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检索条件"任意字段=IEEE Conference on Multi-Chip Module"

共 540 条记录，以下是471-480 订阅

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Field-programmable multi-chip module (FPMCM) for high-performance DSP accelerator

Field-programmable multi-chip module (FPMCM) for high-perfor...

引用

Proceedings of the 1994 ieee Asia-Pacific conference on Circuits and Systems

作者： Isshiki, Tsuyoshi Dai, Wayne Wei-Ming Univ of California Santa Cruz United States

Field Programmable multi-chip module (FPMC-I) integrates multiple FPGA chips by multi-chip module (MCM) technology, thereby significantly increasing the logic capacity, reducing power consumption and speeding up the chip-to-chip communication. Bit-serial datapath circuit designs and their advantages over bit-parallel circuits on FPGA implementation are described. Some circuit layout examples of 2D FIR filter and IDCT circuits in terms of logic resource utilization, routability, 10 pin utilization and performance are presented.

关键词： multichip modules

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multi-chip module implementation of a neural network

Multi-chip module implementation of a neural network

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Proceedings of the ieee multi-chip module conference

作者： Stout, Matthew G. Salmon, Linton G. Rudolph, George L. Martinez, Tony R. Brigham Young Univ Provo United States

ISBN: (纸本)0818655623

The requirement for dense interconnect in artificial neural network systems has led researchers to seek high-density interconnect technologies. This paper reports an implementation using multi-chip modules (MCMs) as the interconnect medium. The specific system described is a self-organizing, parallel, and dynamic learning model which requires a dense interconnect technology for effective implementation;this requirement is fulfilled by exploiting MCM technology. The ideas presented in this paper regarding an MCM implementation of artificial neural networks are versatile and can be adapted to apply to other neural network and connectionist models.

关键词： Electronics packaging

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Clocking considerations for a PentiumTM-based CPU module with 512 K byte secondary cache

Clocking considerations for a PentiumTM-based CPU module wit...

引用

Proceedings of the ieee multi-chip module conference

作者： Reinschmidt, Robert M. Leuthold, Dale H. MicroModule Systems Cupertino United States

ISBN: (纸本)0818655623

A method of distributing clock to and on a PentiumTM-based CPU module was designed and produced. multiple clock driver outputs are connected in parallel and drive a PC board trace through a series termination resistor to the input of the module. On the module, the clock inputs to 20 dice are connected together and brought to a single PGA pin. The effect of varying termination resistance, PWB foil characteristic impedance, and foil length on the clock waveform characteristics including skew, edge rate, overshoot, and time of flight were determined.

关键词： Microprocessor chips

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Silicon-on-silicon multichip module technology with integrated bipolar components in the substrate

Silicon-on-silicon multichip module technology with integrat...

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Proceedings of the ieee multi-chip module conference

作者： Day, Ray-Long Hruska, Christopher D. Tai, King L. Frye, Robert C. Lau, Maureen Y. Sullivan, Paul A. AT&T Bell Lab Lee's Summit United States

ISBN: (纸本)0818655623

To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM.

关键词： Electronics packaging

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chip ON BOARD TECHNOLOGY FOR LOW-COST multi-chip-moduleS

CHIP ON BOARD TECHNOLOGY FOR LOW-COST MULTI-CHIP-MODULES

引用

International conference and Exhibition on multichip modules

作者： CLOT, P SARBACH, P STYBLO, D VALTRON INT SA CH-1343 CHARBONNIERESSWITZERLAND

ISBN: (纸本)0930815394

multi-chip-module on a laminated epoxy-glass substrate (MCM-L) meets the demand for a low cost miniaturized module when many functions with different technologies need to be integrated in a single standard package. The following paper presents two original MCM-L designs using chip On Board (COB) technology. Both are made on the same kind of modified multilayer glass epoxy ; one is equiped with J lead ouput pins allowing the mounting of dice on both faces, the second is very thin with dice mounted on the top face and bumps on the bottom face allowing direct soldering on the motherboard like other Surface Mount Device (SMD) components. These two kinds of MCM modules with Jedec standard dimensions are now pushed into production. Mounting procedure as well as qualification program and test approach are described. To ensure reliability of such MCMs it becomes important to know exactly the maximal stress and deformation induced by thermal or mechanical cycles during mounting procedure. The use of the Finite Element Method (FEM) for design optimization is explained. This method allows the calculation of deformation, stress and temperature distribution in the whole module during the development phase. The results of such simulation are presented here.

关键词： chip ON BOARD (COB) multi-chip-CARRIER-module (MC2M) SOLDERING SIMULATION FINITE ELEMENT METHOD (FEM)

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Placement and routing for a field programmable multi-chip module 94

Placement and routing for a field programmable multi-chip mo...

引用

31st Design Automation conference, DAC 1994

作者： Lan, Sanko Ziv, Avi El Gamal, Abbas Stanford Univ Stanford CA United States

ISBN: (纸本)9780897916530

Placement and routing heuristics for a Field Programmable multi-chip module (FPMCM) are presented. The placement is done in three phases;partitioning, chip assignment and iterative improvement. The routing is done in two phases;global routing followed by detailed routing. Detailed routing involves new channel routing problems denoted by Exact Segmented Channel Routing (ESCR) and K-ESCR. A very fast K-ESCR heuristic is described. Experimental results show that the placement heuristic achieves high gate utilization, and that the K-ESCR heuristic performs surprisingly well over wide range of channel sizes.

关键词： Computer aided logic design

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Active silicon substrate multi-chip module technology for sensor signal processing and control

Active silicon substrate multi-chip module technology for se...

引用

1994 International conference on multichip modules, MCM 1994

作者： Pearson, Richard E. Lockheed Missiles and Space Company Inc. 1111 Lockheed Way Bldg 157 SunnyvaleCA94089 United States

ISBN: (纸本)0930815394

A new approach to build multi-chip modules (MCMs) using active silicon substrate (ASIS) technology is being developed by Lockheed for future sensor signal processing and control applications. The ASIS MCM inherently offers a functional platform versus other approaches using a passive nonfunctional substrate. The Lockheed ASIS design uses benzocyclobutene (BCB) for a low dielectric and copper for interconnect over an active substrate. Support chips are attached to the interconnect over the substrate by solder bumps. This provides a versatile manufacturing concept for easy rework. Bare die testing and bum-in of support chips should eliminate most rework. The result is a dense, high performance, three-dimensional MCM of closely placed functional elements. Unique architectures are possible with optimized active substrates and support chips, but this approach also allows MCMs to be developed sooner with standard integrated circuits. Copyright © 1994 by ISHM - The Microelectronics Society and The International Electronics Packaging Society (IEPS). All rights reserved.

关键词： Substrates

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Applications and design techniques for MCMs

Applications and design techniques for MCMs

引用

ieee conference on multi-chip module

作者： E.E. Davidson IBM Corporation Poughkeepsie NY USA

The multi-chip module (MCM) has yet to make its mark in the high volume computer arena but this situation should change soon. High chip and module connection densities are the drivers that will ultimately make MCMs the choice for many applications. Of course, for this to happen, they will have to be cost competitive when compared to alternative approaches. This, too, will happen. As a result, the art of designing an MCM will become a desirable skill. Designing an MCM is the first step in determining whether your application should include an MCM. This paper shows how to do that.< >

关键词： Costs Application software Production Electronics industry Supercomputers Manufacturing Workstations ieee news Microprocessors Packaging

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Advanced TAB/BGA multi-chip stacked module for high density LSI packages

Advanced TAB/BGA multi-chip stacked module for high density ...

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ieee conference on multi-chip module

作者： M. Mita T. Kumakura S. Inoue Y. Hiraki Electronic Material Engineering Department Densen Works Hitachi Cable Limited Japan Package Technology & Development Intel Japan K.K Japan

A newly advanced design for a TAB/BGA multi-chip stacked module has been developed for high density LSI packages. The configuration of this module is designed to reduce package body size and to lighten the weight. Electrical and thermal performance of this module was carefully considered and estimated by simulation or experiments. This module is called a COCB module which means the chip On chip Ball Grid Array module. Two chips are mounted on both top and bottom sides of a small substrate by TAB technology using a new Au-Sn (Au10-40%-Sn) eutectic micro-connection method. Two chips are electrically connected by routing wires and through holes of an interposed substrate respectively. This module is useful when packages are mounted on a board with solder paste, directly to its surface, with some discrete packages on the assembly line. The authors propose the concept of the micro bare chip module.< >

关键词： Large scale integration Packaging Polyimides Copper Lead Substrates Soldering Resins Thermal conductivity Punching

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Clocking considerations for a Pentium-based CPU module with 512K byte secondary cache

Clocking considerations for a Pentium-based CPU module with ...

引用

ieee conference on multi-chip module

作者： R.M. Reinschmidt D.H. Leuthold MicroModule Systems Cupertino CA USA

A method of distributing clock to and on a Pentium-based CPU module was designed and produced. multiple clock driver outputs are connected in parallel and drive a PC board trace through a series termination resistor to the input of the module. On the module, the clock inputs to 20 dice are connected together and brought to a single PGA pin. The effect of varying termination resistance, PWB foil characteristic impedance, and foil length on the clock waveform characteristics including skew, edge rate, overshoot, and time of flight were determined.< >

关键词： Clocks Electronics packaging Impedance Control systems Resistors Microprocessors Cache memory SRAM chips Frequency Delay

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