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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

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Electrical and thermal study of membrane multi-chip module systems

Electrical and thermal study of membrane multi-chip module s...

引用

ieee conference on multi-chip module

作者： Wheling Cheng S.S. Wong Center for Integrated Systems University of Stanford Stanford CA USA

Membrane multi-chip modules (MCMs) have been fabricated to investigate both the electrical design and thermal management of advanced MCM systems. Custom bipolar interface circuits have been interconnected to CMOS VLSI chips, achieving a chip-to-chip delay of 5.6 nsec compared with 7.9 nsec for wire bonded system. Integrated decoupling capacitors and bipolar transistors were utilized to reduce power supply noise across chips by a factor of 3.2. To further decrease the thermal resistance of the systems, water has been used to provide extra heat removal paths. The thermal resistance of the systems has been decreased from 25/spl deg/C/W to 17/spl deg/C/W with the sealed water.

关键词： Biomembranes Thermal resistance Thermal management Power system management Integrated circuit interconnections Power system interconnection Very large scale integration Delay Wire Bonding

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Design considerations for implementing a modularly configured attached processor in a multi chip module

Design considerations for implementing a modularly configure...

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ieee conference on multi-chip module

作者： J.S. Singh B.W. Gremel V.P. Singh G.A. Gibson Electrical and Computer Engineering Department University of Texas El Paso El Paso TX USA

Implementation of a novel modularly configured attached processor (MCAP) architecture was evaluated using 1 /spl mu/m CMOS logic on an MCM-D The transistor count was approximately ten million transistors, distributed on twenty-five chip dice. Delay, area, and power calculations were performed using the SUSPENS model. Rent's rule was found to be not applicable. Speed was calculated to be in the 100 MHz range. The module foot print was found to be 90 cm/sup 2/. Power dissipation per unit area was low enough to allow air cooling.

关键词： CMOS technology CMOS process CMOS logic circuits Computer architecture Delay Semiconductor device modeling Foot Power dissipation Cooling Power system management

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Experimental characterization of simultaneous switching noise for multichip module

Experimental characterization of simultaneous switching nois...

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ieee conference on multi-chip module

作者： K. Ito K. Kato N. Hirano T. Sudo Semiconductor Device Engineering Laboratory Toshiba Corporation Kawasaki Japan

CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.

关键词： multichip modules Semiconductor device noise Semiconductor device measurement Packaging Circuit testing Noise generators Vehicles Dielectric substrates Noise measurement Ceramics

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The design and implementation of NASA's advanced flight computing module

The design and implementation of NASA's advanced flight comp...

引用

ieee conference on multi-chip module

作者： L. Alkalaj B. Jarvis JPL Caltech USA NCHIP Inc. USA

This paper describes the first MCM module of the AFC program which implements the functionality of a 32-bit RISC radiation hardened space flight computer. This module was designed jointly by engineers at JPL and TRW using a collaborative partnership agreement. The MCM was fabbed at nchip Corporation. The AFC program also plans to design, develop, and fab two more MCM modules: the Mass Memory MCM, and Programmable I/O MCM. These three MCMs will then be stacked as part of a scalable (stackable) core avionics architecture. The flight computer MCM described in this pager contains 33 die in a single 2 by 4 inch AlN package from Coors, with a total of 442 pins. The MCM uses nchip's die stack approach for both SRAM and EEPROM.

关键词： Automatic frequency control Aerospace electronics Reduced instruction set computing Radiation hardening Aerospace engineering Design engineering Collaboration Computer architecture Packaging Pins

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Proceedings of the 1994 ieee multi-chip module conference

Proceedings of the 1994 IEEE Multi-Chip Module Conference

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Proceedings of the ieee multi-chip module conference

ISBN: (纸本)0818655623

The conference materials contain 29 papers. The topics covered include multichip module (MCM) infrastructure in Japan and the United states;ARPA MCM foundry status and future directions;MCM applications;test methodologies for MCMs;MCM design issues;novel MCM technologies;known good die technology;electrical modeling, simulation, and design;and partitioning strategies.

关键词： Microprocessor chips

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An MCM-D memory module in an overmolded plastic package

An MCM-D memory module in an overmolded plastic package

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ieee conference on multi-chip module

作者： A. Bet-Shliemoun Nien-Tsu Shen D. Malladi D. Towne A. Tam MicroModule Systems Cupertino CA USA Sun Microsystems Mountain View CA USA

In this paper, a PQFP package design which holds a thin film MCM with four memory dice is described. The substrate design is briefly mentioned. We describe the strategy to integrate the MCM-D Al substrate into an existing standard package (i.e. 160 lead PQFP) with minimum cost to meet manufacturability and reliability requirements. This was achieved through minimal modifications to existing assembly processes, fixtures, and materials. Also discussed is material selection to meet the reliability stress tests goals with respect to thin film MCM corrosion and stress relief on high aspect ratio die sizes. Choice of molding compound, die attach and stress relief coatings and their impact on reliability are discussed. The proper selection of materials can eliminate a few assembly steps. The reliability qualification requirements and the qualification test results are also presented.

关键词： Plastic packaging Stress Substrates Assembly Qualifications Plastic films Costs Manufacturing Fixtures Materials reliability

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Development of a conception methodology for power multi rectifier chips module

Development of a conception methodology for power multi rect...

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conference Record of the ieee Industry Applications Society Annual Meeting (IAS)

作者： S. Rael D. Bailivet C. Schaeffer Laboratoire d'Electrotechnique de Grenoble Unité de recherche associée au CNRS 355 Saint Martin d'Heres France Lab. d'Electrotech. de Grenoble CNRS St. Martin d'Heres France

Many industrial applications require a higher power to volume ratio. Manufacturers have achieved switch functions composed of semiconductor chips connected in parallel within power modules. Therefore, we have developed a 3D electrothermal simulation tool which solves the heat conduction equation in stationary condition, and the electrical linear system of the parallel connection which takes into account the thermal behaviour of each chip. Thus, we are able to study some electrical and thermal imbalances of the power multi-chips module, and to contribute to a safe and reliable concept. This paper deals with the case of rectifier modules.

关键词： Rectifiers Manufacturing industries Semiconductor device manufacture Power semiconductor switches multichip modules Electrothermal effects Resistance heating Equations Linear systems Thermal conductivity

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Proceedings of ieee multi-chip module conference (MCMC-94)

Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)

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ieee conference on multi-chip module

Presents the front cover of the proceedings record.

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ADVANCED TAB BGA multichip STACKED module FOR HIGH-DENSITY LSI PACKAGES

ADVANCED TAB BGA MULTICHIP STACKED MODULE FOR HIGH-DENSITY L...

引用

1994 ieee multi-chip module conference (MCMC-94)

作者： MITA, M KUMAKURA, T INOUE, S HIRAKI, Y HITACHI CABLE LTD DEPT ELECTRON MAT ENGNDENSEN WORKSHITACHIJAPAN

ISBN: (纸本)0818655607

A newly advanced design of TAB/BGA multi-chip stacked module has been developed for high density LSI packages. Configuration of this module is designed to reduce package body size and to lighten the weight. Electrical and thermal performance of this module was carefully considered and estimated by simulation or experiments. This module is named as COCB module which means the chip On chip Ball Grid Array module. 2 chips are mounted on both top and bottom sides of small substrate by TAB technology using new Au-Sn (Au10-40% - Sn) eutectic micro-connection method. 2 chips are electrically connected by routing wires and through hole of interposed substrate respectively. This module is useful when packages are mounted on a board with solder paste, directly to its surface, with some discrete packages on assembly line. In this paper we proposed a new concept of micro bare chip module.

关键词： Electronics packaging

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EXPERIMENTAL CHARACTERIZATION OF SIMULTANEOUS SWITCHING NOISE FOR multichip module

EXPERIMENTAL CHARACTERIZATION OF SIMULTANEOUS SWITCHING NOIS...

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1995 ieee multi-chip module conference

作者： ITO, K KATO, K HIRANO, N SUDO, T TOSHIBA CO LTD SEMICOND DEVICE ENGN LABSAIWAI KUKAWASAKI 210JAPAN

ISBN: (纸本)0818669705

关键词： multichip modules

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