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ieee SOUTHEASTCON 96 conference on Bringing Together Education, Science and Technology

作者： Kolbehdari, MA Sadiku, MNO TEMPLE UNIV DEPT ELECT ENGNPHILADELPHIAPA 19120

ISBN: (纸本)0780330897

In this paper, a new comprehensive electromagnetic modeling tool, the networking distributed transmission line parameters, R(ω), L(ω), C(ω), and G(ω), is developed. The modal characteristic impedances, network functions, and multiconductor transmission lines stamp of pulse propagation in interconnects are derived. For signals with sub-nanosecond rise times, the interconnects always be-have as transmission lines. multichip module MCM's are the emerging technology for an advanced electronic packaging. This technology has the advantages of smaller size, lighter systems, and improved performance. The interconnect circuit parameters vary with frequency has developed based on finite element method. In this approach, two- or three-dimensional finite element is used to solve the fields in terms of the magnetic vector potential and scalar potential. The loss analysis has taken into account the skin effect, proximity effect, and lossy dielectric material of the problem. The accuracy of the method is studied by comparison with available data in the literature.

关键词： Interconnection networks

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Proceedings of the 1995 ieee multi-chip module conference

Proceedings of the 1995 IEEE Multi-Chip Module Conference

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Proceedings of the 1995 ieee multi-chip module conference

The proceedings contains 37 papers. Topics discussed include multichip modules, silicon on insulator technology, application specific integrated circuits, electric network parameters, electromagnetic wave scattering, ... 详细信息

关键词： multichip modules

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Mixed signal digital sub-band tuner multichip module

Mixed signal digital sub-band tuner multichip module

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ieee conference on multi-chip module

作者： K. Sienski C. Field C. Schreiner M. Chivers Garland Division E-Systems Garland TX USA

Mixed signal designs consisting of analog and digital components bridge the gap between the sensor and data processor in a broad range of systems. As digital MCM technology matures, it becomes feasible to consider incorporating more of a system on a single substrate. In many cases, the opportunity for expansion lies in the analog and digital conversion circuitry. This paper describes the development of a mixed signal module that integrates an A/D converter and digital sub-band tuner in a single MCM. Physical isolation structures are developed to shield the analog signals from electromagnetic noise generated by the digital circuitry. A laser customized rapid prototyping technique is used to implement the design on an MCM-D substrate.

关键词： Tuners multichip modules Signal design Bridge circuits Sensor systems Electromagnetic shielding Circuit noise Electromagnetic interference Noise generators Signal generators

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A multichip module solution for high performance ATM switching

A multichip module solution for high performance ATM switchi...

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ieee conference on multi-chip module

作者： L. Licciardi M. Peretti L. Pilati J.J. Ichai F. Martin Y. Urena CSELT Torino Italy IBM Montpellier Technologies Montpellier France

the high industrial importance that ATM (asynchronous transfer mode) is assuming in the telecommunication environment strongly drives technology improvements. A MCM-C 16/spl times/16 Switching Element (MCM-BASE16) for the industrial ATM cross connect UTXC is presented; implementation details are described regarding both the substate characteristics and the new IBM CCGA (ceramic column grid array) packaging technique. Electrical and thermal analysis results are reported and finally the testing methodology is presented both at the substrate and at the module level. The MCM-BASEI6 has a global throughput of 5 Gbit/s, works at 77.8 MHz and dissipates approximately 10 W at the operating frequency; these results confirm the effectiveness of this new packaging technique in obtaining high speed and area performance.

关键词： multichip modules Asynchronous transfer mode Microprocessors Switches Telecommunication switching Circuit testing Clocks Frequency Integrated circuit packaging Communication industry

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A multichip module, the basic building block for large area pixel detectors

A multichip module, the basic building block for large area ...

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ieee conference on multi-chip module

作者： K.-H. Becks E.H.M. Heijne P. Middelkamp L. Scharfetter W. Snoeys University of Wuppertal Germany CERN Geneva Switzerland

In order to build large array pixel detectors for future experiments in High Energy Physics e.g. for experiments at the Large Hadron Collider (LHC) at CERN, one needs to construct easy to handle and manufacturable able modules which can be used to put together to big detector systems. Diode- (pixel-) arrays can be fabricated in wafer size dimensions (currently about 8 cm in length); read our chips have dimensions of about 1 cm/sup 2/. A natural (but not trivial) thing would be to use the silicon diode array as the basic building block for a detector system. Several read out chips have to be bonded onto this module. For easy module interconnections the data lines, control lines, and power distributions have to be connected to the periphery of the module. To avoid complicated wiring, all lines should be integrated onto the detector substrate. Such a module could be made using multichip module (MCM) technology. Some electrical considerations of such a module and possible realizations are discussed.

关键词： multichip modules Detectors Sensor arrays Large Hadron Collider Diodes Manufacturing Silicon Bonding Power system interconnection Power distribution

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A functional module comparison of the interconnected mesh power system (IMPS) with a standard four-layer MCM topology

A functional module comparison of the interconnected mesh po...

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ieee conference on multi-chip module

作者： R.D. Glover L.W. Schaper High Density Electronics Center Fayetteville AR USA

The Interconnected Mesh Power System (IMPS) has been developed to reduce a conventional four-layer MCM-D structure to only a two-layer structure. IMPS uses interconnected, meshed power and ground planes to replace the solid power and ground planes found in a standard four-layer topology. A prototype of each topology has been produced using the M040 MCM design as a test vehicle, which consists of a Motorola MC68040 microprocessor and four IDT 7006 dual-port SRAMs. This paper will present results of the comparison between the standard four-layer and IMPS versions of the MO40 MCM. Results are based on tests performed on the MCMs, which include a functionality test of both the processor and memory as well as electrical measurements on each version of the M040 MCM. These tests indicate comparable performance between the four layer substrate and the IMPS substrate costing half as much.

关键词： Power system interconnection Testing Topology Solids Prototypes Vehicles Microprocessors Performance evaluation Electric variables measurement Costing

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Flexible access to MCM technology via the multichip module designers' access service (MIDAS)

Flexible access to MCM technology via the multichip module d...

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ieee conference on multi-chip module

作者： J. Peltier W. Hansford The MIDAS Service Information Sciences Institute Marina del Rey CA USA

The MCM Designers' Access Service (MIDAS) allows designers to obtain prototype and small quantities of MCMs. The service currently maintains relationships with several MCM-D foundries, including: nchip in San Jose, CA; Micromodule Systems (MMS) in Cupertino, CA; and IBM Microelectrons in Hopewell Junction, NY. MIDAS provides a low-cost service achieved through a multi-project environment where the customers share tooling and substrate manufacturing costs. The service offers design support, distributes foundry design kits, groups the projects onto regularly scheduled runs, places orders, and supplies fully assembled modules. As well, MIDAS offers a limited selection of open-tooled, second-level packages, bare tested die (KGD), and test sockets. MIDAS functions as a technology enabler by supplying the designer with an interface "transparent" to the fabricator and common to multiple vendors. Foundries prefer to work with a single source who coordinates the details of user interactions. Thus, they avoid dealing with multiple customers and spare valuable overhead. The service operates on an on-going basis and has delivered modules to customers from each foundry. Commercial, military and educational/research institutions utilize the service. This paper discusses the background and current status of MIDAS. Additionally, plans for accessing mixed signal MCM technologies and flip chip bumping and assembly are reviewed.

关键词： multichip modules Foundries Assembly Testing Prototypes Manufacturing Costs Job shop scheduling Packaging Sockets

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Non-hermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5 Pb/Sn solder joints of flip-chip bonded multi-chip module high voltage devices

Proceedings - Electronic Components and Technology Conferenc...

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Proceedings - Electronic Components and Technology conference 1996年 347-353页

作者： Wong, C.P. Segelken, J.M. Tai, K.L. Wong, C.C. Georgia Inst of Technology Atlanta United States

AT&T's No. 5 Electronic Switching System (ESS) is the state-of-the-art electronic switch that uses the solid-state gated-diode-crosspoint (GDX) for fast switching of telephone calls. These GDX's operate at 375 volts and require exceptional protection and reliability performance of these packages. Ceramic hermetic packages were used for these type of devices. In order to cost reduce these GDX's, a new type of flip-chip bonded structure with 95/5 Pb/Sn solder joints GDX's was developed. These flip-chip GDXs' were surface-mounted on a conventional ceramic substrate. An thixotropic silicone gel was used as an underfill and overfill glob-coating to provide the ultra-high reliability performance of these high voltage devices and a silicone elastomer was used to pot the hybrid surface-mounted GDX multi-chip module structure to further enhance the robustness of its structure. In this paper, the materials such as the flip-chip solder (95/5 Pb/Sn), silicone gel, and elastomer, and their processes such as flip-chip bumping, reflow, cleaning, encapsulation and reliability testing are described for this robust, high performance and low-cost packages.

关键词： Electronics packaging

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Proceedings of 1995 ieee multi-chip module conference (MCMC-95)

Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-...

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ieee conference on multi-chip module

Presents the front cover of the proceedings record.

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Field programmable multi-chip module (FPMCM) - an integration of FPGA and MCM technology

Field programmable multi-chip module (FPMCM) - an integratio...

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Proceedings of the 1995 ieee multi-chip module conference

作者： Darnauer, Joel Isshiki, Tsuyoshi Garay, Porfirio Ramirez, John Maheshwari, Vijayshri Dai, Wayne Wei-Ming UC Santa Cruz Santa Cruz United States

multichip module technology can be used to dramatically increase the capability and performance of field programmable gate arrays (FPGAs) and the field programmable systems (FPS) that they are a part of. After an analysis of the key advantages that MCM technology has for FPGAs, we present the design of our first-generation silicon-on-silicon field programmable multi-chip module (FPMCM), analyze its limitations, and present some lessons learned in the development process. We conclude with a comparison of MCM-C and MCM-D technology for this application and suggest that the case for MCM-D for FPMCMs is most compelling when MCM-D is considered as a doorway to active substrate and chip-on-chip technologies.

关键词： multichip modules

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