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Proceedings of the 1998 ieee 45th International Solid-State Circuits conference, ISSCC

作者： Koyanagi, Mitsumasa Matsumoto, Takuji Shimatani, Tamio Hirano, Keiichi Kurino, Hiroyuki Aibara, Reiji Kuwana, Yasuhiro Kuroishi, Norihiko Kawata, Tetsuro Miyakawa, Nobuaki Tohoku Univ Sendai Japan

A special-purpose parallel processor system is presented, with high performance and compact machine size for Monte Carlo simulation. The configuration of this system is described where optical waveguides are used as data buses on the multichip modules (MCM) substrates and free-space optical interconnections are used between the MCM substrates. The improvement of overall performance with increasing the number of slave processors is evaluated by the computer simulation.

关键词： Parallel processing systems

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Replaceable chip module (RCM™) 7

Replaceable chip module (RCM™)

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7th International conference and Exhibition on multichip modules and High Density Packaging, MM-HDP 1998

作者： Rathburn, J. Gryphics Inc. 279 N. Medina St. LorettoMN55357-0337 United States

ISBN: (纸本)0780348508

Gryphics, Inc. is developing a means of incorporating ICs into a very low cost replaceable chip module (RCM). This high density module accepts a wide variety of devices in many applications. Each device is interconnected by a very low inductance multi-mode compliance contact system, which is solderless and demateable. The loaded RCM can be used as a characterization, test, burn-in, and production system use interface, where all ICs or passive components remain unhandled, and in an actual use configuration. No additional test, burn-in or production socketing is required, with any faulty components removed and replaced without need for rework. Thermal management is also incorporated as required. A wide variety of configurations and interface formats are being developed, with applications including MCMs, memory modules, PCMCIA modules, connectors with integrated semiconductors, microprocessor/memory modules, sockets and interfaces, production level connectors, and multidirectional interconnects among others. The RCMs are low profile, high density packaged assemblies that can accept a mixture of typical packaged devices, discrete/passive devices, chip scale/flip chip devices, or bare die in some cases. Costly or low yield semiconductor devices are interconnected in a removable fashion via an organic, ceramic, or flex substrate without the temperatures required for solder flow. Simple removal and replacement of failed devices allows for great flexibility, upgrade options, and a reduction in the significance of known good die, with correlation between test and as-used performance. © 1998 ieee.

关键词： Substrates

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Proceedings 1997 ieee multi-chip module conference

Proceedings 1997 IEEE Multi-Chip Module Conference

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ieee conference on multi-chip module

Presents the title page of the proceedings record.

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multi-chip module with optical interconnection for parallel processor system

Multi-chip module with optical interconnection for parallel ...

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ieee International conference on Solid-State Circuits (ISSCC)

作者： M. Koyanagi T. Matsumoto T. Shimatani K. Hirano H. Kurino R. Aibara Y. Kuwana N. Kuroishi T. Kawata N. Miyakawa University of Tohoku Sendai Japan Information Processing Center Hiroshima University Hiroshima Japan Tsukuba Research Lab Hitachi Chemical Company Limited Ibaraki Japan Advanced Technology Engineering Center Fuji Xerox Company Limited Kanagawa Japan

The parallel-processor system dramatically reduces the computational time in scientific computation, specifically in Monte Carlo simulation. However, the general-purpose parallel processor system is usually large and is expensive. A special-purpose parallel processor system is presented, with high performance and compact machine size for Monte Carlo simulation. High-speed optical-interconnections are used as the data buses to achieve this high performance.

关键词： Optical interconnections Optical waveguides Polyimides High speed optical techniques Master-slave Waveguide transitions Concurrent computing Data buses Poisson equations CMOS technology

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Superconductive multi-chip module process for high speed digital applications

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ieee TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY 1997年第2期7卷 2627-2630页

作者： Abelson, LA Elmadjian, RN Kerber, GL Smith, AD Space & Electron. Group TRW Inc. Redondo Beach CA USA

We report on the development of a superconducting multi-chip module (MCM) process for high speed digital packaging applications, which allows superconducting microstrip connections of superconducting chips with impedances up to 50 Omega. The MCM process uses a low temperature polymer, benzocyclobutene (BCB) dielectric, which has excellent planarization properties (>90%). The six mask MCM process uses three Nb wire layers, two BCB layers, and Ti/Pd/Au for the pad metallization. To maximize yield of 32 mm square MCM die, we optimized Nb deposition and BCB curing parameters to minimize stress-induced failures and reduce defect density. Current-carrying capabilities of signal lines and vias (5 mu m minimum design rule) are in excess of 20 mA/mu m line width. We discuss successful packaging of superconducting chips, demonstrating error-free operation up to 5 Gbit/s, and other process improvements, such as the use of NbN wiring for 10 K operation.

关键词： 10 K 5 Gbit/s 5 micron benzocyclobutene curing parameters current-carrying capabilities defect density Dielectrics error-free operation high speed digital packaging applications Impedance impedance matching integrated circuit packaging integrated circuit yield low temperature polymer Microstrip microstrip lines minimum design rule multichip modules Niobium Packaging pad metallization planarization properties Polymers signal lines stress-induced failures Superconducting epitaxial layers Superconducting filaments and wires superconducting integrated circuits superconducting microstrip connections superconductive multi-chip module process Superconductivity Temperature yield

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Microwave multi-chip module utilizing aluminum silicon carbide with in-situ cast components and high density interconnect technology

Microwave multi-chip module utilizing aluminum silicon carbi...

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1997 International conference on multichip modules

作者： Dufour, B McNulty, M Miller, S Lockheed Martin Government Electronic Systems Moorestown United States

ISBN: (纸本)0780337875

multi-chip module (MCM) designs of today place ever increasing demands upon packaging technologies. With increasing functionality and power levels being compressed into smaller packages, the packaging density and thermal performance of the module substrate has to keep pace. Further the unit cost of these substrates has increased along with performance demands. The packaging approach discussed in this paper eliminates traditional substrates entirely by leveraging the multi-layer routing capability of Lockheed Martin High Density Interconnect (HDI) Technology. Bare die are inserted directly into a CTE-matched Aluminum Silicon Carbide (Al/SiC) housing with in-situ cast feedthrus and seal ring. Die interconnect and routing are completed entirely in the HDI overlay. This paper describes a high power microwave module designed and fabricated using Al/SiC-based HDI technology Design and fabrication issues for this packaging technology are presented and comparisons to other packaging technologies are discussed.

关键词： multi-chip module packaging high density interconnect aluminum silicon carbide microwave

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How to better know what happens inside a power multi chip module

How to better know what happens inside a power multi chip mo...

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28th Annual ieee Power Electronics Specialists conference, PESC 1997

作者： Clavel, Edith Roudet, James Schanen, Jean-Luc Lab d'Electrotechnique de Grenoble Saint-Martin d'Heres France

In this paper, the way to provide an electrical equivalent scheme for any Power multi chip module (PMCM) is presented. Considering the geometrical description of the PMCM, an electrical R, L, M circuit is automatically generated using a special software, InCa. This circuit can be used either directly in a PSPICE simulation, or to analyze technical parameters like switching cell inductance, interaction between power and drive circuit or current unbalance in the PMCM.

关键词： Power electronics

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8-bit 2.5 gigasample A/D converter multichip module for all-digital radar receiver for AN/APS 145 radar on navy E2-C airborne early warning aircraft

8-bit 2.5 gigasample A/D converter multichip module for all-...

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Proceedings of the 1997 ieee multi-chip module conference

作者： Thompson, Rick L. Degerstrom, Michael J. Walters, Wayne L. Vickberg, Mark E. Riemer, Paul J. Amundsen, Eric L.H. Gilbert, Barry K. Mayo Foundation Rochester United States

This paper will discuss multichip module (MCM) technology as it is applied to a prototype high performance direct digitizing channelized radar receiver system under development for the Navy's E2-C Airborne Early Warning Aircraft, which encompasses both analog signals at UHF frequencies and multi-gigahertz digital signals. Critical issues which arise in the design of such a system will be discussed, including thermal management, transmission line, voltage standing wave ratio, and simultaneous switching noise analyses. This paper will also describe the various simulation and analysis software tools employed in the development of the MCM containing the analog-to-digital converter (A/D converter) and demultiplexer for this system, and the roles of these tools in providing insight into the design of the MCM.

关键词： multichip modules

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Adaptive wide-area design process manager for collaborative multichip module design

Adaptive wide-area design process manager for collaborative ...

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Proceedings of the 1997 ieee multi-chip module conference

作者： Madni, Azad M. Madni, Carla C. Intelligent Systems Technology Inc

multichip module (MCM) design is a complex process that requires multiple tradeoffs and design iterations. It involves multiple core competencies that seldom reside in a single organization or geographical site. It typically requires multiple design tools that come from different vendors. Design process management in such an environment is key to infusing discipline as well as reducing design cycle time. This paper presents an innovative CORBA 2.0-compliant Internet/WWW-based wide-area design process management approach that is based on dynamically constructed 'flows'. At the heart of the design process manager is an object-oriented meta-model of the design process. This model captures and inter-relates all key design objects that are required to manage and improve the MCM design process. A key aspect of the design process manager is its multi-perspective visualization capability that allows both managers and designers to view the MCM design process from their respective perspectives.

关键词： multichip modules

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Statistical Process Control applied to automated dispense of silver filled epoxy for Commercial Millimeter Wave multi chip module

Statistical Process Control applied to automated dispense of...

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1997 International conference on multichip modules

作者： Spinazzola, R M/A-COM an AMP Co Lowell United States

ISBN: (纸本)0780337875

This paper presents the results of continuous improvement from: Designed Experiments, Viscosity measurements, Statistical Process Control documented operating procedures, and operator training & certification;on the automated epoxy dispense process. This capability enables the company;M/A-COM;to produce the first volume low cost 28 Ghz Commercial Millimeter Wave multi chip module Receiver. The Millimeter Wave multi chip module Receiver uses GaAs Phempts measuring 12 by 10 mil length and width by 5 mil thick. This small discrete device required the development of a process for a ten mil diameter silver paste epoxy dot. repeatable, in production, and in volume. Statistically Designed Experiments were used to identify and set the most important process parameters. Viscosity measurements were made which characterized the silver filled epoxy paste. The ASTM methods for measuring viscosity of adhesives adhesives were modified to identify the material's sensitivity to shear. A unique Statistical Process Control method was implemented to establish process control over a material which has proven to change flow behavior during processing through an auger type positive displacement pump. The key to the success of this project has been the properly train operators.

关键词： DOE SPC epoxy dispense viscosity

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