential build-up micro-via photo-dielectric multi chip module printed wiring board (PWB) flip chip attach

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Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects 48

Electromagnetic analysis of high-density multi-chip module s...

引用

48th Electronic Components & Technology conference

作者： Beker, B Yee, I Miracky, R Univ S Carolina Dept Elect & Comp Engn Columbia SC 29208 USA

ISBN: (纸本)0780345266

This paper describes the modeling approach and numerical results of MCM transmission lines formed by periodic interwoven metallization patterns. The characteristic impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmission lines are pointed out and ample data are provided for the "weaved" line as a function of several geometrical parameters.

关键词： multichip modules

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Microwave multichip modules using low cost microwave chip on flex packaging technology 7

Microwave multichip modules using low cost microwave chip on...

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1998 International conference on multichip modules and High Density Packaging (MCM 98)

作者： McNulty, M Schnell, J Nixon, D Lockheed Martin Govt Elect Syst Moorestown NJ 08057 USA

ISBN: (纸本)0780348508

Microwave chip on Flex (MCOF) is an innovative, low cost extension of Lockheed Martin's chip's first High Density Interconnect (HDI) technology. In MCOF technology, die are attached face down on an adhesive backed pre-patterned polyimide dielectric and then overmolded with an epoxy encapsulant. Laser drilled vias followed by multi-layer thin film metallization complete the circuit. Significant cost and weight advantages are attained by replacing traditional module substrates with an epoxy encapsulant. Transmit/Receive (T/R) modules, thousands of which may be used in a solid state phased array radar application, are particularly good candidates for this technology. This paper describes the use of MCOF technology to package T/R modules for solid state radar applications. An overview of the MCOF process is first presented, followed by a review of the design and fabrication considerations for MCOF multichip modules. Specific attention is focused on the unique packaging and electrical performance requirements of T/R modules and how these objectives are met by MCOF technology. Finally reliability considerations for use in military applications are discussed. Potential MCOF failure mechanisms and the MCOF reliability plan will be presented.

关键词： multichip module packaging high density interconnect plastic flex microwave

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A probe routing algorithm for MCM substrate test 7

A probe routing algorithm for MCM substrate test

引用

1998 International conference on multichip modules and High Density Packaging (MCM 98)

作者： Yan, RC Kim, BC Tufts Univ Dept Elect Engn Medford MA 02155 USA

ISBN: (纸本)0780348508

In this paper we describe a novel heuristic algorithm based on the single-ended probe. We present a heuristic algorithm to reduce the single-ended probe travel time in MCM substrate testing. Our algorithm has been successfully implemented and compared with previous results. The results show that significant improvements are achieved using the new heuristic algorithm.

关键词： multi-chip module substrate test probe interconnect netlist

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Investigations on some KGD approaches for space applications 7

Investigations on some KGD approaches for space applications

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1998 International conference on multichip modules and High Density Packaging (MCM 98)

作者： Massenat, MR Boetti, A Billot, M MMSF Matra Marconi Space France F-78146 Velizy Villacoublay France

ISBN: (纸本)0780348508

The gradual shift from Low and Medium Complexity Hybrids used for Space applications up to now, to High Complexity multi-chip modules that will be needed in the near future has directed the attention of ESA and CNES toward the very important need of using Known Good Dies in MCM manufactured for Space Applications A Study Contract has therefor been funded jointly by the two Space Agencies with Matra Marconi Space (France) to address this matter and carry out practical testing to highlight possible approaches to KGD having regard to particular Space concerns and requirements. This paper describes the "old" approach of chip Lot Acceptance (LAT) and compares it with two anew,, KGD methods, namely the utilization of Membrane Test Sockets that allows full temperature testing and bum-in and the application of "chip re-routing" on the top surface of the chip with "temporary mounting" for testing and burn-in. A practical test plan on a test vehicle made of non-KGD chips coming from the same wafer has been carried out in two major steps: firstly performing a full KGD flow on each die, secondly testing them before and after aging according to space requirements. The results of these different methods demonstrate their efficiency, verify that no disturbing effects or damage on the dies are induced by the KGD processes themselves, and provide also means of carrying out a cost comparison. Furthermore they will give guidelines for the possible updating of ESA specifications in this.

关键词： multi-chip module known good die space application membrane testing temporary mounting

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